Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a plated product having a surface-plating layer formed from tin or a tin alloy, which inhibits the production of whiskers while keeping the surface quality adequate. SOLUTION: This manufacturing method comprises the steps of: continuously forming the surface-plating layer formed from tin or a tin alloy on the surface of a tape of a substrate made from an electroconductive metal, while moving the tape in a longitudinal direction; and heating the tape by irradiating the surface-plating layer with a laser beam while subsequently moving the tape in the longitudinal direction. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of electronic parts excellent in solder run-up preventing property. SOLUTION: On the manufacturing method of electronic components like a connector 1 having a terminal part 2 and contact part 3 to be soldered, laser beam is irradiated on a plated surface layer formed between the terminal part 2 and the contact part 3 in an aerial atmosphere with increased oxygen density, after forming the plated surface layer on a base plate made of conductive metal material at least at the contact part 3. By the above, an alloy layer is formed by diffusing the metal constituting the plated surface layer to lower side thereof, and a metal oxide layer is formed on the surface of the alloy layer. The plated surface layer is cut at the oxidized area 4 on which the metal oxide layer is formed. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a plated product with excellent slidability, in which a plating film is formed on a substrate comprising a conductive metal.SOLUTION: The plated product is provided, in which a plating film is formed on a substrate comprising a conductive metal, wherein a porous plating layer is formed on the substrate, while the surface of the plating film has a number of pores, and also the pores are filled with lubricative particles by blasting. Preferably, the porous plating layer includes Ni or Cu as the main component. Also, a mean diameter of the pore is preferably 0.2-20 μm in area weighted average efficiency.
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a galvanized film which has fine appearance, and in which the generation of defects is suppressed, and which has satisfactory corrosion resistance and adhesion, on the surface of a base material composed of magnesium or a magnesium alloy. SOLUTION: In the method for producing a product composed of magnesium or a magnesium alloy, an anodized film or a conversion-treated film is formed on the surface of a base material composed of magnesium or a magnesium alloy, the same is then dipped into a galvanizing bath, and oxidation-reduction reaction is progressed between the anodized film or conversion-treated film and zinc ions, thus a galvanized film is formed. COPYRIGHT: (C)2006,JPO&NCIPI