公开(公告)号：EP3360400A1

公开(公告)日：2018-08-15

申请号：EP16854064.9

申请日：2016-09-20

申请人： Laird Technologies, Inc.

发明人： CREASY Jr., Larry Don ,  TSAI, Richard ,  LEE, Dusan

IPC分类号： H05K9/00 ,  H05K1/09

CPC分类号： H05K9/0084 ,  C23C18/1605 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1614 ,  C23C18/163 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/1653 ,  C23C18/2066 ,  C23C18/30 ,  C23C18/38 ,  C23C18/405

摘要： According to various aspects, exemplary embodiments are disclosed of selectively metal-plated rolls of materials, rolls of materials configured for selective metal plating, and methods for selectively plating rolls of materials. In an exemplary embodiment, a roll of material includes a substrate. An insulating ink is on the substrate. A catalyst coating is on the substrate whereat the insulating ink is not present. The catalyst coating may be configured to provide the substrate with one or more catalytic surfaces suitable for electroless deposition of metal. Accordingly, metal plating may be electrolessly deposited on the catalyst coating without over-plating the insulating ink.

公开(公告)号：EP3296845A1

公开(公告)日：2018-03-21

申请号：EP16792549.4

申请日：2016-04-26

申请人： FUJIFILM Corporation

发明人： TSUKAMOTO Naoki

IPC分类号： G06F3/041 ,  B32B1/00 ,  B32B15/08 ,  C23C18/18 ,  G06F3/044 ,  H01B5/14 ,  H01B13/00 ,  H05K3/00 ,  H05K3/18

CPC分类号： C23C18/18 ,  B32B1/00 ,  B32B15/08 ,  B32B2307/202 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/2013 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/30 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/181 ,  H05K3/182 ,  H05K2201/0129 ,  H05K2203/0545 ,  H05K2203/302

摘要： An object of the present invention is to provide a method of simply manufacturing a conductive laminate which has a three-dimensional shape including a curved surface and in which a metal layer is disposed on the curved surface, a conductive laminate, a plated layer-attached substrate, a plated layer precursor layer-attached substrate, and a touch sensor.
The method of manufacturing the conductive laminate having three-dimensional shape including a curved surface according to the present invention includes: Step A of forming a pattern-shaped plated layer precursor layer including a predetermined compound on a substrate to obtain a plated layer precursor layer-attached substrate; Step B of deforming a plated layer precursor layer-attached substrate such that at least a portion of the plated layer precursor layer is deformed to form a three-dimensional shape including a curved surface; Step C of applying energy to the plated layer precursor layer to form a pattern-shaped plated layer; and Step D of applying a plating catalyst or a precursor thereof to the pattern-shaped plated layer, and then performing a plating treatment to form a pattern-shaped metal layer on the plated layer.

摘要翻译： 本发明的目的在于提供一种简单制造具有曲面的三维形状且在该曲面上配置有金属层的导电性层叠体的方法，导电性层叠体，附有镀层 衬底，附着镀层前体层的衬底和触摸传感器。 根据本发明的制造具有包括曲面的三维形状的导电层压板的方法包括：步骤A，在基板上形成包含预定化合物的图案形状镀层前体层，以获得镀层前体层 - 附着的基底; 步骤B，使附着有电镀层前体层的基板变形，使得至少一部分电镀层前体层变形以形成包括弯曲表面的三维形状; 将能量施加到镀层前体层以形成图案形状的镀层的步骤C; 以及将电镀催化剂或其前体施加到图案形状的镀层上，然后进行电镀处理以在电镀层上形成图案形状的金属层的步骤D.

公开(公告)号：EP3019641A1

公开(公告)日：2016-05-18

申请号：EP14822421.5

申请日：2014-07-09

申请人： United Technologies Corporation

发明人： ROACH, James, T. ,  COOK, Grant ,  BUGAJ, Shari, L. ,  DEHLAVI, Majidullah ,  SCHLICHTING, Kevin, W. ,  PARKOS, Joseph ,  LEVASSEUR, Glenn

IPC分类号： C23C26/00

CPC分类号： B64D15/00 ,  C23C18/1605 ,  C23C18/1646 ,  C23C18/1651 ,  C25D1/00 ,  C25D5/022 ,  C25D5/10 ,  C25D5/16 ,  C25D5/56 ,  C25D7/00 ,  H05B3/06

摘要： Aviation components comprising a polymeric substrate having an outer surface wherein a metal is plated onto the outer surface to form a plated layer are disclosed. A method to make aviation components comprising a polymeric substrate having an outer surface and where a metal is plated onto the outer surface is disclosed. An over-plated heating element for shedding ice from an aircraft component having a polymeric substrate with a pocket to receive a heating element, a metal deposited onto the substrate, a heating element positioned within the pocket and a covering layer deposited onto the heating element and the plated layer is disclosed.

摘要翻译： 公开了包括具有外表面的聚合物基材的航空部件，其中将金属镀在外表面上以形成镀层。 公开了一种使包括具有外表面的聚合物基材和其中金属被镀在外表面上的航空部件的方法。 一种用于从具有带有凹穴的聚合物基底的飞机部件脱落冰以接收加热元件的过镀层加热元件，沉积在基底上的金属，位于该凹槽内的加热元件和沉积在加热元件上的覆盖层， 公开了镀层。

公开(公告)号：EP2639262A1

公开(公告)日：2013-09-18

申请号：EP12159858.5

申请日：2012-03-16

申请人： Mitsubishi Chemical Europe GmbH

发明人： Schrauwen, Bernardus Antonius Gerardus

IPC分类号： C08K3/22 ,  H05K1/03 ,  H05K3/10

CPC分类号： C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

摘要： The present invention relates to a thermoplastic composition comprising: a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt% with respect to the weight of the total composition, wherein the LDS additive comprises a mixed metal oxide comprising at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminum and molybdenum, wherein the LDS additive comprises at least 40 wt% of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1 .

摘要翻译： 本发明涉及一种热塑性组合物，其包含：a）热塑性树脂和b）相对于总组合物重量为至少1重量％的量的激光直接结构化（LDS）添加剂，其中LDS添加剂包括 包含至少含有锡和选自锑，铋，铝和钼的第二金属的混合金属氧化物，其中所述LDS添加剂包含至少40重量％的锡，并且其中所述第二金属与锡的重量比为 至少0.02：1。

公开(公告)号：EP2465973A2

公开(公告)日：2012-06-20

申请号：EP11193191.1

申请日：2011-12-13

申请人： Rohm and Haas Electronic Materials LLC

发明人： Rzeznik, Maria Anna ,  Liu, Feng

IPC分类号： C23C18/16 ,  C23C18/20

CPC分类号： C23C18/1646 ,  C23C18/1639 ,  C23C18/1653 ,  C23C18/1875 ,  C23C18/2086 ,  C23C18/30 ,  C23C18/405 ,  C23C28/02 ,  H05K3/42 ,  H05K2203/0716

摘要： Stable zero-valent metal compositions and methods of making and using these compositions are provided. Such compositions are useful as catalysts for subsequent metallization of non-conductive substrates, and are particularly useful in the manufacture of electronic devices.

摘要翻译： 提供稳定的零价金属组合物和制备和使用这些组合物的方法。 这样的组合物可用作用于随后金属化非导电衬底的催化剂，并且在电子器件的制造中特别有用。

公开(公告)号：EP2329057A2

公开(公告)日：2011-06-08

申请号：EP09793262.8

申请日：2009-10-02

申请人： E. I. du Pont de Nemours and Company

发明人： NAIR, Kumaran Manikantan ,  SKURSKI, Michael A. ,  VOULTOS, John, D.

IPC分类号： C23C18/16 ,  C23C18/42 ,  C23C18/54 ,  H01L23/15 ,  H01B1/16

CPC分类号： H05K3/4661 ,  C03C8/04 ,  C03C8/18 ,  C23C18/1601 ,  C23C18/1646 ,  C23C18/1651 ,  C23C18/42 ,  C23C18/54 ,  H01B1/22 ,  H01L21/4867 ,  H05K1/092 ,  H05K3/246 ,  H05K2203/072

摘要： Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.

公开(公告)号：EP3380643A1

公开(公告)日：2018-10-03

申请号：EP16869048.5

申请日：2016-11-03

申请人： Applied Materials, Inc.

发明人： LIU, Zhendong ,  HOU, Wenting ,  LEI, Jianxin ,  YOUNG, Donny ,  LU, William M.

IPC分类号： C23C14/56 ,  C23C14/34 ,  C23C14/50

CPC分类号： C23C4/134 ,  C23C14/34 ,  C23C14/564 ,  C23C16/4404 ,  C23C16/45525 ,  C23C16/50 ,  C23C18/1646 ,  C23C18/1689 ,  C23C18/31 ,  C23C18/48 ,  C25D3/02 ,  C25D5/48 ,  C25D7/00 ,  C25D17/00 ,  H01J37/32477 ,  H01J37/32504 ,  H01J37/3408 ,  H01J37/3441 ,  H01J37/3476

摘要： Implementations of the present disclosure relate to an improved shield for use in a processing chamber. In one implementation, the shield includes a hollow body having a cylindrical shape that is substantially symmetric about a central axis of the body, and a coating layer formed on an inner surface of the body. The coating layer is formed the same material as a sputtering target used in the processing chamber. The shield advantageously reduces particle contamination in films deposited using RF-PVD by reducing arcing between the shield and the sputtering target. Arcing is reduced by the presence of a coating layer on the interior surfaces of the shield.

公开(公告)号：EP3234219A1

公开(公告)日：2017-10-25

申请号：EP15813382.7

申请日：2015-12-17

申请人： Atotech Deutschland GmbH

发明人： BECK, Thomas ,  STEINBERGER, Gerhard ,  WALTER, Andreas

IPC分类号： C23C18/44

CPC分类号： C23C18/44 ,  C23C18/1646

摘要： The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aldehyde compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aldehyde compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aldehyde compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths.

摘要翻译： 本发明涉及一种含水电镀液组合物和一种通过无电镀在衬底上沉积钯层的方法。 本发明的水系镀浴组合物含有钯离子源，钯离子还原剂和醛化合物。 含水电镀液组合物具有提高的钯沉积速率，同时保持浴稳定性。 含水电镀液组合物也具有延长的使用寿命。 本发明的醛化合物允许在浴寿命期间将沉积速率调节到恒定的范围并且在较低的温度下无电沉积钯层。 本发明的醛化合物激活具有低沉积速率的无电镀钯浴并重新激活老化的无电镀钯浴。

公开(公告)号：EP3224388A1

公开(公告)日：2017-10-04

申请号：EP15797992.3

申请日：2015-11-17

申请人： Atotech Deutschland GmbH

发明人： PICALEK, Jan ,  BERA, Holger ,  AKHTAR, Shakeel ,  BEJAN, Iulia ,  PINNAU, Jennifer

IPC分类号： C23C18/32 ,  C23C18/50

CPC分类号： C23C18/1646 ,  C23C18/36 ,  C23C18/50

摘要： The present invention relates to aqueous plating bath compositions and methods for deposition of nickel and nickel alloys utilizing mixtures of stabilizing agents comprising metal ions of at least one of indium and gallium and iodine containing, inorganic compounds in order to enhance bath stability.

摘要翻译： 本发明涉及使用包含铟和镓中的至少一种金属离子和无机化合物中的至少一种的金属离子的稳定剂的混合物来沉积镍和镍合金的含水镀敷浴组合物和方法，以提高镀浴稳定性。

公开(公告)号：EP3167097A1

公开(公告)日：2017-05-17

申请号：EP15818405.1

申请日：2015-06-29

申请人： MacDermid Acumen, Inc.

发明人： MORCOS, Boules H. ,  MICYUS, Nicole J. ,  PAWLOWSKI, John

IPC分类号： C23C18/32

CPC分类号： C23C18/1646 ,  C23C18/1662 ,  C23C18/1671 ,  C23C18/34 ,  C23C18/36

摘要： A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative temiinal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.

摘要翻译： 描述了在基底上制造复合无电镍层的方法。 该方法包括使基材与复合无电镀镍浴接触并在无电镀镍浴中产生静电场的步骤。 通过将阳极放置在无电镀镍浴中并且将阳极连接到DC整流器的正极端子，并且将基板连接到DC整流器的负极端子并且优选地将电容器插入到电路中来产生电场 防止电流通过。 由静电场产生的吸引力增加了带正电荷的PTFE颗粒对带负电荷的基材的吸引力并将带正电荷的PTFE颗粒驱动到带负电荷的基材上。