Abstract:
PROBLEM TO BE SOLVED: To provide a planar coil element manufacture of which is facilitated by an easy-to-handle resin, and to provide a manufacturing method therefor.SOLUTION: In a planar coil element 10 and a manufacturing method therefor, a metal magnetic powder-containing resin 20 containing a flat or acicular first metal magnetic powder 30 further contains a second metal magnetic powder 32 having an average particle diameter (1 μm) smaller than that (32 μm) of the first metal magnetic powder 30, and thereby the viscosity of the metal magnetic powder-containing resin 20 decreases significantly. Consequently, the metal magnetic powder-containing resin 20 can be handled easily when it is applied and shaped to surround a coil 19, thus facilitating manufacture of the planar coil element 10.
Abstract:
PROBLEM TO BE SOLVED: To improve magnetic coupling between primary winding and secondary winding in a transformer component where multiple printed substrates, each of which is provided with a spiral conductor, are laminated.SOLUTION: A transformer component includes printed substrates 20, 40 in which spiral conductors 21, 41 serving as primary winding are formed and printed substrates 10, 30 in which spiral conductors 11, 31 serving as secondary winding are formed. The printed substrates 10, 20 are laminated so that the spiral conductors 11, 21 are disposed facing each other, and the printed substrates 30, 40 are laminated so that the spiral conductors 31, 41 are disposed facing each other. This structure improves magnetic coupling between the primary winding and the secondary winding. Thus, a transformer component with less transmission loss is provided.
Abstract:
PROBLEM TO BE SOLVED: To provide small and low resistance coil substrate and coil component, and to provide its manufacturing process. SOLUTION: Since the oil substrate 100 and the coil component 1 are produced through plating growth of a conductor pattern (planar coil 34), the portion 34K in the vicinity of the top of a conductor which became high through plating growth of the conductor is flattened by polishing or cutting while shortening the distance (G) between conductors and the size is reduced. In other words, small and low resistance coil substrate and coil component are attained. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a coil component which can be easily set with such DC superposition characteristics as different inductances can be attained, respectively, for a plurality of current levels. SOLUTION: The coil component 1 comprises a coil 34 formed along one plane, an upper magnetic substrate 11 and a lower magnetic substrate 12 arranged to sandwich the coil 34 from the opposite sides. An outer leg 123 is arranged in a region sandwiched by the upper magnetic substrate 11 and the lower magnetic substrate 12. The outer leg 123 is provided with a level difference surfaces 123b and 123c having different distances to the inner surface of the upper magnetic substrate 11. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a coil component in which heat resistance is enhanced. SOLUTION: The coil component 1 comprises a coil 34 formed along one plane, and a core provided along the coil 34 wherein the core has a pair of upper ferrite core 11 and a lower ferrite core 12 arranged to hold the coil 34 between. Resin is interposed between the coil 34 and the upper ferrite core 11 and the lower ferrite core 12, and the resin portion has an adhesive resin layer 40 mixed with spherical rubber filler. COPYRIGHT: (C)2006,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a coil substrate having coil conductors of high inductances and low resistances and capable of creating it with a few processes, the manufacturing method thereof, and a surface-mounting coil element. SOLUTION: The surface-mounting coil element has a core structure 1 wherein a ferrite core 5 having outside legs abuts in the outside legs against a ferrite core 2 having a central leg, a coil substrate 10 wherein spiral coil conductors 20 are so formed on both the surfaces of an insulating resin film 11 having a through hole (transparent hole 12) in its central portion as to connect the spiral coil conductors 20 of both the surfaces with each other via the through hole, and external electrodes connected with the coil conductors. Hereupon, the clearance between the spiral conductors of the coil conductor 20 is made not larger than 20 μm. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an exposure method for exposing a resist layer formed in a plane parallel to the propagation direction of the exposure light and to provide a low-cost coil component having low resistance of a coil conductor and high production yield, relating to an exposure method used in printed board circuit techniques or semiconductor circuit wiring techniques and to a method for manufacturing a coil component by using the exposure method. SOLUTION: A photoresist layer 27 is formed on the wall of a through hole 7 formed in a BT resin wafer 21. The BT resin wafer 21 is mounted on a mount plate 29 where a light diffusing face is formed. A photomask 31 is disposed to locate a specified light transmitting pattern near the photoresist layer 27 in the connecting part with the through hole wall, and irradiated with exposure light. The exposure light transmitting through the light transmitting pattern is diffused by the light diffusing face on the mount plate 29 to expose the photoresist layer 27 on the through hole wall near the light transmitting pattern. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a planar coil element achieving intensity and magnetic permeability at the same time.SOLUTION: In a planar coil element 10, a coil part 19 has a magnetic core part 21 in which metal magnetic powder containing resin 20 includes a first metal magnetic powder 30. Proportion of tilting metal magnetic powder in the first metal magnetic powder 30 is greater in the core part 21 than outside of the core part 21, and in most of the first metal magnetic powder 30 in the core part 21, major axes thereof tilt against a thickness direction and a surface direction of a board 16. Therefore, intensity in the planar coil element 10 is increased comparing to one in a planar coil element 110 in Fig. 9 (a), and magnetic permeability in the planar coil element 10 is also increased comparing to one in a planar coil element 210 in Fig. 9 (b). Thus, the planar coil element is provided with achieving intensity and magnetic permeability on a high level at the same time.
Abstract:
PROBLEM TO BE SOLVED: To prevent the outmost periphery of a flat surface spiral conductor from exposing on a side surface of a coil component.SOLUTION: A coil component 1 includes: a substrate 2; a flat surface spiral conductor 10a formed on a front surface 2t of the substrate 2 by electrolytic plating; and a flat surface conductor 15a which is formed between the outermost periphery of the flat surface spiral conductor 10a and an end part of the substrate 2, from among the front surface 2t of the substrate 2, and is not connected with other conductors on at least the same plane. The flat surface conductor 15a inhibits a plating layer of the outermost periphery from growing in the lateral direction. Thus, the structure prevents the outmost periphery of the flat surface spiral conductor from exposing on a side surface of the coil component.