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公开(公告)号：JP2015035361A
公开(公告)日：2015-02-19
申请号：JP2013166190
申请日：2013-08-09
CPC分类号： Y02P10/253
摘要： 【課題】被加熱部材に対して、互いに近接させた複数の加熱コイルと、各々に対応した共振型電源を有する誘導加熱装置において、周波数制御時にも各共振型電源の位相角の変位のバラツキを小さくして高力率運転を可能にする誘導加熱装置を提供する。【解決手段】各誘導加熱コイル電源を同期させるとともに、コイル間の相互誘導を低減する逆結合インダクタンスで各ゾーン間の相互誘導の低減を実施後、誘導加熱コイルの共振先鋭度(=誘導性リアクタンス/等価抵抗)が全てのコイルにおいて、ほぼ同一となるように構成するとともに、共振コンデンサと構成する自己共振回路の位相をすべてのコイルにおいて、ほぼ同一となるように構成する。被加熱物の加熱にともなう等価抵抗の変化によって各電源の出力位相が変化したときに、共通の周波数制御によって、各電源出力が所定の位相角範囲になるよう制御して高力率運転する。【選択図】図5
摘要翻译： 要解决的问题：提供一种感应加热装置，该感应加热装置具有相对于加热构件彼此近似的多个加热线圈和分别对应的共振型电源，并且通过减少相位的变化来实现高功率因数运算 每个谐振型电源的角度即使在频率控制下也是如此。解决方案：感应加热装置被构造成使得各个感应加热线圈电源彼此同步，感应加热的谐振锐度（=感抗/等效电阻） 线圈在各个区域之间的相互感应减少之后，通过用于减小线圈之间的互感的反向耦合电感在所有线圈上变得基本相同，并且由谐振电容器构成的各自谐振电路的相位在所有线圈处变得基本相同 。 当通过伴随加热物体的加热的等效电阻的变化来改变每个电源的输出相位时，通过控制来执行高功率因数运算，使得每个电源输出在普通频率范围内 控制。
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公开(公告)号：JP2014099305A
公开(公告)日：2014-05-29
申请号：JP2012249887
申请日：2012-11-14
发明人： UCHIDA NAOKI , FUJITA KAZUYOSHI , AO TAKAHIRO
IPC分类号： H05B6/10
摘要： PROBLEM TO BE SOLVED: To provide an induction heating device capable of equalizing temperature distribution along a cross sectional shape of an induction heated member even when the induction heated member having an oval or elongated circle shaped cross section is placed in a horizontal state.SOLUTION: An induction heating device includes: a cylindrical graphite tube 12 (a heated member including a graphite tube) which is placed so that a trunk part is positioned above and below a processed member; an induction heating coil 16 wound around the graphite tube 12 in a solenoid shape; and a heat insulation material 18 which covers the wound induction heating coil 16. An air gap is provided between the graphite tube 12 and the induction heating coil 16. The induction heating coil 16 and the heat insulation material 18 contact with each other or are located close to each other.
摘要翻译： 要解决的问题：提供一种感应加热装置，即使当具有椭圆形或细长圆形截面的感应加热构件处于水平状态时，也可以使感应加热构件的横截面形状的温度分布相等。 感应加热装置包括：圆柱形石墨管12（包括石墨管的加热构件），其被布置成使得主体部分位于加工构件的上方和下方; 以螺线管形状缠绕在石墨管12周围的感应加热线圈16; 以及覆盖卷绕的感应加热线圈16的绝热材料18.在石墨管12和感应加热线圈16之间设置气隙。感应加热线圈16和隔热材料18彼此接触或位于 彼此接近
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公开(公告)号：JP2014029807A
公开(公告)日：2014-02-13
申请号：JP2012170175
申请日：2012-07-31
发明人： UCHIDA NAOKI , KAWANAKA KEIJI , FUJITA KAZUYOSHI , AO TAKAHIRO
摘要： PROBLEM TO BE SOLVED: To provide a control method which can deal with a reverse flow of power occurring when driven in an inverter output phase of beyond ±90 degrees in a mutual induction condition where output power=0, that is, power factor=0 when driven in the inverter output phase of +90 degrees or -90 degrees.SOLUTION: In an induction heating apparatus, a power supply 32 for supplying power to each of a plurality of induction heating coils 12a, 12b which are mutually inducted with each other is controlled such that operation frequencies become the same with each other and a power supply output phase θ remains within a range represented as 90°>|θ|.
摘要翻译： 要解决的问题：提供一种控制方法，其能够在输出功率= 0的相互感应条件下，即在功率因数= 0的相互感应条件下处理在超过±90度的逆变器输出相中驱动时发生的功率的逆流 当驱动逆变器输出相位为+90度或-90度时。解决方案：在感应加热装置中，用于向相互相互导入的多个感应加热线圈12a，12b中的每一个供电的电源32 被控制为使得操作频率彼此相同和电源输出阶段; 保持在90°范围内| |＆thetas; |。
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公开(公告)号：JP2011204787A
公开(公告)日：2011-10-13
申请号：JP2010068642
申请日：2010-03-24
发明人： MIYATA JUNYA , UCHIDA NAOKI
IPC分类号： H01L21/22 , H01L21/324 , H01L21/683
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor substrate heat treating device allowing control of a temperature distribution on a susceptor horizontal plane even when giving a horizontal magnetic flux to the susceptor, and allowing heat treatment by batch processing.SOLUTION: The semiconductor heat treating device 10 for indirectly heating a wafer 30 mounted on the horizontally arranged susceptor 14 by induction-heating the susceptor 14 includes: an induction heating coil 20 disposed on the outer peripheral side of the susceptor 14 and forming an AC magnetic flux in a direction parallel to a wafer mounting surface of the susceptor 14; and a rotation table 18 horizontally rotating the susceptor 14. The susceptor 14 is constituted of a thin part 14a positioned on the center side and a thick part 14b positioned on the outer edge side.
摘要翻译： 要解决的问题：提供一种半导体基板热处理装置，即使在向基座提供水平磁通量的同时也能够控制基座水平面上的温度分布，并且允许通过间歇处理进行热处理。解决方案：半导体热处理装置 用于通过感应加热基座14间接加热安装在水平布置的基座14上的晶片30的装置10包括：感应加热线圈20，其设置在基座14的外周侧上，并在平行于 基座14的晶片安装面; 以及使基座14水平旋转的旋转台18.基座14由位于中心侧的薄部14a和位于外缘侧的厚部14b构成。
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公开(公告)号：JP2011077369A
公开(公告)日：2011-04-14
申请号：JP2009228378
申请日：2009-09-30
发明人： MIYATA JUNYA , UCHIDA NAOKI
IPC分类号： H01L21/324 , H01L21/31 , H05B3/03 , H05B3/68
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor substrate heat treatment device, reducing the number of temperature sensors than ever and allowing temperature distribution control considering the interference of a magnetic flux between adjacent heating zones. SOLUTION: The semiconductor substrate heat treatment device 10 has a plurality of induction heating coils 12 (12a-12f), inverters 20 (20a-20f) each connected with corresponding induction heating coils 12, and graphite 14 disposed on a plane constituted by the plurality of induction heating coils 12 to heat a wafer 16. The device includes: temperature sensors 30 (30a-30c) selecting two adjacently disposed induction heating coils as one set from among the plurality of induction heating coils 12 to set the graphite 14 heated between the selected set of two induction heating coils as a temperature detection point; and a temperature control unit 28 deriving a temperature gradient from temperatures detected by the plurality of temperature sensors 30 to determine the power input into each of the plurality of induction heating coils 12 based on the temperature gradient. COPYRIGHT: (C)2011,JPO&INPIT
摘要翻译： 要解决的问题：提供一种半导体基板热处理装置，减少温度传感器的数量，并考虑到相邻加热区之间的磁通量的干扰，从而允许温度分布控制。 解决方案：半导体基板热处理装置10具有多个感应加热线圈12（12a-12f），各自与相应的感应加热线圈12连接的逆变器20（20a-20f）和设置在构成的平面上的石墨14 通过多个感应加热线圈12加热晶片16.该装置包括：温度传感器30（30a-30c），从多个感应加热线圈12中选择两个相邻设置的感应加热线圈作为一组，以设置石墨14 在所选择的两组感应加热线圈之间加热作为温度检测点; 以及温度控制单元28，其根据由多个温度传感器30检测的温度导出温度梯度，以基于温度梯度来确定输入到多个感应加热线圈12中的每一个的功率。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2011054318A
公开(公告)日：2011-03-17
申请号：JP2009200262
申请日：2009-08-31
发明人： UCHIDA NAOKI , OZAKI KAZUHIRO
摘要： PROBLEM TO BE SOLVED: To provide an induction heating device capable of stable temperature distribution control, even if a conductive member such as a metal film is formed on the surface of a heated object.
SOLUTION: The induction heating device 10 indirectly heating a wafer arranged on a susceptor by induction heating the susceptor includes: a susceptor 18 with its plate thickness varied by giving its outer edge part a notch 22 in a direction parallel to a loading face of a heated object; a susceptor 18 with its thickness made thinner further toward a periphery side on a main face located at an opposite side where the wafer 23 is loaded; induction heating coils 26 (26a, 26b, 26c), arranged at an outer periphery side of the susceptor 18, for forming an alternating-current magnetic field in a direction parallel to the wafer loading face of the susceptor 18; and a control part 40 as well as an inverter 38 for controlling frequencies of the current inputted into the induction heating coils 26.
COPYRIGHT: (C)2011,JPO&INPIT摘要翻译： 要解决的问题：即使在被加热物体的表面上形成诸如金属膜的导电构件，也能够提供能够进行稳定的温度分布控制的感应加热装置。 感应加热装置10通过感应加热间接加热设置在基座上的晶片的感应加热装置10包括：通过使其外边缘部分沿平行于装载面的方向使其外边缘部分形成切口22而使其板厚变化的基座18 的加热物体; 其厚度的基座18在位于晶片23的相对侧的主面上朝向外周侧进一步变薄; 设置在基座18的外周侧的感应加热线圈26（26a，26b，26c），用于在与基座18的晶片装载面平行的方向上形成交流磁场; 控制部分40以及用于控制输入到感应加热线圈26中的电流的频率的逆变器38.版权所有：（C）2011，JPO＆INPIT
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公开(公告)号：JP2010287447A
公开(公告)日：2010-12-24
申请号：JP2009140694
申请日：2009-06-12
发明人： UCHIDA NAOKI , OKAZAKI YOSHIHIRO , OZAKI KAZUHIRO
摘要： PROBLEM TO BE SOLVED: To provide an induction heating device for reducing switching loss of power inverters, an induction heating method, and a program.
SOLUTION: The induction heating device includes a plurality of induction heating coils 20 arranged close to each other, a plurality of power inverters 30 having capacitors 40 each connected in series with each induction heating coil and converting DC voltage to rectangular-wave voltage, and a control circuit 15 for controlling so as to arrange phases of coil currents flowing in the plurality of induction heating coils. The control circuit 15 controls timing for transition of the rectangular wave voltage so as to make an instantaneous value of the rectangular-wave voltage maintain at the DC voltage or the inverse voltage when the coil current turns to zero-cross.
COPYRIGHT: (C)2011,JPO&INPIT摘要翻译： 要解决的问题：提供一种用于降低功率逆变器的开关损耗的感应加热装置，感应加热方法和程序。 感应加热装置包括：彼此靠近配置的多个感应加热线圈20，多个电力逆变器30，其具有各自与每个感应加热线圈串联连接的电容器40，并将DC电压转换为矩形波电压 以及控制电路15，用于控制在多个感应加热线圈中流动的线圈电流的相位。 控制电路15控制矩形波电压的转变的定时，使得当线圈电流变为零交叉时，矩形波电压的瞬时值保持在DC电压或反向电压。 版权所有（C）2011，JPO＆INPIT
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公开(公告)号：JP2009239098A
公开(公告)日：2009-10-15
申请号：JP2008084400
申请日：2008-03-27
发明人： INAMI SHOICHI , MIYATA JUNYA , UCHIDA NAOKI
IPC分类号： H01L21/268 , H01L21/02 , H05B6/10 , H05B6/36 , H05B6/44
摘要： PROBLEM TO BE SOLVED: To provide a radiant heat source, which is an object of induction heating, and a wafer heat treatment system, which can prevent decrease in the temperature of a center part in the radiant heat source heated by a C type coil arranged in parallel.
SOLUTION: The wafer heat treatment system includes: a heating furnace 12 which separates a process room 24 and a control room 14 by a separator 16; an induction heating apparatus 30 which is provided with an induction heating coil 32 in the control room 14; a laser irradiation apparatus 50 which is provided with a light focusing part 52 in the control room 14; and a computer 60 which detects the temperature distribution of the wafer 20 and adjusts the power supplied to the inductive heating coil 32 and the output of the laser irradiated from the light focusing part 52, based on the temperature distribution of the wafer 20. The induction heating coil 32 is formed in the shape of approximately C and is arranged in parallel with a graphite 18. The light focusing part 52 is arranged in the position in which the laser, which is made to penetrate the separator 16, is irradiated in the center part surrounded by the heating region of the inductive heating coil 32 to the graphite 18.
COPYRIGHT: (C)2010,JPO&INPIT摘要翻译： 要解决的问题：提供作为感应加热的目的的辐射热源和晶片热处理系统，其可以防止由C加热的辐射热源中的中心部分的温度降低 型线圈并联排列。 解决方案：晶片热处理系统包括：加热炉12，其通过分离器16分隔处理室24和控制室14; 感应加热装置30，其在控制室14中设置有感应加热线圈32; 激光照射装置50，其在控制室14中设置有聚光部52; 以及计算机60，其基于晶片20的温度分布，检测晶片20的温度分布并调节供应到感应加热线圈32的功率和从聚光部分52照射的激光的输出。感应 加热线圈32形成为大致C形状并与石墨18平行布置。光聚焦部52布置在使穿透分离器16的激光照射在中心的位置 部分被感应加热线圈32的加热区包围到石墨18上。版权所有（C）2010，JPO＆INPIT
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公开(公告)号：JP2009218448A
公开(公告)日：2009-09-24
申请号：JP2008061799
申请日：2008-03-11
发明人： INAMI SHOICHI , MIYATA JUNYA , UCHIDA NAOKI
IPC分类号： H01L21/26
摘要： PROBLEM TO BE SOLVED: To provide a wafer heat treatment apparatus in which the temperature can be quickly raised or lowered while the temperature distribution is kept uniform with high accuracy regardless of the infrared transmissivity of a wafer. SOLUTION: The wafer heat treatment apparatus 10 comprises a plurality of induction heating coils 12 (12a-12d) arranged concentrically and a plurality of annular graphite portions 14 (14a-14d) corresponding to the induction heating coils 12, respectively. The apparatus includes a wafer holding means 16 for placing the wafer 40 in a gap between the wafer 40 to be heat-treated and the graphite portions 14. The cross section of the graphite portion 14 has a semicircular shape. Preferably, the wafer heat treatment apparatus 10 having the characteristics described above comprises a reflector plate 18 that is placed opposing to the graphite portions 14 through the wafer 40 and reflects radiant rays having passed through the wafer 40. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 要解决的问题：提供一种晶片热处理设备，其中温度可以快速升高或降低，同时温度分布以高精度保持均匀，而与晶片的红外透射率无关。 解决方案：晶片热处理设备10包括分别同心设置的多个感应加热线圈12（12a-12d）和分别对应于感应加热线圈12的多个环形石墨部分14（14a-14d）。 该装置包括用于将晶片40放置在待热处理的晶片40和石墨部分14之间的间隙中的晶片保持装置16.石墨部分14的横截面具有半圆形。 优选地，具有上述特征的晶片热处理设备10包括反射板18，反射板18通过晶片40与石墨部分14相对放置并且反射通过晶片40的辐射线。版权所有（C） 2009年，JPO＆INPIT
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公开(公告)号：JP2008251440A
公开(公告)日：2008-10-16
申请号：JP2007093495
申请日：2007-03-30
发明人： UCHIDA NAOKI , YABE TAIJI , KAWANAKA KEIJI , KATAYAMA HIDEKI
IPC分类号： H05B6/06 , H02M7/48 , H02M7/5387 , H05B6/10 , H05B6/44
摘要： PROBLEM TO BE SOLVED: To provide an induction heating method capable of reducing waste material as compared with a conventional one by accurately controlling the temperature distribution of a heating object in stopping or in a low-speed operation. SOLUTION: This heating method of a heating object by this induction heating device is characterized in that an inverter makes a power supply method to an induction heating coil different in response to a transport condition of a heating object by a transport means; when the heating object is normally transported, power is adjusted by control of a current frequency or control of phase angles of the voltage waveform and the current waveform while respectively deviating frequencies of currents supplied to the respective induction heating coils arranged adjacently to one another; when the transport of the heating object is stopped or set at a speed lower than that of the normal transport, the frequencies of the currents supplied to the respective induction heating coils are made coincident with one another; the power is adjusted by adjusting a duty ratio in one cycle while the waveforms of the currents supplied to the respective induction heating coils are synchronized or controlled to keep a predetermined phase difference; and thereby the temperature of the heating object is raised. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译： 要解决的问题：提供一种能够通过在停止或低速运转中精确地控制加热物体的温度分布而与现有技术相比减少废料的感应加热方法。 解决方案：该感应加热装置的加热对象的这种加热方法的特征在于，逆变器响应于通过运送装置的加热物体的运输状态而对感应加热线圈施加电力供给方法; 当加热对象正常传送时，通过控制电流频率或控制电压波形和电流波形的相位角来调节功率，同时分别提供给彼此相邻布置的各个感应加热线圈的电流的频率偏移; 当加热物体的输送停止或设定为比正常输送的速度低时，供给各感应加热线圈的电流的频率相互一致; 通过调节一个周期的占空比来调节功率，同时提供给各个感应加热线圈的电流的波形被同步或控制以保持预定的相位差; 从而提高加热对象的温度。 版权所有（C）2009，JPO＆INPIT
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