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公开(公告)号:EP4400472A1
公开(公告)日:2024-07-17
申请号:EP22872901.8
申请日:2022-09-20
IPC分类号: C01B21/064 , C08K3/28 , C08K3/38
CPC分类号: C01B21/064 , C08K3/38 , C08K3/28
摘要: Provided is a hexagonal boron nitride powder for filler in which the elution amount of B is reduced even when the thickness of primary particles is increased and, as a result, high thermal conductivity is achieved. The hexagonal boron nitride powder for filler contains primary particles of hexagonal boron nitride and agglomerates of the primary particles, where the primary particles have an average equivalent circular diameter of 4 µm or more, the primary particles have an average thickness of 0.5 µm or more, the ratio of the average equivalent circular diameter to the average thickness is 1 or more and 10 or less, the average particle size is 5 µm or more and 100 µm or less, the bulk density is 0.5 g/cm3 or more and less than 1.0 g/cm3, and the elution amount of B is 60 ppm or less.
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公开(公告)号:EP3617137B1
公开(公告)日:2023-08-09
申请号:EP19197413.8
申请日:2018-02-07
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公开(公告)号:EP3718965B1
公开(公告)日:2023-06-07
申请号:EP20172924.1
申请日:2015-06-24
IPC分类号: C01B21/064 , C04B35/622 , B01J19/08 , C04B35/583 , B82Y40/00
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公开(公告)号:EP4129897A1
公开(公告)日:2023-02-08
申请号:EP21775314.4
申请日:2021-03-24
发明人: AOKI, Masao
IPC分类号: C01B21/064 , C01B21/068 , C01B21/072 , C01B33/18 , H01B3/12
摘要: Provided is an insulating filler composed of a mixed powder in which a hydrophobic fumed oxide powder having an average primary particle size D 1 , which is smaller than an average primary particle size D 2 , is adhered to the surface of a magnesium oxide powder and/or a nitride-based inorganic powder having the average primary particle size D 2 , wherein: the ratio D 1 /D 2 of the average primary particle size D 1 to the average primary particle size D 2 is 6 × 10 -5 to 3 × 10 -3 ; the volume resistivity of the mixed powder is 1 × 10 11 Ω· m or more; and the content ratio of the hydrophobic fumed oxide powder in the mixed powder is 5-30 mass%. Also provided is an insulating material in which the above-mentioned insulating filler is contained in a resin molded body, wherein, when the insulating material is immersed in water at a temperature of 50°C for 120 hours, the rate of change (absolute value) of the dielectric breakdown voltage before and after the immersion is 5% or less.
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公开(公告)号:EP4105173A1
公开(公告)日:2022-12-21
申请号:EP21770425.3
申请日:2021-03-18
发明人: WADA, Kosuke , TANIGUCHI, Yoshitaka
IPC分类号: C01B21/06 , C01B21/064 , H01L23/36 , H01L23/373 , C08L83/05 , C08L83/07 , C08K3/013 , H05K7/20
摘要: Provided is a heat dissipation sheet containing a silicone resin and a thermally conductive filler, wherein, in a cross-sectional view in the thickness direction from one surface to the other surface of the heat radiation sheet, with respect to the cross-sectional shape of the thermally conductive filler, the average value of an aspect ratio of the 1st to 24th particles from the largest of biaxial average diameters, is in a range of 0.4 or more and 1.4 or less. As a result, it is possible to provide a heat dissipation sheet which exhibits excellent thermal conductivity and insulating property even under high pressure, and a method for producing the heat dissipation sheet. In addition, with respect to the 1st to 24th particles from the largest of biaxial average diameters, an area ratio (Sr) of a total area S of cross-sectional shapes of a plurality of the particles to a whole area of the cross-sectional view may be in a range of 20% or more and 80% or less, and the particle number ratio may be less than 1, preferably 0.4 or more and less than 1. Further, the heat dissipation sheet may have a thermal resistance ratio R 0.4 /R 1.0 of 1 or more, wherein R 0.4 is a thermal resistance value when a pressure of 0.4 MPa is applied in the thickness direction and R 1.0 is a thermal resistance value when a pressure of 1.0 MPa is applied in the thickness direction.
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公开(公告)号:EP3047055B1
公开(公告)日:2022-11-23
申请号:EP14766794.3
申请日:2014-09-15
IPC分类号: C30B29/40 , C23C16/34 , D01F9/12 , C01B21/064 , C01B32/162 , C01B32/164 , C23C16/455 , C30B25/00 , C30B29/60 , D01F9/08 , D01F9/133
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7.
公开(公告)号:EP4053073A1
公开(公告)日:2022-09-07
申请号:EP20881522.5
申请日:2020-10-20
发明人: IKEDA, Yuichi , DAIKI, Shota , FUJINAMI, Kyoichi , NAWATA, Teruhiko , TESHIMA, Katsuya , YAMADA, Tetsuya
IPC分类号: C01B21/064 , C08L101/00 , C08K3/38
摘要: Provided is a production method which makes it possible to improve a filling property, with respect to a resin, of a hexagonal boron nitride powder which contains hexagonal boron nitride particles each having a low aspect ratio, while maintaining low thermal conduction anisotropy of the hexagonal boron nitride powder. A method of producing a hexagonal boron nitride powder includes disintegrating, by a means which substantially does not involve pulverization of primary particles, a hexagonal boron nitride raw material powder which contains (i) hexagonal boron nitride particles each having an aspect ratio of 1.5 to 5.0 and (ii) an aggregate that contains hexagonal boron nitride particles each having an aspect ratio of more than 5.0.
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8.
公开(公告)号:EP4043394A1
公开(公告)日:2022-08-17
申请号:EP20874248.6
申请日:2020-09-29
IPC分类号: C01B21/064 , C08K9/04 , C08L63/00 , C08L75/04 , C08L83/04
摘要: Provided is a boron nitride powder having excellent adhesion to a resin. The boron nitride powder has a hexagonal structure, has a carboxyl group present on a surface of the boron nitride powder, and has a molar ratio of carboxyl group to nitrogen atom of 0.001 or more on a surface of the boron nitride powder.
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公开(公告)号:EP3333141B1
公开(公告)日:2021-12-15
申请号:EP17844650.6
申请日:2017-08-25
发明人: ISHIDA, Yuh , SUMIYA, Hitoshi
IPC分类号: C04B35/5831 , C04B35/626 , C04B35/645 , B24D3/34 , C01B21/064
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公开(公告)号:EP3878809A1
公开(公告)日:2021-09-15
申请号:EP20760326.7
申请日:2020-01-02
发明人: ZHANG, Xuetong , LI, Guangyong
IPC分类号: C01B21/064 , B82Y40/00
摘要: The present application discloses a flexible boron nitride nanoribbon aerogel and a preparation method thereof. The flexible boron nitride nanoribbon aerogel has a interconnected three-dimensional porous network structure which is formed by mutually twining and contacting boron nitride nanoribbons and consists of macropores having a pore diameter of more than 50 nm, mesopores having a pore diameter of 2-50 nm and micropores having a pore diameter of less than 2 nm. The preparation method comprises: performing high-temperature dissolution on boric acid and a nitrogen-containing precursor to form a transparent precursor solution, preparing the transparent precursor solution into precursor hydrogel, subsequently drying and performing high-temperature pyrolysis to obtain the flexible boron nitride nanoribbon aerogel. The boron nitride nanoribbon aerogel of the present application has excellent flexibility and resilience, can withstand different forms of loads from the outside within a wide temperature range and has resilience. Furthermore, the preparation method is simple in preparation process, mild in reaction conditions, easy to operate, low in cost, green and free of pollution, and is capable of realizing continuous production.
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