Abstract:
PROBLEM TO BE SOLVED: To provide a composite of metal oxide nanoparticles and a silsesquioxane polymer capable of forming, without entailing the flocculation, etc. of a metal oxide at a curing step, a high-quality cured film in which the metal oxide is homogeneously dispersed.SOLUTION: In the provided method for manufacturing a composite of metal oxide nanoparticles and a silsesquioxane polymer, a silsesquioxane polymer or silane monomer possessing a silanol group at the terminal thereof and metal oxide nanoparticles possessing hydroxyl groups or alkoxy groups on the surfaces thereof are reacted within an aqueous solvent in the presence of a phase transfer catalyst; a composite manufactured by the same is also provided.
Abstract:
PROBLEM TO BE SOLVED: To provide a golf ball with excellent elastic modulus by combining heterogeneous compositions.SOLUTION: The golf ball is formed from heterogeneous golf ball compositions comprising a thermoplastic matrix and discrete particles of crosslinked polymer dispersed within the matrix.
Abstract:
PROBLEM TO BE SOLVED: To provide: a copolymer in which dispersibility of a filler such as carbon black and silica can be improved when being used for a part of a rubber composition; the rubber composition that includes the copolymer, in which processability is excellent when being combined, being molded and being subjected to vulcanization, that has excellent rolling resistance performance and abrasion resistance, and that can control decrease of mechanical strength and hardness; and a tire using the rubber composition.SOLUTION: A copolymer contains a monomer unit (a) derived from isoprene, and a monomer unit (b) derived from farnesene. A method for producing the copolymer involving copolymerization of at least isoprene and farnesene. A rubber composition contains the copolymer (A), a rubber component (B) and carbon black (C). A rubber composition contains the copolymer (A), a rubber component (B) and silica (D). A rubber composition contains the copolymer (A), a rubber component (B), carbon black (C) and silica (D). A tire has at least one part where the rubber composition is used.
Abstract:
A polyester resin composition for light reflector base, causing only a small amount of outgas in the process of molding a light reflector base or producing a light reflector, excellent in adhesiveness with a metal film layer provided to the surface of the light reflector base, and capable of keeping high luminance even when exposed under high-temperature atmospheres will be provided. The polyester resin composition for light reflector base of the present invention, on the surface of which a light reflecting layer is provided, contains (A) 100 parts by weight of polyester resin, and (B) 0.05 to 2 parts by weight of modified polyolefin resin having a weight-average molecular weight of 2,000 or larger, and an acid value of larger than 1 mg KOH/g and smaller than 10 mg KOH/g.
Abstract:
PROBLEM TO BE SOLVED: To provide an adhesive with thermal conductivity, insulation, high-temperature resistance, and flame retardancy; and to provide an adhesive tape.SOLUTION: Such an adhesive comprises: a silicone rubber of 10 to 90 wt.%, which then is temperature-resistant above ≥150°C without substantially cracking under at 150°C, and whose hardness does not change with a change of temperature; a metal hydroxide of 0.01 to 75 wt.%; and a metal oxide of 0.01 to 80 wt.%.
Abstract:
PROBLEM TO BE SOLVED: To provide an abrasive pad which ensures excellent polishing rate and polishing uniformity by improving the problem of scratch occurring when using a conventional hard (dry) abrasive pad, and can deal with not only the primary polishing but also the finish polishing, and to provide a manufacturing method therefor.SOLUTION: In the abrasive pad for polishing a semiconductor device including an abrasive layer which has a polyurethane polyurea resin molding containing substantially spherical bubbles, independent bubble ratio of the polyurethane polyurea resin molding is 60-98%, the ratio (loss modulus/storage modulus) tanδ of the loss modulus E" to the storage modulus E' of the polyurethane polyurea resin molding is 0.15-0.30, the storage modulus E' is 1-100 MPa, and the density D of the polyurethane polyurea resin molding is 0.4-0.8 g/cm.
Abstract:
PROBLEM TO BE SOLVED: To provide a casting epoxy resin composition superior in flowability as well as in thermal conductivity.SOLUTION: The casting epoxy resin composition is characterized by containing: an epoxy resin showing a liquid state at room temperature and having two or more epoxy groups per molecule; an epoxy resin curing agent showing a liquid state at room temperature; a plate-like inorganic filler; and a spherical alumina filler. The plate-like inorganic filler and spherical inorganic filler have two or more maximal points in a particle distribution as a whole, and the mass ratio of the plate-like inorganic filler is 5-20 mass% of the total mass of the inorganic filler, the total mass being obtained by totalizing the masses of the plate-like inorganic filler and spherical inorganic filler combined together.