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公开(公告)号：JP5656491B2
公开(公告)日：2015-01-21
申请号：JP2010158541
申请日：2010-07-13
IPC: H01M2/10
CPC classification number: H01M2/02 , H01M2/0202 , H01M2/0207 , H01M2/0257 , H01M2/0267 , H01M2/0275 , H01M2/0473 , H01M2/0482 , Y10T29/49108 , Y10T29/49112
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公开(公告)号：JP5647034B2
公开(公告)日：2014-12-24
申请号：JP2011046345
申请日：2011-03-03
IPC: H01M2/10
CPC classification number: H01M10/0436 , B21H3/02 , C23F3/06 , H01M2/0404 , H01M10/052 , H01M10/30 , H01M10/637 , Y10T29/49108
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公开(公告)号：JP5522856B2
公开(公告)日：2014-06-18
申请号：JP2011181144
申请日：2011-08-23
Applicant: 三星エスディアイ株式会社Samsung SDI Co.,Ltd.
Inventor： 雲成 白
IPC: H01M2/10
CPC classification number: H01M2/0404 , H01M2/0473 , H01M2/0478 , H01M2/0482 , H01M2/10 , H01M10/0431 , H01M10/425
Abstract: A battery pack comprises a bare cell including a cap plate, a protection circuit module mounted to the cap plate and cover means mounted to the cap plate for covering the protection circuit module, wherein the cover means comprises side wall portions and end portions at respective ends of the sidewall portions, wherein the side wall portions comprise a first material and one or both of the end portions comprise a resilient end portion, the resilient end portion comprising a second material that is more resilient than the first material.
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公开(公告)号：JP5258813B2
公开(公告)日：2013-08-07
申请号：JP2010037259
申请日：2010-02-23
Applicant: 三星エスディアイ株式会社Samsung SDI Co.,Ltd.
Inventor： 雲成 白
IPC: H01M2/10
CPC classification number: H01M2/1061 , H01M2/0207 , H01M2/0267 , H01M10/0436 , H01M10/425
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