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公开(公告)号：EP3125278B1
公开(公告)日：2019-08-14
申请号：EP14887601.4
申请日：2014-09-17
发明人： NISHIZAWA, Koichiro
IPC分类号： H01L21/3205 , C23C18/50 , C23C28/00 , H01L21/28 , H01L21/768 , H01L23/532 , C25D7/12 , C23C18/16 , C23C18/32 , C23C18/54 , H01L21/285 , H01L29/45 , C23C28/02 , C23C18/18
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公开(公告)号：EP3156517B1
公开(公告)日：2018-12-05
申请号：EP15189465.6
申请日：2015-10-13
摘要： The present invention relates to the use of water soluble and air stable phosphaadamantanes as stabilizer in electrolytes for electroless metal deposition, an electrolyte as well as a method for the electroless deposition of metals, particularly layers of nickel, copper, cobalt, boron, silver, palladium or gold, as well as layers of alloys comprising at least one of the aforementioned metals as alloying metal. The present invention further relates to an organic stabilizer for electroless plating processes, and an electrolyte for the electroless deposition of a metal layer on a substrate, comprising a metal ion source for the metal to be deposited, a reducing agent, a complexing agent, a stabilizer and preferably an accelerator, as well as a method for the electroless deposition of a metal layer on a surface from an electrolyte according to the invention.
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公开(公告)号：EP3224388B1
公开(公告)日：2018-10-17
申请号：EP15797992.3
申请日：2015-11-17
发明人： PICALEK, Jan , BERA, Holger , AKHTAR, Shakeel , BEJAN, Iulia , PINNAU, Jennifer
CPC分类号： C23C18/1646 , C23C18/36 , C23C18/50
摘要： The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising metal ions of at least one of indium and gallium and iodine containing, inorganic compounds in order to enhance bath stability.
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公开(公告)号：EP3299493A4
公开(公告)日：2018-03-28
申请号：EP15905444
申请日：2015-10-01
发明人： NAMBU TAKASHI , AN BYEONGIL , ARAI TAKASHI
IPC分类号： C23C28/00 , C22C23/00 , C22C23/04 , C22C23/06 , C23C18/16 , C23C18/32 , C23C18/50 , C23C22/07 , C23C22/57 , C23C22/73 , C23C22/82 , F04D29/00
CPC分类号： C23C18/32 , C22C23/06 , C23C18/1633 , C23C18/1646 , C23C18/50 , C23C22/08 , C23C22/12 , C23C22/18 , C23C28/00 , C23C28/30 , C23C28/34 , F04D29/00
摘要： Said coating structure is provided with: a chemical conversion layer (11), which is formed by chemical conversion coating so as to cover the surface of an impeller body (10) obtained from a magnesium alloy that contains magnesium as the main component and which has a film thickness within a previously determined range; and a plating layer (12) formed so as to cover the chemical conversion layer (11).
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7.发明公开ENVIRONMENTALLY FRIENDLY STABLE CATALYSTS FOR ELECTROLESS METALLIZATION OF PRINTED CIRCUIT BOARDS AND THROUGH-HOLES 审中-公开环保型稳定催化剂用于印刷电路板和通孔的无金属化
公开(公告)号：EP3181724A3
公开(公告)日：2017-08-16
申请号：EP16202084.6
申请日：2016-12-02
发明人： CLEARY, Donald E.
CPC分类号： H05K3/181 , C23C18/1831 , C23C18/1879 , C23C18/2066 , C23C18/30 , C23C18/31 , C23C18/38 , C23C18/48 , C23C18/50 , H05K3/422 , H05K2203/0716
摘要： Catalysts include nanoparticles of catalytic metal and maltodextrin as a stabilizer in molar ratios which enable stabilization of the catalyst during storage and during electroless metal plating. The catalysts are environmentally friendly and are tin free. The catalysts adhere well to dielectric materials of printed circuit boards including the walls of through-holes.
摘要翻译： 催化剂包括催化金属和麦芽糖糊精的纳米颗粒作为稳定剂，其摩尔比能够在储存期间和无电镀金属期间使催化剂稳定。 该催化剂对环境无害并且不含锡。 催化剂很好地粘附到包括通孔壁的印刷电路板的介电材料上。
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8.发明公开ALLOY-PLATE-COATED MATERIAL, AND METHOD FOR PRODUCING ALLOY-PLATE-COATED MATERIAL 审中-公开采用合金电镀材料和方法用于制造合金的包覆材料
公开(公告)号：EP3064611A4
公开(公告)日：2017-04-12
申请号：EP14858864
申请日：2014-10-27
申请人： TOYO KOHAN CO LTD
IPC分类号： C23C18/50 , B32B15/01 , C23C22/50 , C23C22/83 , C23C28/00 , H01M8/0208 , H01M8/0228 , H01M8/1018
CPC分类号： B32B15/015 , C23C18/50 , C23C22/50 , C23C22/83 , C23C28/34 , H01M8/0208 , H01M8/0228 , H01M2008/1095
摘要： Provided is an alloy plate coated material (100) including a base material (10), and an alloy plate layer (20) which is formed on the base material (10) to constitute an outermost layer and is formed from a M1-M2-M3 alloy (provided that M1 is at least one element selected from Ni, Fe, Co, Cu, Zn and Sn; M2 is at least one element selected from Pd, Re, Pt, Rh, Ag and Ru; and M3 is at least one element selected from P and B), in which the alloy plate layer (20) has a molar ratio of M1 to M2 (M1/M2) of 0.005 to 0.5.
摘要翻译： 本发明提供一种形成在基体材料（10）在最外层构成，并且由M1-M2形成的合金板涂覆材料（100），其包括基体材料（10），和合金板层（20）上的所有 M3合金（提供确实M1是从镍，铁，铜，钴，Zn和Sn中选出的至少一种元素; M2是选自Pd，RE，铂，铑，银和Ru中选择的至少一种元素; M3是至少 从P和B中的一种元素），其中，所述合金板层（20）具有M1与0.005 M2（M1 / M2）至0.5的摩尔比。
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9.发明公开PROCÉDÉ DE TRAITEMENT D'UNE STRUCTURE MAGNÉTIQUE 审中-公开VERFAHREN ZUR BEHANDLUNG EINER MAGNETISCHEN STRUKTUR
公开(公告)号：EP2962337A1
公开(公告)日：2016-01-06
申请号：EP14713168.4
申请日：2014-02-21
发明人： RAVELOSONA, Dafiné
CPC分类号： H01F41/0253 , H01F1/047 , H01F7/02 , H01F41/308 , H01L43/12
摘要： Process for treating a magnetic structure, characterised in that it comprises the following steps: providing (S10) a magnetic structure comprising at least one first layer of magnetic material comprising a CoFeB alloy; irradiating (S20) the magnetic structure with light low-energy ions; and simultaneously holding (S30) the magnetic structure with a preset temperature profile and for a preset time.
摘要翻译： 用于处理磁性结构的方法，其中包括以下步骤：提供磁性结构，所述磁性结构包括包含CoFeB合金的一个第一层磁性材料; 用轻的低能离子照射磁结构; 并且以预设的温度曲线同时保持磁性结构并且预设时间。
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公开(公告)号：EP2036098A4
公开(公告)日：2012-03-21
申请号：EP07784146
申请日：2007-05-25
申请人： LAM RES CORP
发明人： DORDI YEZDI , THIE WILLIAM , VASKELIS ALGIRDAS , NORKUS EUGENIJUS , JACIAUSKIENE JANE , JAGMINIENE ALDONA
摘要： An electroless copper plating solution is disclosed herein. The solution includes an aqueous copper salt component, an aqueous cobalt salt component, a polyamine-based complexing agent, a chemical brightener component, a halide component, and a pH-modifying substance in an amount sufficient to make the electroless copper plating solution acidic. A method of preparing an electroless copper solution is also provided.
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