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Patent Agency Ranking
公开(公告)号：JP3858577B2
公开(公告)日：2006-12-13
申请号：JP2000271889
申请日：2000-09-07
Applicant: 株式会社デンソー
CPC classification number: H01L2224/48091 , H01L2224/8592 , H01L2924/00014
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公开(公告)号：JP3591425B2
公开(公告)日：2004-11-17
申请号：JP2000128260
申请日：2000-04-27
Applicant: 株式会社デンソー
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/8592 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
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公开(公告)号：JP5292687B2
公开(公告)日：2013-09-18
申请号：JP2006278426
申请日：2006-10-12
Applicant: 株式会社デンソー
CPC classification number: G01L13/025 , G01L19/0627 , G01L19/141 , H01L2224/48091 , H01L2224/73265 , H01L2924/10155 , H01L2924/16151 , H01L2924/00014
Abstract: The sensor (100) has a housing (10) made of resin, and a detection chip (20) attached to the housing for detecting pressure applied to the detection chip. A protection material (40) is arranged in the housing such that the material covers the chip. The housing has edges (18a, 18b) that stand in contact with the protection material and are rounded down such that the edges comprise a curve radius of 0.5 millimeter. The housing has a chip attachment (11) for attaching the chip, where the chip has two detecting surfaces (20a, 20b).
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公开(公告)号：JP3858927B2
公开(公告)日：2006-12-20
申请号：JP2005098679
申请日：2005-03-30
Applicant: 株式会社デンソー
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/8592 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
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