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287 条记录 (耗时 0.012 秒)

    POLISHING OR GRINDING PAD ASSEMBLY
    7.
    发明公开
    POLISHING OR GRINDING PAD ASSEMBLY 审中-公开

    公开(公告)号：EP3702101A1

    公开(公告)日：2020-09-02

    申请号：EP20167198.9

    申请日：2016-09-23

    申请人： HUSQVARNA AB

    发明人： Tchakarov, Tchavdar V.

    IPC分类号： B24B7/18 ,  B24D13/14 ,  B24B7/22 ,  B24B41/047 ,  B24D7/06 ,  B24D7/08 ,  B24D11/00 ,  B24D18/00

    摘要： A floor polishing or grinding pad assembly (10) is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad (12), a reinforcement layer or ring (14; 114), and multiple floor-contacting disks (16; 16a; 16b; 16c; 116). In another aspect, the reinforcement layer includes a central hole (17) through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension (x) greater than a linear dimension (y) of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle ( α ) offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks (116) alternating between and/or offset from a larger set of the disks (16). In another aspect, the reinforcement layer includes a wavy or undulating internal edge (117) shape.

    SUBSTRATE POLISHING DEVICE AND POLISHING METHOD
    9.
    发明公开
    SUBSTRATE POLISHING DEVICE AND POLISHING METHOD 审中-公开

    公开(公告)号：EP3479958A1

    公开(公告)日：2019-05-08

    申请号：EP18204957.7

    申请日：2018-11-07

    申请人： Ebara Corporation

    发明人： NAKANISHI, Masayuki ,  KODERA, Kenji

    IPC分类号： B24B37/10 ,  B24B37/12 ,  B24B37/30 ,  B24B41/047 ,  B24B41/06 ,  B24B7/07 ,  B24B27/00 ,  B24B37/22

    摘要： One object of the present invention is to improve the uniformity of polishing in a substrate polishing device for polishing a quadrilateral-shaped substrate.
    The present application discloses, as one embodiment of the present invention, a substrate polishing device (100) for polishing a quadrilateral-shaped substrate (130), the substrate polishing device (100) including: a surface plate (110); a substrate support mechanism that is attached to the surface plate (110) and that supports the substrate (130); a polishing head mechanism (140) for attaching a polishing pad (150), the polishing head mechanism (140) opposing the surface plate (110); and an orbital drive mechanism (160) for orbitally driving the polishing head mechanism (140). The substrate support mechanism includes: a base plate (121); a plate flow passage (520A, 520C, 520E) provided to the base plate (121); and a plurality of substrate support chambers (510A, 510C, 510E) that are connected to the plate flow passage (520A, 520C, 520E), wherein each substrate support chamber (510A, 510C, 510E) independently applies a vertical direction force to the substrate (130), and the vertical direction force applied to the substrate (130) corresponds to an internal pressure of the substrate support chamber (510A, 510C, 510E).