公开(公告)号：JP2000153378A

公开(公告)日：2000-06-06

申请号：JP26406398

申请日：1998-09-02

Applicant: FUJI ELECTRIC CO LTD

Inventor： NAGASHIMA TAKAHIRO

IPC: G11B5/84 ,  B23K26/00 ,  B23K26/351 ,  B23K26/361

Abstract: PROBLEM TO BE SOLVED: To obtain a recording medium coping with high speed processing of good CSS characteristic adding continuous intensity modulation to a laser beam with an intensity modulation signal, setting a ratio between the max-value and the min.value (max.value/min.value) of laser output intensity to a specified value and forming a texture arrayed with protrusions on a substrate of a magnetic recording medium. SOLUTION: A laser beam from a continuous oscillation laser is added with external modulation by a modulator 12 and subjected to output adjustment by an attenuator 13. The laser beam is transmitted to a beam converging lens 15 by a laser beam transmission means 14, is condensed to a prescribed size and irradiates a magnetic recording medium substrate 17 rotated by a spindle motor 16. A max.value/min.value of laser beam output intensity is set to a prescribed value in a range of 1-2. Preferably, the condensing spot diameter of a laser beam on the substrate is set to 1-20 μm, the texture, in which protrusions are helically arrayed, are formed by moving the substrate or the laser beam in parallel, a number of revolutions of the substrate is set to 10-20000.

公开(公告)号：JP2000094174A

公开(公告)日：2000-04-04

申请号：JP26502898

申请日：1998-09-18

Applicant: HITACHI ELECTR ENG

Inventor： WADA NORIYA ,  KINOSHITA KAZUTO ,  SUGIZAKI SHINJI

IPC: G11B5/84 ,  B23K26/066 ,  B23K26/351 ,  B23K26/361 ,  B23K26/06 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To extend the service life of a bump by providing a part of a length in a specified direction on a top of the bump to be formed on a surface of a magnetic disk so as to realize an approximately line-contact condition when a magnetic head is brought into contact with the bump. SOLUTION: A laser beam irradiating means is provided, the laser beam from a laser beam source is dimmed by an AOM, expanded in diameter and paralleled by a beam expander so as to realize a specified beam diameter, and a disk is irradiated with the laser pulses from an objective lens unit to form a bump 2. A diaphragm 30 having an opening 32 is provided on a diaphragm plate 31 in a forward stage of the objective lens unit, and the opening 32 in the diaphragm 30 is of elliptical shape having a major axis 32a and a minor axis 32b. The bump 2 is longitudinal in the direction of the minor axis 32b, and when a magnetic head is abutted thereon, the magnetic head is substantially brought into line-contact therewith in this direction.

公开(公告)号：JPH11333577A

公开(公告)日：1999-12-07

申请号：JP14279698

申请日：1998-05-25

Applicant: YUWA SEISAKUSHO KK

Inventor： IHARA SATOSHI

IPC: B23K26/00 ,  B23K26/351 ,  B23K26/361 ,  B23K26/38

Abstract: PROBLEM TO BE SOLVED: To provide a control method for the working head of the laser beam machine without requiring the large arithmetic capacity of a computer, moreover, having a high operation speed. SOLUTION: By adding a base line (b) near a cutting line (a), by determining a normal plane Z at the arbitrary point P of the cutting line (a) by a CAD, by finding the intersection point Q of the normal plane Z and the base line (b), by linking the point P and the point Q by a straight line (1), by determining by the CAD an axial line AX passing through the arbitrary point P of the cutting line (a) within the normal plane Z and orthogonally crossing the straight line (1), and by controlling by CAD data so that the axis of the working head is along the axial line AX, it is not necessary to prepare the surface data of an object 1 to be worked.

公开(公告)号：JPH11163056A

公开(公告)日：1999-06-18

申请号：JP33174197

申请日：1997-12-02

Applicant: HITACHI CABLE

Inventor： ENDO HIROHISA ,  KISHINO KAZUHISA ,  YONEMOTO TAKAHARU ,  YOSHIOKA OSAMU

IPC: B26F1/02 ,  B23K26/351 ,  B23K26/361 ,  H01L21/60 ,  H05K3/00 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To prevent occurrence of cracks resulting from burrs produced when a solder ball is mounted and, in addition, to carry out the mounting work in a short time, by removing the burrs produced around a through hole with a laser beam after the through hole is formed through a tape by punching. SOLUTION: A through hole 3 having a perpendicular inner peripheral wall to a tape 1 is formed by punching using a molding die having a punch and a die. When the hole 3 is formed, burrs are produced around the hole 3 on the rear surface side. Therefore, the burrs are removed by irradiating only the area surrounding the hole 3 with a laser beam. Consequently, the mounting of a solder ball on the hole 3 on the rear-surface side of the tape 1 becomes easier, because the edge 3a of the cross-section of the hole 3 on the rear-surface side of the tape 1 becomes to have an inclined inner peripheral wall due to the laser beam. Accordingly, occurrence of cracks can be prevented when the solder ball is mounted and, the mounting work can be carried out in a short time.

公开(公告)号：JPH11143517A

公开(公告)日：1999-05-28

申请号：JP30214997

申请日：1997-11-04

Applicant: NEC CORP

Inventor： SAITO YASUKO

IPC: B23K26/361 ,  B23K26/351 ,  G05B19/409 ,  G05B19/4097 ,  H04N1/38 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To easily prepare laser trimming data by visually inputting the trimming data by using a graphic. SOLUTION: In this method, a concept diagram display step (S1) for displaying a concept diagram 11 that corresponds to it on a display screen of a display by inputting trimming data, a data input box display step (S2) for displaying a data input box 12 to display the data of a parameter on the display screen and a data display step (S3) for displaying data that is inputted from a keyboard based on the diagram 11 on the data input box are executed repeatedly for all necessary parameters.

公开(公告)号：JPH11135352A

公开(公告)日：1999-05-21

申请号：JP31457297

申请日：1997-10-31

Applicant: TOKO INC

Inventor： MORITA CHIHO ,  SAKAKURA MITSUO

IPC: B23K26/361 ,  B23K26/00 ,  B23K26/351 ,  H01F17/00 ,  H01F41/04

Abstract: PROBLEM TO BE SOLVED: To provide an inductance element having a high inductance and a high Q-value by preventing the reduction in the resistance of ferrite core and improving the adhesion of a conductive film. SOLUTION: A double-layered conductive film, formed of a base layer and electrode layer is formed on the side surface of a columnar or prismatic ferrite core, and it is ground by laser to form a spiral conductive pattern. The ferrite whose resistance is reduced due to the metalization through laser irradiation is treated by heating in an oxygen atmosphere so as to be reacted with oxygen, thereby making it to be insulating and raising the resistance. Furthermore, the adhesion of ferrite to the surfacial electrode layer is improved.

公开(公告)号：JPH1190663A

公开(公告)日：1999-04-06

申请号：JP25108897

申请日：1997-09-16

Applicant: AMADA CO LTD

Inventor： IIDA FUMIO

IPC: B23K9/32 ,  B23K26/04 ,  B23K26/351 ,  B23K26/361 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To provide a groove machining method with a laser beam having a clean surface where a spatter is not stuck to the right and left sides of a groove part of a work when the groove is machined. SOLUTION: In a groove machining method with a laser beam, when a groove is machined for a work W by irradiating the laser beam LB from a nozzle 11 provided at the tip of a laser beam machining head facing toward the work W to be machined, the groove is machined for the work W by keeping the condition where the optical axis C2 of the laser beam LB is always at an eccentric position in the advancing direction of the laser beam machining head from the axial center C1 of the nozzle 11 against the advancing direction of the laser beam machining head.

公开(公告)号：JPH1174359A

公开(公告)日：1999-03-16

申请号：JP23096597

申请日：1997-08-27

Applicant: TOSHIBA MICRO ELECTRONICS ,  TOSHIBA CORP

Inventor： SASAKI MIKI ,  MINAMI TOSHIFUMI

IPC: B23K26/351 ,  B23K26/361 ,  B23K26/38 ,  H01L21/82 ,  H01L21/8242 ,  H01L27/108 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device of a structure wherein even if fuses are microscopically formed, the desired fuse only among the fuses can be fused out without inflicting damage on the other fuses adjacent to each other, and the microscopic formation of the fuses can contribute to the enhancement of the integration degree of the device, and a method of manufacturing the device. SOLUTION: A semiconductor device is provided with a plurality of groups of first and second wiring layers 13a and 13b which are electrically separated from each other, a plurality of groups of fuses 31-1 to 31-4 which are respectively connected electrically with the wiring layers 13a and 13b corresponding to each other of each group, and an insulating film 34 formed in such a way as to cover the surfaces of the fuses. Windows 33 for fusing are respectively formed on the film 34 in each fuse, and in the case where one fuse among the fuses is fused out, damage is not inflicted on the other fuse adjacent to the one fuse and the microscopic formation of the fuses is possible.

公开(公告)号：JP2827608B2

公开(公告)日：1998-11-25

申请号：JP23693091

申请日：1991-08-26

Applicant: NIPPON DENKI KK

Inventor： HORIKOSHI SATOSHI

IPC: B23K26/361 ,  B23K26/351 ,  H01C17/24 ,  H01C17/242 ,  H01L27/01 ,  H01S3/00 ,  B23K26/00

公开(公告)号：JPH10303062A

公开(公告)日：1998-11-13

申请号：JP10917697

申请日：1997-04-25

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： HAYASAKA MITSUNORI ,  YAMADA KIYOHIKO ,  TOBA HIROKADO

IPC: B23K26/351 ,  B23K26/361 ,  H01G4/255 ,  B23K26/00

Abstract: PROBLEM TO BE SOLVED: To freely increase/decrease an electrostatic capacity for fast and high precision adjustment, relating to a trimmerble capacitor. SOLUTION: Inside a ceramics substrate 10 of dielectrics, provided with first and second electrode terminals 11 and 12 on both ends, an inner layer electrode 15 connected to the first electrode terminal 11 is embedded, and on the surface of dielectrics, a conductive electrode 13 and an insulating electrode 14 which is given conductivity by heating, each of which is respectively connected to the second electrode terminal 12 while facing the inner layer electrode 15, are allocated. A laser is poured as indicated with an arrow 16 to remove a part of the conductive electrode 13, or, a part of the insulating electrode 14 is irradiated with the laser as indicated with an arrow 17, for heating, to provide a conductivity to that part, so that a facing electrode area is increased/ decreased, for adjusting capacity.