公开(公告)号：JP2011013146A

公开(公告)日：2011-01-20

申请号：JP2009158805

申请日：2009-07-03

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： WASHIO KENICHI ,  HASEGAWA MASASHI

IPC: G01R31/28 ,  G01R1/073 ,  H01L21/66

CPC classification number: G01R31/2887 ,  G01R1/07371 ,  G01R31/2889

Abstract: PROBLEM TO BE SOLVED: To adjustably couple relative pressure between at least one of a chip unit and a probe unit, and to provide a connection pin.SOLUTION: A testing device of an integrated circuit includes the chip unit for arranging a plurality of electronic components, such as, test chips on the upper side of a chip support; the probe unit for arranging a plurality of contacts on the lower side of a probe support and leaving a space downward from the chip unit; a connection unit for supporting the probe unit, leaving a space downward from the chip unit on a pin support, while vertically passing through the pin support; and a coupled unit for separably coupling the chip unit, the probe unit, and the connection unit, and displacing one of the chip support and the probe support, and the pin support in a direction of being approached and separated mutually.

Abstract translation: 要解决的问题：可调节地耦合芯片单元和探针单元中的至少一个上的相对压力，并提供连接引脚。解决方案：集成电路的测试装置包括用于布置多个电子部件的芯片单元 ，如芯片支架上侧的测试芯片; 探针单元，用于在探针支架的下侧布置多个触点，并从芯片单元向下留下空间; 连接单元，用于支撑探针单元，在垂直穿过销支撑件的同时在芯支撑件上从芯片单元向下留下空间; 以及耦合单元，用于可分离地联接芯片单元，探针单元和连接单元，并且使芯片支撑件和探针支架之一以及销支撑沿相互靠近和分离的方向移动。

公开(公告)号：JP2010210587A

公开(公告)日：2010-09-24

申请号：JP2009059940

申请日：2009-03-12

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： HASEGAWA MASASHI ,  NARITA TOSHIO

IPC: G01R1/073 ,  G01R31/26 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To suppress variations in the height position and coordinate position of a needle resulting from the thermal deformation of a support and a probe substrate, as much as possible.
SOLUTION: The electrical connection device includes the support having a lower surface, the probe substrate that is attached to the lower surface of the support and supported by the support, and a plurality of contacts attached to the lower surface of the probe substrate. At least one of the support and the probe substrate has a temperature-adjusting member for receiving electric power and generating or absorbing heat. The support and the probe substrate are made of materials having substantially the same thermal expansion coefficient.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：尽可能地抑制由支撑体和探针基板的热变形引起的针的高度位置和坐标位置的变化。 电连接装置包括具有下表面的支撑件，探针基板附接到支撑件的下表面并由支撑件支撑，以及附接到探针基板的下表面的多个触点 。 支撑体和探针基板中的至少一个具有用于接收电力并产生或吸收热量的温度调节构件。 支撑体和探针基板由具有基本上相同的热膨胀系数的材料制成。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010204122A

公开(公告)日：2010-09-16

申请号：JP2010133539

申请日：2010-06-11

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： HASEGAWA YOSHIE ,  MASUDA HIKARI ,  YASUDA KATSUO ,  WASHIO KENICHI ,  HASEGAWA MASASHI

IPC: G01R31/28 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To facilitate parallelism adjustment in the midway of inspection.
SOLUTION: In a method of processing information about a probe card, information about the probe card is processed. The probe card includes a substrate, a plurality of probes arranged on the substrate, and a storing device arranged on the substrate. This method includes determining at least three first reference probes and at least three second reference probes where needle height positions are aligned, determining an optimal amount of overdrive of the probes, and writing the XY coordinate positions of the needles of the first reference probes, the needle height positions of the second reference probes, and the optimal amount of overdrive into the storage device.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：为了便于检查中途的并行调整。 解决方案：在处理有关探针卡的信息的方法中，处理有关探针卡的信息。 探针卡包括衬底，布置在衬底上的多个探针和布置在衬底上的存储装置。 该方法包括确定至少三个第一参考探针和至少三个第二参考探针，其中针高度位置对准，确定探针的过驱动的最佳量，以及写入第一参考探针的针的XY坐标位置， 第二参考探针的针高度位置，以及过载到存储装置中的最佳量。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009277773A

公开(公告)日：2009-11-26

申请号：JP2008125903

申请日：2008-05-13

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： WASHIO KENICHI ,  HASEGAWA MASASHI

IPC: H01L21/66 ,  G01R31/28

Abstract: PROBLEM TO BE SOLVED: To provide a means of facilitating an operation for adjusting the posture of a test head relative to a probe card.
SOLUTION: A probing device 10 includes a stage base 24, an inspection stage 22 which is supported on the stage table 24 and receives a body 12 to be inspected which has a plurality of electrodes, a card base 26 placed above the inspection stage 22, the probe card 30 which has a plurality of contact elements 44 and is supported on the card base 26 so that stylus tips of the elements 44 face the inspection stage 22, coupling devices 28a, 28b, and 28c that couple the card base 26 to the inspection stage 22 in a displaceable state so as to adjust the parallelism between the body 12 to be inspected and probe card 30, a test head 76 supported on the card base 26 displaceably over the probe card 30 so as to form a space above the probe card 30 by being arranged on the card base 26, and a displacement preventing device 64 which prevents the test card 76 from being displaced with respect to the card base 26 in such a way that the prevention can be canceled.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种便于调整测试头相对于探针卡的姿势的操作的手段。 解决方案：探测装置10包括台座24，检查台22，其被支撑在台台24上并且容纳具有多个电极的被检查体12，放置在检查上方的卡座26 阶段22，探针卡30具有多个接触元件44并且被支撑在卡座26上，使得元件44的触控笔尖面对检查台22，连接卡基座的连接装置28a，28b和28c 26到可检测状态的检查台22，以便调整被检体12与探针卡30之间的平行度，支撑在卡底座26上的测试头76可移动地位于探针卡30上，以便形成空间 通过布置在卡座26上的探针卡30上方，以及防止测试卡76相对于卡座26移位的位移防止装置64，以防止被取消。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009025267A

公开(公告)日：2009-02-05

申请号：JP2007191638

申请日：2007-07-24

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： HASEGAWA YOSHIE ,  HASEGAWA MASASHI

IPC: G01R1/073 ,  G01R31/26 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To dispose probes equal in number to electrodes of a single integrated circuit within a probe disposition region corresponding in size to the integrated circuit, although each of the probes has an elongated portion extending in a transverse direction. SOLUTION: An electrical connection device includes: a probe attaching body having one surface provided with at least one probe disposition region and a plurality of lands provided within the probe disposition region; and a plurality of probes located within the probe disposition region as viewed flatways. Each of the probes includes: an attaching portion extending from a land in a longitudinal direction that intersects with the probe disposition region and having one end attached to the land; an arm portion extending from the other end of the attaching portion in a transverse direction; an elongated portion extending from a top of the arm portion in a direction opposite to the attaching portion; and a needlepoint provided at a top of the elongated portion. At least one of the probes has an arm portion extending from an arm portion of at least one other probe toward an attaching portion or an elongated portion of another probe with a space in a direction that crosses an arm portion of another probe. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：尽管每个探针具有在横向方向上延伸的细长部分，但是在与集成电路大小对应的探针配置区域内配置数量相等的单个集成电路的电极的探针。 电连接装置包括：探针附接体，其具有设置有至少一个探针配置区域的一个表面和设置在探测器配置区域内的多个焊盘; 以及位于所述探针配置区域内的多个探针，如同平面所示。 每个探针包括：附接部分，其从与探针配置区域相交的纵向方向上的平台延伸并且一端连接到脊部; 从所述安装部的另一端沿横向延伸的臂部; 从所述臂部的顶部沿着与所述安装部相反的方向延伸的细长部; 以及设置在细长部分的顶部的针尖。 至少一个探针具有从至少一个其它探针的臂部分朝着与另一个探针的臂部分交叉的方向上的空间的另一个探针的附接部分或细长部分延伸的臂部分。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2013148511A

公开(公告)日：2013-08-01

申请号：JP2012010294

申请日：2012-01-20

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： WASHIO KENICHI ,  HASEGAWA MASASHI

IPC: G01R1/073 ,  G01R31/26 ,  H01L21/66

CPC classification number: G01R31/2889

Abstract: PROBLEM TO BE SOLVED: To facilitate an equal-length wiring by simplifying a connection wiring structure.SOLUTION: An inspection device of the present invention comprises at least: a probe card that has a plurality of probes contacting a plurality of electrodes of each of the chips is arranged correspondingly to chips to be inspected on a semiconductor wafer; and a test head that is electrically connected to each of the probes on the probe card and applies a test signal from a tester to them. A plurality of tester lands on a probe substrate, which are electrically connected respectively to the plurality of probes, and a plurality of electrical connection parts on a tester side for the test head corresponding to each tester land are arranged so as to configure a plurality of array areas that are obtained by dividing an area correspondingly to the chips to be inspected. The plurality of probes on the probe substrate are connected to the corresponding tester lands that are provided on the array areas respectively for the chips to be inspected.

Abstract translation: 要解决的问题：通过简化连接布线结构来促进等长布线。解决方案：本发明的检查装置至少包括：探针卡，其具有接触多个电极的多个探针 芯片对应于在半导体晶片上检查的芯片; 以及测试头，其电连接到探针卡上的每个探针，并将来自测试仪的测试信号施加到它们。 多个检测器平台分别与多个探针电连接在探针基板上，并且在测试器侧的多个电连接部分对应于每个测试台的测试头布置成构成多个 通过对应于要检查的芯片划分区域而获得的阵列区域。 探针基板上的多个探针分别连接到设置在阵列区域上的相应的测试台，用于待检查的芯片。

公开(公告)号：JP2010271160A

公开(公告)日：2010-12-02

申请号：JP2009122771

申请日：2009-05-21

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： HASEGAWA MASASHI

IPC: G01R1/073 ,  H01L21/66

Abstract: PROBLEM TO BE SOLVED: To maximally suppress a circuit chip from being heated to a high temperature. SOLUTION: The electrical connection device includes a support having an upper surface and a lower surface; a probe substrate supported by being assembled on the lower surface of the support with a thickness direction used as a vertical direction; a plurality of contactors mounted on the lower surface of the probe substrate; a chip substrate having a plurality of circuit chips arranged on the upper surface, which is a chip substrate positioned at an interval over the support, in a state where a thickness direction is used as a vertical direction; a heat treatment member for absorbing the heat and discharging the heat on the chip substrate side and on the side different from the chip substrate side, which is a heat treatment member arranged on the lower surface of the chip substrate; and a heat treatment plate mounted on the lower side of the heat treatment member. COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：最大限度地抑制电路芯片被加热到高温。 电连接装置包括具有上表面和下表面的支撑件; 探针基板，其以厚度方向作为垂直方向组装在所述支撑体的下表面上; 安装在探针基板的下表面上的多个接触器; 芯片基板，其具有布置在上表面上的多个电路芯片，所述多个电路芯片是以厚度方向用作垂直方向的状态的位于所述支撑件上方间隔的芯片基板; 一个热处理部件，用于吸收散热芯片基板一侧和不同于芯片基板侧的热量，该热处理部件是布置在芯片基板的下表面上的热处理部件; 以及安装在热处理部件的下侧的热处理板。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2007095993A

公开(公告)日：2007-04-12

申请号：JP2005283483

申请日：2005-09-29

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： HASEGAWA YOSHIE ,  WASHIO KENICHI ,  YASUDA KATSUO ,  HASEGAWA MASASHI

IPC: H01L21/66 ,  G01R1/073 ,  G01R31/26 ,  G01R31/28

Abstract: PROBLEM TO BE SOLVED: To facilitate work for aligning a probe point with an electrode of an inspection body after mounting on a prober. SOLUTION: Before a probe card is placed on the prober, probe information is determined regarding at least three reference probes P4, P5 and P6 among a plurality of probes 38. The method determines at least either point positions indicating coordinate positions of the points of the reference probes P4, P5 and P6 with the probe card placed on the prober, or electrode positions indicating coordinate positions of electrodes corresponding to the reference probes P4, P5 and P6 with the planar inspection body 12 having a plurality of electrodes corresponding to the probes 38. Based on the probe information and at least either the point positions or the electrode positions, the probe card and the inspection body 12 placed on the prober are relatively displaced to have the points of the reference probes P4, P5 and P6 aligned with the electrodes of the inspection body. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了便于在安装在探测器上之后将检测点与检查体的电极对准的工作。 解决方案：在将探针卡放置在探测器上之前，针对多个探针38中的至少三个参考探针P4，P5和P6确定探针信息。该方法确定指示坐标位置的至少一个点位置 参考探针P4，P5和P6与探针卡放置在探测器上的点，或指示对应于参考探针P4，P5和P6的电极的坐标位置的电极位置，其中平面检查体12具有对应于 根据探针信息和至少点位置或电极位置，放置在探测器上的探针卡和检查体12相对移位，使得参考探针P4，P5和P6的点对准 与检查体的电极。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2006098278A

公开(公告)日：2006-04-13

申请号：JP2004286237

申请日：2004-09-30

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： FUKUSHI TOSHIO ,  HASEGAWA MASASHI

IPC: G01R1/073 ,  G02F1/13

Abstract: PROBLEM TO BE SOLVED: To attain a shape resisting being bent to a needlepoint domain pressed on an electrode of an object under inspection.
SOLUTION: This probe is equipped with a strip-shaped attachment domain and the needlepoint domain forward extending from an end of the attachment domain. The needlepoint domain is equipped with: a first domain extending from an end part of the attachment domain and transformed into a projecting state to the lower side than a lower end edge of the attachment domain; a contact part formed in the first domain, the contact part being pressed on the electrode of the object under inspection; and a second domain integrally connected to the first domain and having abutting parts abutting on a member on the support body side in at least two positions longitudinally spaced apart from each other in the attachment domain.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了获得抵抗被检测对象物的电极上的针尖区域弯曲的形状。

解决方案：该探针配备有带状连接结构域，并且针尖结构域从连接结构域的末端向前延伸。 针尖结构域配备有：从连接结构域的端部延伸并且变成突出状态的第一区域到比附着区域的下端边缘更低的侧面; 形成在第一区域中的接触部分，接触部分被按压在被检查物体的电极上; 以及第二区域，其一体地连接到所述第一区域并且具有抵靠部件，所述邻接部件在所述附接区域中在彼此纵向间隔开的至少两个位置处抵靠在所述支撑体侧的构件上。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2011249695A

公开(公告)日：2011-12-08

申请号：JP2010123673

申请日：2010-05-31

Applicant: Micronics Japan Co Ltd ,  株式会社日本マイクロニクス

Inventor： WASHIO KENICHI ,  HASEGAWA MASASHI

IPC: H01L21/66 ,  G01R1/067 ,  G01R1/073

Abstract: PROBLEM TO BE SOLVED: To provide semiconductor device testing equipment capable of supporting even a thin wafer without flexural deformation thereof, and which eliminates the need for moving a probe needle in contact with a back surface electrode of the wafer even when a semiconductor element to be tested is shifted; a testing method using the same; and a coaxial probe needle unit used for the same.SOLUTION: Semiconductor device testing equipment, a testing method using the same, and a coaxial probe needle unit used for the same are provided. The semiconductor device testing equipment comprises: a wafer chuck having a support surface for supporting a wafer to be tested; a movement mechanism for relatively moving the wafer chuck in both a vertical and horizontal direction with regard to an upper probe needle; a plurality of lower probe needles held in the wafer chuck and arranged in the support surface in a matrix configuration; tester equipment electrically connected to the upper probe needle while connected to each of the plurality of lower probe needles via a selecting switch; and a switching device for switching the selecting switch so that the lower probe needles corresponding to a semiconductor element at a testing position are electrically connected to the tester equipment.

Abstract translation: 要解决的问题：为了提供能够支撑甚至薄的晶片而没有其弯曲变形的半导体器件测试设备，并且不需要移动与晶片的背面电极接触的探针，即使当半导体 要测试的元素被移动; 使用该方法的测试方法; 以及用于其的同轴探针针单元。 解决方案：提供半导体器件测试设备，使用其的测试方法以及用于其的同轴探针针单元。 半导体器件测试设备包括：具有支撑待测试晶片的支撑表面的晶片卡盘; 用于相对于上探针相对于晶片卡盘沿垂直和水平方向相对移动的移动机构; 多个下探头针保持在晶片卡盘中并以矩阵形式布置在支撑表面中; 测试器设备通过选择开关连接到多个下探针上的每一个，电连接到上探针; 以及切换装置，用于切换选择开关，使得与测试位置处的半导体元件相对应的下探针与电气连接至测试设备。 版权所有（C）2012，JPO＆INPIT