Positive-type photosensitive insulating resin composition and the cured product

    公开(公告)号:JP3812655B2

    公开(公告)日:2006-08-23

    申请号:JP2002018390

    申请日:2002-01-28

    Abstract: PROBLEM TO BE SOLVED: To obtain a positive photosensitive insulating resin composition having excellent resolution, electric insulating property and thermal shock resistance and giving a cured product with preferable adhesion property and solvent resistance. SOLUTION: The positive photosensitive insulating resin composition is characterized in that it is provided with an alkali soluble resin (A) having a phenolic hydroxyl group, a compound (B) having a quinone diazide group, crosslinked fine particles (C), a compound (D) having at least two alkyletherified amino groups in the molecule, thermosensitive acid generator (E) and a solvent (F). The cured product characterized in that it is obtained by curing the above positive photosensitive insulating resin composition. COPYRIGHT: (C)2003,JPO

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