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    CERAMICS PARTS FOR MOVABLE PRECISION APPARATUS AND ITS MANUFACTURING METHOD
    63.
    发明专利
    CERAMICS PARTS FOR MOVABLE PRECISION APPARATUS AND ITS MANUFACTURING METHOD 失效

    公开(公告)号：JP2002047078A

    公开(公告)日：2002-02-12

    申请号：JP2000230303

    申请日：2000-07-31

    Applicant: NHK SPRING CO LTD

    Inventor： ADACHI RYUSUKE ,  KAYAMOTO TAKASHI

    IPC: C04B41/80

    Abstract: PROBLEM TO BE SOLVED: To provide ceramics parts for a movable precision apparatus like a magnetic disk apparatus whose reliability are enhanced by decreasing a particle generated (dropped out) from a surface of the parts and its manufacturing method. SOLUTION: The ceramics material is fired to form the parts, then heat- treated in the atmosphere or an oxidative atmosphere at 400-1400 deg.C, as a result a protective film is formed and the surface is repaired. The particle generation is remarkably decreased.

    SI-GE SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME, AND THERMOELECTRIC CONVERSION MODULE
    64.
    发明专利
    SI-GE SEMICONDUCTOR DEVICE AND MANUFACTURE OF THE SAME, AND THERMOELECTRIC CONVERSION MODULE 失效

    公开(公告)号：JP2000286466A

    公开(公告)日：2000-10-13

    申请号：JP9397499

    申请日：1999-03-31

    Applicant: NHK SPRING CO LTD

    Inventor： TAGUCHI KOHEI ,  KAYAMOTO TAKASHI

    IPC: H01L35/08 ,  H01L35/14 ,  H01L35/32

    Abstract: PROBLEM TO BE SOLVED: To provide a thermoelectric conversion module of high long-period reliability, wherein bonding of an Si-Ge semiconductor to a carbon electrode as well as to a carbon electrode, soldering material, and metal electrode is satisfactory. SOLUTION: The powder of an Si-Ge semiconductor is allowed to contact a carbon electrode having a thermal expansion factor 77-150% of the Si-Ge semiconductor, which is kept at a temperature lower than solidus line temperature of the Si-Ge semiconductor plus 30 K, so that the Si-Ge semiconductor powder is sintered, a plurality of Si-Ge semiconductor devices wherein the Si-Ge semiconductor 1 is bonded to the carbon electrode 2 are placed side by side, and adjoining carbon electrodes 2 of Si-Ge semiconductor device are connected with a metal electrode 5 via a soldering material 4.

    THERMO-ELECTRIC CONVERSION MODULE
    65.
    发明专利
    THERMO-ELECTRIC CONVERSION MODULE 失效

    公开(公告)号：JP2000188429A

    公开(公告)日：2000-07-04

    申请号：JP9397399

    申请日：1999-03-31

    Applicant: NHK SPRING CO LTD ,  NISSAN MOTOR

    Inventor： TAGUCHI KOHEI ,  TERAKADO KENJI ,  KAYAMOTO TAKASHI ,  MATSUMOTO ATSUO ,  OGUSU SHINKO ,  KUSHIBIKI KEIKO ,  KOBAYASHI MASAKAZU ,  FURUYA KENJI ,  SHINOHARA KAZUHIKO

    IPC: H01L35/08 ,  H01L35/14 ,  H01L35/32

    Abstract: PROBLEM TO BE SOLVED: To provide a thermo-electric conversion module which easily controls power generation output depending on temperature distribution of a heat source, has a curved plane to maintain good thermal contact even for the heat source having a large temperature difference between the high temperature end and low temperature end and minimizes loss of the power generation output. SOLUTION: At least two pairs or more of the p-type and n-type thermo-electric semiconductor elements (1) are alternately arranged in a line, and moreover the p-type and n-type thermo-electric semiconductor elements (1) arranged alternately are connected in series electrically with the electrodes (3) formed at the high temperature end and low temperature end. For example, a strain alleviating electrode (2) mainly composed of carbon is provided at least between the electrode (3) of the high temperature end and the thermo-electric semiconductor element (1), and the adjacent thermo-electric semiconductor elements are deposited via an electrically insulating layer (4) which is mainly composed of an oxide glass material.

    COMPOSITE MATERIAL OF METAL AND CERAMIC
    66.
    发明专利
    COMPOSITE MATERIAL OF METAL AND CERAMIC 失效

    公开(公告)号：JP2000017350A

    公开(公告)日：2000-01-18

    申请号：JP18211798

    申请日：1998-06-29

    Applicant: NHK SPRING CO LTD

    Inventor： KAYAMOTO TAKASHI ,  SAITO SHINJI

    IPC: C22C1/10

    Abstract: PROBLEM TO BE SOLVED: To inexpensively provide a composite material of metal and ceramic usable as a structural member in the combination with a ceramic material low in a thermal expansion coefficient. SOLUTION: Mother phase metal is composed of nickel simple substance or a nickel alloy contg., by weight, >=25% nickel,

    ELECTROSTATIC CLAMPING DEVICE
    67.
    发明专利
    ELECTROSTATIC CLAMPING DEVICE 失效

    公开(公告)号：JPH09283609A

    公开(公告)日：1997-10-31

    申请号：JP11578196

    申请日：1996-04-12

    Applicant: NHK SPRING CO LTD

    Inventor： KAYAMOTO TAKASHI

    IPC: H01L21/302 ,  H01L21/203 ,  H01L21/205 ,  H01L21/3065 ,  H01L21/68 ,  H01L21/683

    Abstract: PROBLEM TO BE SOLVED: To attempt to improve heat transmission efficiency during cooling or heating, by brazing an electrostatic chuck plate having a ceramic board on all surface of base member on which cooling or heating mechanism for a substrate is assembled. SOLUTION: Cooling water passages 1a are sectioned and fixed in the inner part of a base member 1 having a disk shape and being made of aluminum alloy having a flange part at the outer periphery, and an inserting member 3 is brazed on the upper surface of the base member 1 via a brazing member 2. Additionally, an electrostatic chuck plate 5 is brazed on the upper surface of the inserting member 3 via a brazing member 4. This electrostatic chuck plate 5 is formed by laminating a ceramic substrate 5a with aluminum base, a metal conductive layer 5b and a glass insulating layer 5c. By the means mentioned above, heat radiation or heat absorption from all rear surface of the electrostatic chuck plate 5 can be performed and heat transmission efficiency during cooling or heating can significantly be improved.

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