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公开(公告)号：JP4370668B2
公开(公告)日：2009-11-25
申请号：JP2000090783
申请日：2000-03-29
Applicant: Jsr株式会社
IPC: G03F7/039 , C08J5/18 , C08L33/08 , C08L33/10 , C08L101/02 , C25D5/02 , C25D7/12 , G03F7/004 , G03F7/11 , G03F7/38 , G03F7/40 , G03F7/42
CPC classification number: G03F7/40 , G03F7/0392 , G03F7/0397 , G03F7/405
Abstract: The present invention provides a positive type radiation-sensitive resin composition for producing a product formed by plating, which is capable of forming a product formed by plating of a thick film such as a bump or a wiring with high precision and has excellent sensitivity and resolution, and a process for producing a product formed by plating using the composition. The positive type radiation-sensitive resin composition for producing a product formed by plating comprises (A) a polymer having an acid-dissociative functional group which is dissociated by an acid to generate an acid functional group and (B) a component which generates an acid when irradiated with a radiation. This composition is used also for a positive type radiation-sensitive resin film. The product formed by plating is produced by a process including a step wherein electroplating is carried out with the use of a pattern that is formed from the composition or the resin film on the substrate as a mold.
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公开(公告)号：JP3960055B2
公开(公告)日：2007-08-15
申请号：JP2002014308
申请日：2002-01-23
Applicant: Jsr株式会社
Abstract: PROBLEM TO BE SOLVED: To provide a photosensitive insulating resin composition having excellent resolution, electric insulating property and thermal shock property and giving a cured product having preferable chemical resistance. SOLUTION: The photosensitive insulating resin composition comprises an alkali soluble resin (A) having a phenolic hydroxyl group, a compound (B) having at least two alkylether amino group in the molecule, crosslinked fine particles (C), an oxirane ring-containing compound (D), a photosensitive acid generator (E) and a solvent (F). The cured product is obtained by thermally setting the above photosensitive insulating resin composition. COPYRIGHT: (C)2003,JPO
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公开(公告)号：JP3812655B2
公开(公告)日：2006-08-23
申请号：JP2002018390
申请日：2002-01-28
Applicant: Jsr株式会社
IPC: G03F7/004 , G03F7/022 , G03F7/032 , H01L21/312
Abstract: PROBLEM TO BE SOLVED: To obtain a positive photosensitive insulating resin composition having excellent resolution, electric insulating property and thermal shock resistance and giving a cured product with preferable adhesion property and solvent resistance. SOLUTION: The positive photosensitive insulating resin composition is characterized in that it is provided with an alkali soluble resin (A) having a phenolic hydroxyl group, a compound (B) having a quinone diazide group, crosslinked fine particles (C), a compound (D) having at least two alkyletherified amino groups in the molecule, thermosensitive acid generator (E) and a solvent (F). The cured product characterized in that it is obtained by curing the above positive photosensitive insulating resin composition. COPYRIGHT: (C)2003,JPO
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