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13 条记录 (耗时 0.028 秒)

    Method of producing a carbon fiber structure
    2.
    发明专利
    Method of producing a carbon fiber structure 有权

    公开(公告)号：JP5054915B2

    公开(公告)日：2012-10-24

    申请号：JP2005336293

    申请日：2005-11-21

    申请人： 保土谷化学工業株式会社

    发明人： 佳義 単 ,  高行 塚田 ,  史典 宗兼 ,  宏輔 河口

    IPC分类号： D01F9/127 ,  C01B31/02

    CPC分类号： D01F9/127 ,  B82Y30/00

    摘要： Disclosed is a method for manufacturing carbon fibrous structures each of which comprises a three dimensional network of carbon fibers, which is characterized in that , in the procedure of carbon fiber vapor phase deposition utilizing decomposition of organic carbon compound, at least two kinds of organic carbon compounds as carbon sources are in existence at least at predetermined thermal decomposition reaction temperature range in a reaction furnace and partial pressures of gases of these compounds are regulated so that these compounds are decomposed at mutually different decomposition temperatures, and/or a raw material gas supplied into the reaction furnace is forced to form a turbulent flow. It is possible to obtain efficiently the carbon fibrous structures each of which comprises a three dimensional network of carbon fibers and which are suitable as additives to be added to solid materials, such as resin, ceramics, metal, etc., to improve physical properties, such as electric, mechanical, or thermal properties, of the solid materials, and also as additives to be added to liquid materials, such as fuels, lubricant oils, and etc., to improve physical properties, such as thermal property, of the liquid materials.

    Fine carbon fiber structure
    7.
    发明专利
    Fine carbon fiber structure 有权

    公开(公告)号：JP4847164B2

    公开(公告)日：2011-12-28

    申请号：JP2006064102

    申请日：2006-03-09

    申请人： 保土谷化学工業株式会社

    发明人： 佳義 単 ,  高行 塚田 ,  史典 宗兼

    IPC分类号： D01F9/127 ,  C01B31/02

    CPC分类号： D01F9/12 ,  B82Y30/00 ,  D01F9/127 ,  D01F9/1272 ,  D01F9/1276 ,  D01F9/133 ,  Y10T428/249924 ,  Y10T428/2918 ,  Y10T428/30

    摘要： Disclosed is a fine carbon fibrous structure which comprises carbon fibers and granular parts, wherein at least two granular parts connect by at least one of the carbon fibers; wherein the fine carbon fibrous structure have a D 2 /D 1 ratio of 1.3 to 10, wherein the D 1 is the median diameter of outer diameters of the carbon fibers and the D 2 is the area-based circle-equivalent median diameter of the particles; wherein the granular parts have a D 2 of 0.05 to 0.4 µm; wherein the carbon fibers have a median length of not more than 20 µm; wherein the granular parts are produced in a growth process of the carbon fibers; and wherein at least a graphene layer which exists on and constitutes the surface of each granular part is continued on a graphene layer which exists on and constitutes the surface of the carbon fiber which connects between the granular parts.

    Ceramic substrate and its manufacturing method for electronic components
    9.
    发明专利
    Ceramic substrate and its manufacturing method for electronic components 有权

    公开(公告)号：JP5322199B2

    公开(公告)日：2013-10-23

    申请号：JP2007265240

    申请日：2007-10-11

    申请人： 日産自動車株式会社 ,  吉田 誠 ,  千利 増田 ,  保土谷化学工業株式会社

    发明人： 昌樹 久野 ,  宏規 坂元 ,  裕 馬久地 ,  吉田　　誠 ,  千利 増田 ,  高行 塚田 ,  久雄 魚住

    IPC分类号： H01L23/373

    CPC分类号： H01L2224/32225

    摘要： PROBLEM TO BE SOLVED: To provide a ceramic substrate for electronic components, which reduces a coefficient of thermal expansion and reduces thermal stress at an interface between a wiring layer and the ceramic substrate, while assuring thermal conductivity and electric conductivity both required for the wiring layer, and to provide a method for manufacturing the same. SOLUTION: The ceramic substrate 1 for electronic components includes a ceramic substrate 10 and a wiring layer 20 arranged on a surface of the ceramic substrate 10. The wiring layer 20 is composed of a complex material containing granular carbon phase 23, fine carbon fiber 22 and electric conductive base material 21. A carbon nanotube 22 and the granular carbon phase 23 are joined to form a three dimensional network-like structure. In the wiring layer 20, as shown by an arrow sign (a), heat and current form continuous paths in a thickness direction T of the wiring layer 20. COPYRIGHT: (C)2009,JPO&INPIT