公开(公告)号：JP2010269356A

公开(公告)日：2010-12-02

申请号：JP2009124606

申请日：2009-05-22

Applicant: Harima Chem Inc ,  Sharp Corp ,  シャープ株式会社 ,  ハリマ化成株式会社

Inventor： SAKOTA NAOKI ,  AIHARA MASAMI ,  KASHIWAGI SHINICHIRO

IPC: B23K35/363 ,  B23K35/14 ,  B23K35/22 ,  B23K35/26 ,  C22C11/06 ,  C22C12/00 ,  C22C13/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition which can achieve an extremely high level of printability and bleeding suppression effect (even after continuous printing) without causing degradation of stability during storage and solder bonding failure. SOLUTION: The solder paste composition is characterized by containing solder alloy powder, thermoplastic resin powder with a lower melting temperature than the solder alloy and flux. The solder paste composite is effective in bringing the extremely high level of printability and bleeding suppression effect during continuous printing, without causing the degradation of stability during storage, the solder bonding failure, and rejection at an appearance inspection. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊膏组合物，其可以在不会导致存储和焊接失败期间的稳定性劣化的同时实现极高的可印刷性和喷出抑制效果（甚至在连续印刷之后）。 焊膏组合物的特征在于含有焊料合金粉末，熔融温度低于焊料合金和焊剂的热塑性树脂粉末。 焊膏复合物在连续印刷期间有效地提供极高的可印刷性和耐渗色抑制效果，而不会在外观检查期间导致储存期间的稳定性降低，焊接失败和拒绝。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2008062240A

公开(公告)日：2008-03-21

申请号：JP2006239286

申请日：2006-09-04

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： KASHIWAGI SHINICHIRO ,  AIHARA MASAMI

IPC: B23K35/22 ,  B23K35/363 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition, wherein printability and sag resistance (during printing and leaving as it is) can be developed at very high level. SOLUTION: This solder paste composition is a solder paste composition contains solder powder and a flux. The flux contains fatty acid triamide as a thixotropy agent, which is obtained by using C14-22 fatty acid (A), C14-22 hydroxy fatty acid (B) and triamine compound (C) as a starting material. It is preferable that the fatty acid triamide is a material obtained by making the fatty acid (A) of 1.5-2.5 mol and the hydroxy fatty acid (B) of 0.5-1.5 mol react to the triamine compound (C) of 1 mol and it is preferable that the content of the fatty acid triamide is 0.5-40 wt.% of the total content of the flux. COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊膏组合物，其中可印刷性和抗流挂性（在印刷和离开期间）可以以非常高的水平开发。

解决方案：该焊膏组合物是含有焊料粉末和焊剂的焊膏组合物。 助熔剂含有以C14-22脂肪酸（A），C14-22羟基脂肪酸（B）和三胺化合物（C）为起始原料得到的作为触变剂的脂肪酸三酰胺。 优选脂肪酸三酰胺是通过使脂肪酸（A）为1.5〜2.5摩尔，羟基脂肪酸（B）为0.5〜1.5摩尔与1摩尔的三胺化合物（C）反应而得到的材料， 脂肪酸三酰胺的含量优选为助焊剂总量的0.5〜40重量％。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006035259A

公开(公告)日：2006-02-09

申请号：JP2004218318

申请日：2004-07-27

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  AIHARA MASAMI ,  INOUE TAKASUKE ,  KUMAMOTO SATOSHI

IPC: B23K35/22 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To obtain a solder paste for forming a soldered joint that excels in durability including cold cycle resistance and crack resistance.
SOLUTION: This solder paste contains a flux containing thermosetting resin and/or thermoplastic resin, a resin filler powder coated with a metallic layer, and a solder alloy powder. Alternatively, the solder paste contains a flux containing thermosetting resin and/or thermoplastic resin and a resin filler powder coated with a solder alloy layer.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：获得用于形成焊接接头的焊膏，其耐久性优异，包括耐冷循环性和抗裂纹性。 解决方案：该焊膏含有含热固性树脂和/或热塑性树脂的助熔剂，涂有金属层的树脂填料粉末和焊料合金粉末。 或者，焊膏包含含有热固性树脂和/或热塑性树脂的助熔剂和涂覆有焊料合金层的树脂填料粉末。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2008110391A

公开(公告)日：2008-05-15

申请号：JP2006296556

申请日：2006-10-31

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： KASHIWAGI SHINICHIRO ,  AIHARA MASAMI ,  KUMAMOTO SATOSHI

IPC: B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a solder paste composition in which, even in a fine pitch part in the case densification in mounting further progresses from now on, satisfactorily satisifiable improvement of printing properties and reduction of bleeding are made possible.
SOLUTION: This solder paste composition comprises solder alloy powder and a flux. The flux comprises, as a lubricant, a nonionic fluorinated surfactant obtained by adding ethylene oxide to a fluorine-containing compound with a specified structure. It is preferable that the fluorinated surfactant has a molecular weight of 1,500 to 6,000 and is composed using the above compound with a specified structure by 3 to 5 mol per molecular, and, preferably, the content of the fluorinated surfactant is 0.01 to 20 wt.% to the total content of the flux.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种焊膏组合物，其中即使在安装的致密化的情况下的细间距部分从现在起进一步发展，也​​可以令人满意地令人满意地提高印刷性能和降低渗色。

解决方案：该焊膏组合物包含焊料合金粉末和焊剂。 作为润滑剂，助熔剂含有通过在具有规定结构的含氟化合物中添加环氧乙烷而得到的非离子性氟化表面活性剂。 优选氟化表面活性剂的分子量为1500〜6000，并且由具有特定结构的上述化合物构成，分子量为3〜5摩尔，优选氟化表面活性剂的含量为0.01〜20重量％。 ％到助焊剂的总含量。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008062253A

公开(公告)日：2008-03-21

申请号：JP2006240229

申请日：2006-09-05

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： YAMAMOTO MASAYASU ,  SHIOMI TAKUMI ,  NAKANISHI KENSUKE ,  WATABE MASAHIRO ,  AIHARA MASAMI

IPC: B23K35/363 ,  H05K3/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  C08K5/04 ,  C08K5/1535 ,  C08K5/16

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering and a solder paste composition capable of demonstrating excellent wettability to a metal or a plating containing no lead irrespective of the kind of the metal.
SOLUTION: The flux for soldering contains a base resin and an activator. The activator contains an oxygen-containing heterocyclic compound having at least one carboxylic group in a molecule. The oxygen-containing heterocyclic compound preferably has a five-membered ring structure to be selected from a group consisting of furan, hydrofuran, and oxazole. The content of the oxygen-containing heterocyclic compound is preferably 0.1-50 wt.% to the total flux. The solder paste composition contains the flux and solder alloy powder.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供能够显示对金属的润湿性优异的焊接助焊剂和焊膏组合物，不管金属的种类如何，都不含铅。

解决方案：用于焊接的焊剂包含基础树脂和活化剂。 活化剂含有分子中具有至少一个羧基的含氧杂环化合物。 含氧杂环化合物优选具有选自呋喃，氢呋喃和恶唑的五元环结构。 含氧杂环化合物的含量相对于总通量优选为0.1〜50重量％。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2006326598A

公开(公告)日：2006-12-07

申请号：JP2005149122

申请日：2005-05-23

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： NAKANISHI KENSUKE ,  AIHARA MASAMI ,  KUMAMOTO SATOSHI

IPC: B23K35/363 ,  B23K1/00 ,  B23K35/22 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide leadless solder paste which stabilizes the joining between a circuit board and a packaged electronic component or the like, to provide a soldering method, and to provide a method for stabilizing the joining of an electronic component. SOLUTION: The leadless solder paste composition comprises flux, Sn-Ag based solder alloy powder, and at least one kind of metal powder selected from Ag powder, Sn powder and Cu powder. The content of the metal powder is ≤3 wt.% to the total of the Sn-Ag based solder alloy powder and the metal powder, and also, the average grain size of the metal powder is ≤10 μm. The soldering method and the method for stabilizing the joining of an electronic component use the paste composition. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了提供稳定电路板和封装的电子部件等之间的接合的无铅焊膏，以提供焊接方法，并提供稳定电子部件的接合的方法。 解决方案：无铅焊膏组合物包含焊剂，Sn-Ag基焊料合金粉末，以及选自Ag粉末，Sn粉末和Cu粉末中的至少一种金属粉末。 金属粉末的含量相对于Sn-Ag基焊料合金粉末和金属粉末的总量的≤3重量％，金属粉末的平均粒径也≤10μm。 用于稳定电子部件的接合的焊接方法和方法使用糊剂组合物。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005074449A

公开(公告)日：2005-03-24

申请号：JP2003306064

申请日：2003-08-29

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： INOUE TAKASUKE ,  AIHARA MASAMI ,  MORIGAMI TADAHIKO ,  FURUMOTO ATSUSHI

IPC: B23K35/363

Abstract: PROBLEM TO BE SOLVED: To provide a water-insoluble flux for soldering and a soldering paste composition suppressing the generation of minute soldering balls in the periphery of a soldering portion when soldering and having excellent storing stability and the stability in printing.
SOLUTION: The water-insoluble flux for soldering comprises a base resin, an activator, a thixotropic agent, and 0.1 to 0.4% by weight of water based on the total of organic solvents. The water-insoluble soldering paste composition comprises the above flux, and a soldering alloy powder.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供用于焊接的水不溶性助熔剂和焊锡膏组合物，其在焊接时抑制焊接部周边的微小焊锡球的产生，并且具有优异的储存稳定性和印刷稳定性。 解决方案：用于焊接的水不溶性焊剂包括基础树脂，活化剂，触变剂和基于总有机溶剂的0.1至0.4重量％的水。 水不溶性焊膏组合物包含上述助熔剂和焊接合金粉末。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2008110392A

公开(公告)日：2008-05-15

申请号：JP2006296557

申请日：2006-10-31

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： WATABE MASAHIRO ,  NAKANISHI KENSUKE ,  AIHARA MASAMI

IPC: B23K35/363 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering and a solder paste composition capable of exhibiting high corrosion resistance and excellent wettability.
SOLUTION: The flux for soldering comprises base resin, activator and anticorrosive. The anticorrosive is a mixture having a kind or not less than two kinds of imidazoline or its substitution product with an alkyl group or an alkenyl group (provided that the alkyl group or the alkenyl group may have a substituent). The alkyl group or alkenyl group substitution product of imidazoline is, for example, a compound loaded with an alkyl group or an alkenyl group originating from a saturated fatty, an unsaturated fatty acid or a dimer of the fatty acid is added. The anticorrosive constitutes 0.1-25% by weight of the total amount of the flux. The solder paste composition contains the flux and solder alloy powder.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供能够显示高耐腐蚀性和优异润湿性的用于焊接的焊剂和焊膏组合物。

解决方案：焊接助焊剂包括基础树脂，活化剂和防腐剂。 防腐蚀剂是具有一种或不少于两种咪唑啉或其具有烷基或烯基的取代产物（条件是烷基或烯基可以具有取代基）的混合物。 咪唑啉的烷基或烯基取代产物是，例如，加入负载有饱和脂肪酸，不饱和脂肪酸或脂肪酸二聚体的烷基或链烯基的化合物。 耐腐蚀剂占焊剂总量的0.1-25重量％。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008062252A

公开(公告)日：2008-03-21

申请号：JP2006240228

申请日：2006-09-05

Applicant: Denso Corp ,  Harima Chem Inc ,  ハリマ化成株式会社 ,  株式会社デンソー

Inventor： MITSUHARU MASAKI ,  YAMAMOTO MASAYASU ,  NAKANISHI KENSUKE ,  AIHARA MASAMI

IPC: B23K35/363 ,  B23K35/22 ,  H05K3/34

CPC classification number: B23K35/362 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/3613

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering, and solder paste composition, wherein generation of cracks in flux residues after the soldering is sufficiently suppressed even under a severe environment that the difference between coldness and hotness is very large, and they are high in reliability and excellent in solderability, and the manufacturing cost and burden on the environment are equal to before.
SOLUTION: The flux for soldering contains a base resin and an activator. The base resin contains a thermoplastic acrylic resin having the glass transition temperature of

Abstract translation: 要解决的问题：为了提供焊接用焊剂和焊膏组合物，即使在冷热度差非常大的恶劣环境下也能充分抑制焊接后的焊剂残留物的裂纹的产生，以及 它们的可靠性高，可焊性优异，制造成本和环境负担与之前相同。

解决方案：用于焊接的焊剂包含基础树脂和活化剂。 基础树脂含有玻璃化转变温度<-50℃的热塑性丙烯酸树脂。 热塑性丙烯酸树脂的含量优选为焊剂总量的0.5-80重量％，活化剂的含量优选为焊剂总量的0.1-20重量％。 焊膏组合物含有焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT

公开(公告)号：JP2008062242A

公开(公告)日：2008-03-21

申请号：JP2006239288

申请日：2006-09-04

Applicant: Harima Chem Inc ,  ハリマ化成株式会社

Inventor： CHIBA MASAYUKI ,  WATABE MASAHIRO ,  AIHARA MASAMI

IPC: B23K35/363 ,  B23K35/22 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a flux for soldering, which flux can sufficiently suppress the generation of cracks on a residue of the flux after soldering, and also has high reliability and excellent soldering performance, and is equivalent to a conventional flux in a manufacturing cost and an effect on environments, and further to provide a solder paste composite.
SOLUTION: The flux for soldering contains low softening point rosin having a softening point of 60°C or low as a base resin. It is preferable that the low softening point rosin contains secodehydroabietic acid and/or thermolysis components of rosin, and the content of the secodehydroabietic acid and/or the thermolysis components is 5 wt.% or more of the low softening point rosin. Further, it is preferable that the content of the low softening point rosin is 0.5 to 80 wt.% of the total amount of the flux. The solder paste composite contains the flux and powder of a solder alloy.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：为了提供焊接用焊剂，该焊剂能够充分抑制焊接后的焊剂残留物产生裂纹，并且还具有高可靠性和优异的焊接性能，并且相当于常规焊剂 在制造成本和对环境的影响，并进一步提供焊膏复合材料。

解决方案：用于焊接的焊剂含有软化点为60℃或低的作为基础树脂的低软化点松香。 低软化点松香优选含有松香的脱水松解酸和/或热解成分，脱水脱氢酸和/或热分解成分的含量为低软化点松香的5重量％以上。 此外，低软化点松香的含量优选为助熔剂总量的0.5〜80重量％。 焊膏复合物含有助焊剂和焊料合金粉末。 版权所有（C）2008，JPO＆INPIT