中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

33 records (took 0.021 seconds)

    積層型電子部品
    1.
    发明专利
    積層型電子部品 有权

    公开(公告)号：JPWO2003075295A1

    公开(公告)日：2005-06-30

    申请号：JP2003573659

    申请日：2003-03-07

    Applicant: Tdk株式会社 ,  Tdk株式会社

    Inventor： 彰敏 吉井 ,  彰敏 吉井 ,  横山　英樹 ,  英樹 横山 ,  貴志 神谷 ,  貴志 神谷 ,  篤史 武田 ,  篤史 武田 ,  昌幸 岡部 ,  昌幸 岡部

    IPC: H01G4/12 ,  H01G4/06 ,  H01G4/232 ,  H01G4/30 ,  H02B1/00

    CPC classification number: H01G4/2325

    Abstract: 積層型電子部品1は誘電体部2と、誘電体部2にそれぞれ密着した状態で配置され、該誘電体部2を介して対向配置される一対の第1の外部電極31及び第2の外部電極32と、を有している。誘電体部2は第1の外部電極31及び第2の外部電極32のうちの何れか一方に電気的に接続される2以上の内部電極23a〜23eを有する。第1の外部電極31及び第2の外部電極32は、熱硬化性樹脂と導電性粒子とを主成分とする導電性樹脂からなる樹脂電極層31a及び32a、樹脂電極層31a、32aと誘電体部2との間に配置される金属電極層31b、32bとを有している。導電性樹脂中の導電性粒子の含有率が70〜75質量%であり、導電性粒子は、長手方向の平均長さが30〜70μmであり、アスペクト比が1.5〜3.3である針状粒子71を主成分として含んでいる。

    Surface-mount electronic component array
    3.
    发明专利
    Surface-mount electronic component array 有权

    公开(公告)号：JP4985474B2

    公开(公告)日：2012-07-25

    申请号：JP2008050181

    申请日：2008-02-29

    Applicant: Tdk株式会社

    Inventor： 彰敏 吉井 ,  敬 小松

    IPC: H01G4/232 ,  H01G4/30

    Abstract: PROBLEM TO BE SOLVED: To provide a surface mounted electronic component array, in which generation of cracks in a body is prevented, by releasing stress to the body. SOLUTION: A surface mounted capacitor array 1 has a dielectric element body 10 and external electrodes 20A-20D. The external electrodes 20A-20D are arranged along a ridge connecting side-faces 10a and 10c, so that the external electrodes 20B and 20C are located between the external electrodes 20A and 20D, when observing from the side-face 10a side. The external electrodes 20A-20D have printed electrode layers 24A-24D and resin electrode layers 28A-28D, respectively. Both of area difference of the resin electrode layers 28A and the printed electrode layers 24A, and area difference of the resin electrode layers 28D and the printed electrode layers 24D, when observing from the side-face 10a side, are larger than area difference of the resin electrode layers 28B and the printed electrode layers 24B, and area difference of the resin electrode layers 28C and the printed electrode layers 24C, when observing from the side-face 10a side. COPYRIGHT: (C)2009,JPO&INPIT

    Surface-mount electronic components and surface-mount electronic component array
    9.
    发明专利
    Surface-mount electronic components and surface-mount electronic component array 有权

    公开(公告)号：JP4853482B2

    公开(公告)日：2012-01-11

    申请号：JP2008059707

    申请日：2008-03-10

    Applicant: Tdk株式会社

    Inventor： 彰敏 吉井 ,  敬 小松

    IPC: H01G4/252 ,  H01G4/12

    Abstract: PROBLEM TO BE SOLVED: To provide a surface-mounting electronic component and a surface-mounting electronic component array for preventing an element body from being cracked easily by relaxing stress to the element body. SOLUTION: A surface-mounting capacitor 1 comprises a dielectric element body 10 and an external electrode 16A. The dielectric element body 10 has a main surface 10a and sides 10c-10f. The external electrode 16A comprises a fired electrode layers 18A, a resin electrode layer, and a first plated layer and a second plated layer. The fired electrode layer 18A is formed on a main surface 10a of the dielectric element body 10 so that the fired electrode layer 18A is not on edge sections E1-E4 and is of a circular shape when viewed from the side of the main surface 10a. COPYRIGHT: (C)2009,JPO&INPIT

Patent Agency Ranking