公开(公告)号：JP2019021832A

公开(公告)日：2019-02-07

申请号：JP2017140849

申请日：2017-07-20

申请人： NIPPON MEKTRON KK

发明人： MISHIMA KENICHI

IPC分类号： H05K13/04 ,  H05K13/08

摘要： 【課題】LEDパッケージにおける蛍光体の位置を精度良く算出することが可能な基板位置認識装置、位置認識加工装置および基板製造方法を提供する。【解決手段】作動時に蛍光発光する蛍光体32を備えるLEDパッケージ30の基板20における実装位置を認識する基板位置認識装置であって、基板20に対して青色成分を含む光を照射する照明手段101と、基板20からの反射光および蛍光体32からの蛍光のうち少なくとも青色光を選択的に取り出すと共に、その青色光よりも長波長領域の光はカットする観察フィルタ102と、観察フィルタ102により取り出された光を撮像する撮像手段103と、撮像手段103が撮像した画像データD10に基づいて、基板20における蛍光体の位置を算出する画像処理手段200と、を備えている。【選択図】図1

公开(公告)号：JP2019001148A

公开(公告)日：2019-01-10

申请号：JP2018026015

申请日：2018-02-16

申请人： NIPPON MEKTRON KK

发明人： SHIGEOKA TAKESHI

IPC分类号： B41F15/40 ,  B41F15/08 ,  B41F15/44 ,  H05K3/12

摘要： 【課題】端面の平坦性や印刷版側のパターン等に応じて被印刷面への当接状態を任意に調整可能なスキージを提供する。【解決手段】基材上にインクペーストを塗布するスキージ2を構成する。この際、印刷版に当接しながら移動する当接部200を有するスキージ板20と、スキージ板20のうち印刷版の少なくとも印刷領域に当接する範囲の複数の個所において、スキージ板20にかかる単位荷重当たりの変形量を調整するスキージ板保持具23及び止ネジ25を設ける。【選択図】図2

公开(公告)号：JP2006222330A

公开(公告)日：2006-08-24

申请号：JP2005035538

申请日：2005-02-14

申请人： NIPPON MEKTRON KK

发明人： MATSUDA FUMIHIKO

IPC分类号： H05K3/46

摘要： PROBLEM TO BE SOLVED: To provide a multilayer flexible wiring circuit board which can realize compatibility between secured through-hole connection reliability and the formation of a fine pattern on a surface layer, and also to provide a method for manufacturing the board. SOLUTION: An inner layer substrate having a cable structure is formed, and a cover as a cable protection layer is formed to the inner layer substrate, and a first conducting hole is formed in the inner layer substrate including the cover. A conductive paste is filled in the first conduction hole to form an interlayer connection part of the conductive paste, a previously-die-cut single sided copper clad laminate and an adhesive are positioned and stacked on the inner layer substrate. A second conducting hole is formed along the coaxial line of the first conducting hole therein to form a through-hole having a diameter smaller than the interlayer connection part of the concentrically-remaining conductive paste along the coaxial line of the interlayer connection part. The second conducting hole is electrolessly plated and/or subjected to conductive treatment and electroplating to form the through-hole in the interlayer connection part of the conductive paste along its coaxial line. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2003165802A

公开(公告)日：2003-06-10

申请号：JP2001364674

申请日：2001-11-29

申请人： NIPPON MEKTRON KK

发明人： KANEGA ATSUSHI ,  ENOKIDA TAKASHI

IPC分类号： C08J5/00 ,  C08F2/10 ,  C08F214/16 ,  C08F214/18

摘要： PROBLEM TO BE SOLVED: To provide a method for producing a fluorine-containing copolymer excellent in light transmission and heat discoloring resistance it for a long time in a high temperature. SOLUTION: This method for producing the fluorine-containing copolymer by performing a radical copolymerization reaction of at least 2 kinds of fluorine- containing monomers is provided by heating a halogenated fluoroalkyl compound and a polymerization initiator which can transfer a radical to the fluoroalkyl compound at 40-100°C in an aqueous medium, then adding fluorine-containing monomers in the reaction system and forming the fluorine-containing copolymer. Since the fluorine-containing copolymer is excellent in heat yellowing resistance, the coloration is extremely little and also since it is excellent in light transmission, it is suitably used as a molding material for various members in fields such as semiconductor and electric/electronic fields. COPYRIGHT: (C)2003,JPO

公开(公告)号：JP2003142823A

公开(公告)日：2003-05-16

申请号：JP2001341977

申请日：2001-11-07

申请人： NIPPON MEKTRON KK

发明人： MATSUDA FUMIHIKO

IPC分类号： H05K3/42

摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method for a both-sided flexible circuit board which can process an insulating base material by a resin etching method and suitably form a hole for conduction needed for via hole formation. SOLUTION: A material composed of two layers of an insulating base material 2 and adhesive polyimide 3 which differ in etching resistance is used as the insulating base material, and the hole 6 for conduction is formed by resin etching using a conductor layer on a higher etching-resistance side as a conformal mask.

公开(公告)号：JP2003133699A

公开(公告)日：2003-05-09

申请号：JP2001325950

申请日：2001-10-24

申请人： NIPPON MEKTRON KK

发明人： TOYOSHIMA RYOICHI

IPC分类号： H05K3/28 ,  H05K3/24

摘要： PROBLEM TO BE SOLVED: To provide a surface protection layer forming method capable of suitably forming a surface protection layer for a circuit board correspondingly to the fining of a circuit wiring pattern. SOLUTION: A required circuit wiring pattern 2 is formed on an insulating substrate 1, and a removable conductive metallic layer 3 is formed on the whole upper surface of the board 1. After forming an electrodeposition lead by removing an unnecessary metallic layer 3 in a state coating a part independent of the pattern 2 with a mask 4, a surface protection layer 8 is formed on the surface of the pattern 2 by an electrodeposition means in a state leaving an aperture necessary for the pattern 2.

公开(公告)号：JP2003105320A

公开(公告)日：2003-04-09

申请号：JP2001301308

申请日：2001-09-28

申请人： NIPPON MEKTRON KK

发明人： WATANABE TETSUYA ,  YOKOYAMA TAKASHI

IPC分类号： F16J15/14 ,  C08F290/06 ,  C09K3/10

摘要： PROBLEM TO BE SOLVED: To provide a method for producing a gasket for precision instruments, realizing sufficient sealing properties and producible at a high productivity by using an X-Y-Z axes coating robot. SOLUTION: The gasket is obtained by discharging a liquid gasket material on the surface of a substrate in stringy state with an X-Y-Z axes coating robot, curing the liquid gasket material by irradiating it with an active energy ray to obtain the gasket, wherein fluidity of the gasket material increases in dynamic state, that is, when stress is applied, but high viscosity is kept in static state, in other word, the material has extremely high thixotropy. Thereby, the liquid gasket material is effectively discharged on the surface of the substrate from the nozzle of the X-Y-Z axes coating robot at a high productivity to keep the ideal form the cross section of the discharged liquid gasket material and so as the gasket having sufficient sealing activity is produced at a high productivity.

公开(公告)号：JP2002353592A

公开(公告)日：2002-12-06

申请号：JP2001162359

申请日：2001-05-30

申请人： NIPPON MEKTRON KK

发明人： MATSUDA FUMIHIKO

IPC分类号： H05K1/02 ,  H05K3/00

摘要： PROBLEM TO BE SOLVED: To provide a method for producing a double-sided flexible circuit board, in which insulation base material can be machined and a conduction hole for making a through-hole conducting part can be formed preferably through resin etching or plasma etching method. SOLUTION: A conduction hole 8 required for conducting conductor layers 4 and 5 on the opposite sides of an insulation base material 1 and a non- penetration groove 9 for enhancing bendability are formed simultaneously by plasma etching or wet etching the insulation base material 1. A through-hole conducing part 12 is formed for the conduction hole 8 and then a required circuit wiring pattern 13 is formed.

公开(公告)号：JP2002353591A

公开(公告)日：2002-12-06

申请号：JP2001162358

申请日：2001-05-30

申请人： NIPPON MEKTRON KK

发明人： MATSUDA FUMIHIKO

IPC分类号： B23K26/382 ,  B23K101/42 ,  H05K3/00 ,  H05K3/42 ,  B23K26/00

摘要： PROBLEM TO BE SOLVED: To provide a method for producing a circuit board in which fine holes for conduction can be bored efficiently. SOLUTION: A resist layer 3 is provided on an insulation base material 1, and only a desired part thereof is machined thin through plasma etching or wet etching. A conduction hole 7 is then bored at a specified position of the insulating base material 4 machined thin through plasma etching, wet etching or laser machining means.

公开(公告)号：JP2002344133A

公开(公告)日：2002-11-29

申请号：JP2001142726

申请日：2001-05-14

申请人： NIPPON MEKTRON KK

发明人： MATSUDA FUMIHIKO

IPC分类号： H05K3/42 ,  H05K3/00

摘要： PROBLEM TO BE SOLVED: To provide a manufacturing method of a double-sided flexible circuit board easy to form a minute conductive through-hole layer necessary for the minute double-sided flexible circuit board with high resolution. SOLUTION: One conductive layer 3 from conductive layers 2 and 3 on both sides of an insulating layer 1 is half-etched, and a conductive hole 6 is formed in the insulating layer 1 by using the opening 5 formed in the other conductive layer 2. After a thinned conductive layer 4 is protected with a resist layer 7, the other conductive layer 2 is half-etched, and at the same time the conductive layer 4 exposed at the bottom of the conductive hole 6 is removed by etching to form a conductive hole 9.