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    PRODUCTION FOR POLYESTER MOLDED ARTICLE HAVING METALLIZED SURFACE
    73.
    发明专利
    PRODUCTION FOR POLYESTER MOLDED ARTICLE HAVING METALLIZED SURFACE 失效

    公开(公告)号：JPS61281874A

    公开(公告)日：1986-12-12

    申请号：JP12327085

    申请日：1985-06-06

    申请人： NIPPON ESTER CO LTD

    发明人： ICHIKAWA MIHOKO ,  TSUJIMOTO KEIZO ,  ICHIHASHI EIJI

    IPC分类号： C23C18/20 ,  C23C18/16 ,  C23C18/22 ,  C23C18/24 ,  C23C18/26 ,  C23C18/28 ,  C23C18/31 ,  C23C18/34 ,  C23C18/40 ,  C23C18/44

    摘要： PURPOSE:To obtain a molded article having a metallic coating film excellent in adhesive force by alkali-treating a polyester molded article and thereafter performing successively the acidic liquid treatment, the sensitization treatment and the activation treatment and performing the chemical plating. CONSTITUTION:After alkali-treating a polyester molded article by using an NaOH aq. soln. or the like, it is treated in an acidic soln. such as an HCl aq. soln. or the like to neutilize excess alkali. Then in an ordinary method, it is subjected to the sensitization treatment preferably in the reduced pressure and successively the high activation treatment is performed thereto. After these treatments, the chemical plating such as Ni and Cu is performed. By this method, the polyester molded article having metallized surface which is uniform and excellent in adhesive force is obtained in the short-time treatment. This method can be applied for a molded article having the various shapes such as fiber, a dishcloth, a film and a hollow vessel.

    ELECTROMAGNETIC-WAVE SHIELDING MATERIAL AND ITS MANUFACTURE
    74.
    发明专利
    ELECTROMAGNETIC-WAVE SHIELDING MATERIAL AND ITS MANUFACTURE 失效

    公开(公告)号：JPS61253373A

    公开(公告)日：1986-11-11

    申请号：JP9448785

    申请日：1985-04-30

    申请人： CHIHIRO KOGYO KK

    发明人： SHIBATA KOHACHI

    IPC分类号： H01B5/14 ,  B32B7/02 ,  B32B15/09 ,  C23C18/20 ,  C23C18/22 ,  H01B13/00 ,  H01P11/00 ,  H05K9/00

    摘要： PURPOSE:To obtain an electromagnetic-wave shielding material having various uses and high practicality by pretreating a polyester substrate with a solvent such as methyl ethyl ketone, roughening the surface of the substrate with acidic and alkaline etching solns. and plating the surface with copper or the like by direct electroless plating. CONSTITUTION:A polyester substrate is pretreated with one ore more kinds of solvents selected among methyl ethyl ketone, methanol and acetone to remove a fiber bundling agent from the substrate. The substrate is washed, degreased with alkali and washed, and the surface of the substrate is successively roughened with acidic and alkaline etching solns. The substrate is then neutralized and washed, and after catalyst deposition and activation are carried out as usual, the roughened surface is plated with a metal for shielding having high electric conductivity such as copper by direct electroless plating. Thus, an electromagnetic-wave shielding material is obtd. from a polyethylene terephthalate fabric or other fibrous material.

    PRODUCTION OF SURFACE-METALLIZED THERMOPLASTIC POLYESTER RESIN MOLDING
    75.
    发明专利
    PRODUCTION OF SURFACE-METALLIZED THERMOPLASTIC POLYESTER RESIN MOLDING 失效

    公开(公告)号：JPS61253371A

    公开(公告)日：1986-11-11

    申请号：JP9379685

    申请日：1985-05-02

    申请人： TORAY INDUSTRIES

    发明人： NAKAMURA SEIICHI ,  INOUE SHUNEI ,  YONETANI KIICHI

    IPC分类号： C23C18/16 ,  B32B15/09 ,  C08L67/00 ,  C23C18/22 ,  C25D5/56

    摘要： PURPOSE:To produce the titled molding having good flame retardance and mechanical properties by subjecting the molding of a thermplastic polyester contg. a specific ratio each of a filler and org. halogen flame retardant to a surface roughening treatment with an acidic chromic acid soln. and alkaline soln. then to plating. CONSTITUTION:The molding formed by incorporating 5-250pts.wt. filler such as antimony oxide and 3-80pts.wt. org. halogen flame retardant such as bis(2.4- dichlorophenyl)ether into 100pts.wt. thermoplastic polyester obtd. by the condensation polymn. of a carboxylic acid component of which about >=90mol% is a terephthalic acid and diol component is molded. Such molding is subjected to a dipping treatment for about 0.25-60min at about 5-95 deg.C with the acidic chromic acid soln. consisting essentially of a chromic compd. having hexad valency, sulfuric acid and water, then to a dipping treatment for about 1-120min at about 5-95 deg.C with the alkaline soln. such as potassium hydroxide, by which the surface is roughened. The molding is then subjected to a plating treatment, by which the molding having the excellent adhesive power of the plating film is obtd.

    Method for forming chemical plating on insulator
    77.
    发明专利
    Method for forming chemical plating on insulator 失效
    在绝缘体上形成化学镀层的方法

    公开(公告)号：JPS61124577A

    公开(公告)日：1986-06-12

    申请号：JP24319684

    申请日：1984-11-20

    申请人： Oki Electric Ind Co Ltd

    发明人： KISANUKI KENICHI

    IPC分类号： C23C18/18 ,  C23C18/22

    CPC分类号： C23C18/22

    摘要： PURPOSE:To form a chemical plating layer having high adhesive power on an insulator by roughening chemically the surface of the adhesive agent layer deposited on the surface of an insulator and grinding the surface to the surface of an insulator and grinding the surface to the extent of not occluding gas then executing chemical plating. CONSTITUTION:The adhesive agent layer 12 such as phenolic 'sumilite(R)' resin is deposited on the surface of the insulator 11 provided on a metallic plate 10. The surface of the layer 12 is then chemically roughened by using chromic acid mixture, etc. The chemically roughened surface is then ground by brushing to the surface condition to the extent of not occluding the gas such as hydrogen generated in the stage of chemical plating in the surface, more particularly the recessed part of the layer 12. The chemical plating layer 13 having the high adhesive strength to obviate blistering is formed on the insulator 11.

    摘要翻译： 目的：通过化学方法将沉积在绝缘体表面上的粘合剂层的表面进行化学处理，在绝缘体上形成具有高粘合力的化学镀层，并将其表面研磨到绝缘体的表面，并将表面研磨至 不堵塞气体，然后进行化学镀。 构成：在金属板10上设置的绝缘子11的表面上沉积有酚醛树脂等粘合剂层12，然后通过使用铬酸混合物等将层12的表面进行化学粗化 然后，将化学粗糙化表面通过刷到表面状态进行研磨，使其不吸收在表面的化学镀层阶段，特别是层12的凹陷部分中产生的氢气等气体。化学镀层 在绝缘体11上形成具有高粘结强度以消除气泡的13。

    METHOD FOR PLATING POLYESTER RESIN
    80.
    发明专利
    METHOD FOR PLATING POLYESTER RESIN 失效

    公开(公告)号：JPS60121273A

    公开(公告)日：1985-06-28

    申请号：JP22953983

    申请日：1983-12-05

    申请人： OKUNO CHEM IND CO

    发明人： KITA TOSHIYUKI ,  SATOU KAZUYA ,  KAWAGISHI SHIGEMITSU

    IPC分类号： C23C18/22

    摘要： PURPOSE:To form a layer having superior adhesive strength and preventing blister or peeling on polyester resin by performing etching treatment for pretreating with a soln. of a heterocyclic carbonate and a soln. of a fluorine compound before plating the resin. CONSTITUTION:When a molded article of polyester resin is electroplated through a electroless plating stage, the surface to be plated is pretreated. The article is first degreased and washed by a conventional method, and it is etched. The etching is carried out by bringing the article into contact with a soln. of a heterocyclic carbonate such as heterocyclic alkylene carbonate or water a lower alcohol such as methanol or ethanol and succesively with an aqueous soln. of hydrofluoric acid, acidic ammonium fluoride or the like having 100-300g/l concn. The article is then sensitized and activated as usual, and it is electroplated through an electroplating stage. A high quality layer having superior adhesive strength can be formed by plating.