公开(公告)号：JPS59194458A

公开(公告)日：1984-11-05

申请号：JP6878383

申请日：1983-04-18

Applicant: Ricoh Co Ltd

Inventor： CHIBA FUMIKIYO ,  KOMATSU KOUZOU ,  TAKAHASHI KAZUTOMO ,  ISHIKAWA YUUICHI ,  MATSUO KAZUYOSHI

IPC: H05K5/00 ,  H01L23/32 ,  H01L23/36 ,  H04N1/401

CPC classification number: H04N1/401 ,  H01L23/32 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: PURPOSE:To improve the reliability of a produce by providing heat sink means in a cassette case which contains a mother board, thereby preventing the erroneous operation and the deterioration of an IC due to heat generation. CONSTITUTION:One 2-1, 2-2 of the peripheral edges of an upper member 1-1 and a lower member 1-2 which form a cassette case 1 is opened, and notches 3, 3 are formed at the other periphery of the member 1-2. When the case 1 is associated, the open end for connecting the connection terminal of a mother board 5 and an external connector is formed of the opened peripheral edges 2-1, 2-2, and the notches 3, 3 become holes for externally exhausting the heat in the case 1. The terminal 7 connected to the external connector is provided at the end of the board 6, and IC chips 8, 8 are placed in a chip-on-board type on a substrate.

Abstract translation: 目的：通过在包含母板的盒壳中提供散热装置来提高产品的可靠性，从而防止由于发热而引起的IC的错误操作和劣化。 构成：打开形成盒壳体1的上部构件1-1和下部构件1-2的周缘的一个2-1,2-2，并且在该壳体1的另一个周边形成有槽3,3 会员1-2。 当壳体1关联时，用于连接母板5的连接端子和外部连接器的开口端由打开的外围边缘2-1,2-2形成，并且凹口3,3成为用于外部排出的孔 连接到外部连接器的端子7设置在板6的端部，并且IC芯片8,8以基板上的芯片形式放置在基板上。

公开(公告)号：JPS59194456A

公开(公告)日：1984-11-05

申请号：JP6878283

申请日：1983-04-18

Applicant: Ricoh Co Ltd

Inventor： CHIBA FUMIKIYO ,  KOMATSU KOUZOU ,  TAKAHASHI KAZUTOMO ,  ISHIKAWA YUUICHI ,  MATSUO KAZUYOSHI

IPC: H01L23/32

CPC classification number: H01L23/32 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PURPOSE:To improve the reliability of a semiconductor device cassette by plating an IC chip in a so-called chip-on-board (COB) type secured onto a mother board, thereby reducing the mounting area and volume of the IC. CONSTITUTION:IC chips 20, 20 such as ROMs and the like are placed in a COB type on a mother board 2 contained in a cassette case made of upper and lower members 4-1 and 4-2. A pin 10 is integrally formed at the member 4-2, inserted into a positioning hole 11 opened at the board 2 to position the board 2 in a cassette case. A projection 12 for securing the board 2 is integrally formed with the member 4-2, and a similar projection is formed at the member 4-1.

Abstract translation: 目的：通过将IC芯片电镀在固定在母板上的所谓芯片上（COB）型，从而降低IC的安装面积和体积，从而提高半导体器件盒的可靠性。 构成：将IC芯片20,20（例如ROM等）放置在包含在由上部和下部构件4-1和4-2构成的盒壳体中的母板2上的COB型中。 销10一体地形成在构件4-2处，插入到在板2上开口的定位孔11中，以将板2定位在盒壳体中。 用于固定板2的突起12与构件4-2一体地形成，并且在构件4-1处形成类似的突起。