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公开(公告)号：JP2013163221A
公开(公告)日：2013-08-22
申请号：JP2013097057
申请日：2013-05-02
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： ANADA TAKAAKI , KASHIWAGI SHINICHIRO , KUMAMOTO SATOSHI
IPC: B23K35/363 , B23K1/00 , B23K35/26 , B23K101/42 , C22C13/00 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux capable of suppressing coloring of a flux residue after soldering and generation of a crack state due to many cracks while containing a rosin resin as a base resin, and securing visibility in visual inspection even in a non-cleaning state, and to provide a soldering paste composition using it.SOLUTION: A soldering flux is an non-cleaning flux containing a rosin resin as the base resin and an anti-oxidant, and has 30 wt.% or less of percentage content of abietic acid type fatty acid having conjugated double bond contained in the rosin resin, wherein the anti-oxidant is pentaerythritol tetrakis [3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate].
Abstract translation: 要解决的问题：提供一种能够抑制焊接后的焊剂残留物的着色以及由于在含有松香树脂作为基础树脂的情况下由于许多裂纹而产生裂纹状态的助焊剂，并且即使在非检测中也可以确保目视检查的可视性， 清洗状态，并提供使用它的焊膏组合物。溶解剂：助焊剂是含有松香树脂作为基础树脂和抗氧化剂的非清洁助焊剂，并且具有30重量％以下的含量 松香树脂中含有共轭双键的松香酸型脂肪酸，其中抗氧化剂是季戊四醇四[3-（3,5-二叔丁基-4-羟基苯基）丙酸酯]。
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Patent Agency Ranking
公开(公告)号：JP2011173173A
公开(公告)日：2011-09-08
申请号：JP2011117261
申请日：2011-05-25
Applicant: Harima Chemicals Inc , ハリマ化成株式会社
Inventor： ANADA TAKAAKI , KASHIWAGI SHINICHIRO , KUMAMOTO SATOSHI
IPC: B23K35/363 , B23K35/26 , C22C13/00 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux capable of suppressing coloring of flux residues after the soldering and occurrence of any cracked state caused by a large number of cracks, and ensuring the visibility during the visual inspection even in a non-cleaned state while a rosinous resin is contained as a base resin, and a solder paste composition using the same. SOLUTION: The soldering flux is a non-cleaning flux containing rosin-based resin as the base resin, wherein the percentage content of an abietic acid type resinous acid having conjugate double bonds contained in the rosin-based resin is 2-5 wt.%. The rosin-based resin is preferably one or more kinds selected from the group composed of a hydrogenated rosin and a disproportionated rosin. The solder paste composition contains the above flux and solder alloy powder. The above flux or the soldering paste composition preferably contains an oxidation inhibitor. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种能够抑制焊接后的焊剂残留物的着色以及由大量裂纹引起的任何破裂状态的发生的助焊剂，并且即使在非易失性存储器中也能确保目视检查期间的可视性， 作为基础树脂含有松香性树脂时的清洗状态，以及使用其的焊膏组合物。 焊剂是含有松香系树脂作为基础树脂的非清洁助熔剂，其中松香类树脂中含有共轭双键的松香型树脂酸的含量百分含量为2-5 重量％。 松香系树脂优选为选自由氢化松香和歧化松香组成的组中的一种以上。 焊膏组合物含有上述焊剂和焊料合金粉末。 上述焊剂或焊膏组合物优选含有氧化抑制剂。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2008062240A
公开(公告)日：2008-03-21
申请号：JP2006239286
申请日：2006-09-04
Applicant: Harima Chem Inc , ハリマ化成株式会社
Inventor： KASHIWAGI SHINICHIRO , AIHARA MASAMI
IPC: B23K35/22 , B23K35/363 , H05K3/34
Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition, wherein printability and sag resistance (during printing and leaving as it is) can be developed at very high level. SOLUTION: This solder paste composition is a solder paste composition contains solder powder and a flux. The flux contains fatty acid triamide as a thixotropy agent, which is obtained by using C14-22 fatty acid (A), C14-22 hydroxy fatty acid (B) and triamine compound (C) as a starting material. It is preferable that the fatty acid triamide is a material obtained by making the fatty acid (A) of 1.5-2.5 mol and the hydroxy fatty acid (B) of 0.5-1.5 mol react to the triamine compound (C) of 1 mol and it is preferable that the content of the fatty acid triamide is 0.5-40 wt.% of the total content of the flux. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种焊膏组合物，其中可印刷性和抗流挂性（在印刷和离开期间）可以以非常高的水平开发。
解决方案：该焊膏组合物是含有焊料粉末和焊剂的焊膏组合物。 助熔剂含有以C14-22脂肪酸（A），C14-22羟基脂肪酸（B）和三胺化合物（C）为起始原料得到的作为触变剂的脂肪酸三酰胺。 优选脂肪酸三酰胺是通过使脂肪酸（A）为1.5〜2.5摩尔，羟基脂肪酸（B）为0.5〜1.5摩尔与1摩尔的三胺化合物（C）反应而得到的材料， 脂肪酸三酰胺的含量优选为助焊剂总量的0.5〜40重量％。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008062239A
公开(公告)日：2008-03-21
申请号：JP2006239285
申请日：2006-09-04
Applicant: Harima Chem Inc , ハリマ化成株式会社
Inventor： ANADA TAKAAKI , KASHIWAGI SHINICHIRO , KUMAMOTO SATOSHI
IPC: B23K35/363
Abstract: PROBLEM TO BE SOLVED: To provide a soldering flux with which the coloring of flux residue and the occurrence of crazing state due to multiple cracks after soldering can be suppressed though the flux contains a rosinous resin as a base resin and the visibility in visual inspection can be secured even in an uncleaned state, and to provide a solder paste composition using the same. SOLUTION: The soldering flux is a non-cleaning flux which contains rosinous resin as the base resin, wherein the percentage content of an abietic acid type resinous acid having conjugate double bonds which are contained in the rosinous resin is ≤ 30 wt.%. It is preferable that the rosinous resin is one or more selected from the group composed of hydrogenated rosin and disproportionated rosin. The solder paste composition contains the above flux and solder powder. It is preferable that the flux or the soldering paste composition contains an oxidation inhibitor. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种助焊剂，其中通过含有松香树脂作为基础树脂，可以抑制助焊剂残留物的着色和焊接后的多次裂纹引起的焊接状态的发生，并且可见度 即使在未清洁状态下也可以确保目视检查，并提供使用其的焊膏组合物。 焊剂是含有松香树脂作为基础树脂的非清洁助焊剂，其中松香树脂中含有的具有共轭双键的松香酸树脂酸的含量百分含量≤30重量％。 ％。 优选所述松香树脂是选自由氢化松香和歧化松香组成的组中的一种或多种。 焊膏组合物含有上述焊剂和焊料粉末。 焊剂或焊膏组合物优选含有氧化抑制剂。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2010269356A
公开(公告)日：2010-12-02
申请号：JP2009124606
申请日：2009-05-22
Applicant: Harima Chem Inc , Sharp Corp , シャープ株式会社 , ハリマ化成株式会社
Inventor： SAKOTA NAOKI , AIHARA MASAMI , KASHIWAGI SHINICHIRO
Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition which can achieve an extremely high level of printability and bleeding suppression effect (even after continuous printing) without causing degradation of stability during storage and solder bonding failure. SOLUTION: The solder paste composition is characterized by containing solder alloy powder, thermoplastic resin powder with a lower melting temperature than the solder alloy and flux. The solder paste composite is effective in bringing the extremely high level of printability and bleeding suppression effect during continuous printing, without causing the degradation of stability during storage, the solder bonding failure, and rejection at an appearance inspection. COPYRIGHT: (C)2011,JPO&INPIT
Abstract translation: 要解决的问题：提供一种焊膏组合物，其可以在不会导致存储和焊接失败期间的稳定性劣化的同时实现极高的可印刷性和喷出抑制效果（甚至在连续印刷之后）。 焊膏组合物的特征在于含有焊料合金粉末，熔融温度低于焊料合金和焊剂的热塑性树脂粉末。 焊膏复合物在连续印刷期间有效地提供极高的可印刷性和耐渗色抑制效果，而不会在外观检查期间导致储存期间的稳定性降低，焊接失败和拒绝。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2008110391A
公开(公告)日：2008-05-15
申请号：JP2006296556
申请日：2006-10-31
Applicant: Harima Chem Inc , ハリマ化成株式会社
Inventor： KASHIWAGI SHINICHIRO , AIHARA MASAMI , KUMAMOTO SATOSHI
Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition in which, even in a fine pitch part in the case densification in mounting further progresses from now on, satisfactorily satisifiable improvement of printing properties and reduction of bleeding are made possible.
SOLUTION: This solder paste composition comprises solder alloy powder and a flux. The flux comprises, as a lubricant, a nonionic fluorinated surfactant obtained by adding ethylene oxide to a fluorine-containing compound with a specified structure. It is preferable that the fluorinated surfactant has a molecular weight of 1,500 to 6,000 and is composed using the above compound with a specified structure by 3 to 5 mol per molecular, and, preferably, the content of the fluorinated surfactant is 0.01 to 20 wt.% to the total content of the flux.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种焊膏组合物，其中即使在安装的致密化的情况下的细间距部分从现在起进一步发展，也可以令人满意地令人满意地提高印刷性能和降低渗色。
解决方案：该焊膏组合物包含焊料合金粉末和焊剂。 作为润滑剂，助熔剂含有通过在具有规定结构的含氟化合物中添加环氧乙烷而得到的非离子性氟化表面活性剂。 优选氟化表面活性剂的分子量为1500〜6000，并且由具有特定结构的上述化合物构成，分子量为3〜5摩尔，优选氟化表面活性剂的含量为0.01〜20重量％。 ％到助焊剂的总含量。 版权所有（C）2008，JPO＆INPIT
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