Abstract:
PROBLEM TO BE SOLVED: To provide an electrode production method capable of easily producing an electrode which has a specific surface shape, for example, suitable for having chiral selectivity formed.SOLUTION: The electrode production method for producing an electrode which has a specific surface shape formed on the surface thereof is provided, wherein while allowing rotation of an electrolysis tank 6 in the counterclockwise direction or in the clockwise direction around the axis of rotation arranged parallel to the direction of a magnetic field B generated by a magnet, electrolysis is performed by applying at least one of voltage and current through an electrolytic medium to a pair of electrodes 71 and 72 arranged in the electrolysis tank 6 so as to rotate around the axis of rotation with the electrolysis tank 6.
Abstract:
PROBLEM TO BE SOLVED: To provide a barrel plating apparatus capable of preventing the occurrence of the burning of a plated film formed on the surface of a material to be plated by preventing the occurrence of a gap between the material-to-be-plated housed in a drum and a rod-like conductive member which causes the formation of a high current density part. SOLUTION: The barrel plating apparatus is provided with the cylindrical drum 2 dipped in a plating solution in a horizontal state and housing the material to be plated, a supporting member 6 for supporting the drum 2 rotatable, a driving mechanism 5 for rotatively driving the drum 2 and a center bar 3 arranged coaxially with the drum 2 and connected to an axial rod 26B integrally rotating with the drum 2. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a fixture for electroplating with which, in the object to be plated, plating of parts other than a face to be plated can be securely prevented, and whose performance, reliability or the like can be improved. SOLUTION: The air in a space part S surrounded by first and second insulation plates 10, 20, an inside seal 40, and an outside seal 50 is sucked by a pump P through an air suction passage 60. In this way, the space part S is held to a negative pressure state, the whole of the inside seal 40 is made to abut against a wafer W with uniform pressing force (facial pressure), and further, the whole of the outside seal 50 is made to abut against the second insulator 20 with uniform pressing force (plane pressure). COPYRIGHT: (C)2006,JPO&NCIPI