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公开(公告)号：JP2014197590A
公开(公告)日：2014-10-16
申请号：JP2013072034
申请日：2013-03-29
Inventor： OKUBO HITOSHI , ITO HIDETO , MAEDA YOSHIHIRO , OTA MANABU , KANAME YUYA , KAWAHARA TAKAHIRO , NAKAGAWA KENJI , ITO TOMOKAZU
Abstract: 【課題】スパイラル導体の最外周ターンの太りを防止すると共に、はんだフィレットの高さを抑え、少量のはんだで所望の実装強度を確保する。【解決手段】基板10の上面10aにはスパイラル導体11、端子電極13、ダミー端子電極15が設けられ、基板10の下面10bにはスパイラル導体12、端子電極14、ダミー端子電極16が設けられている。引出電極26,27は、金属磁性粉含有樹脂層17を貫通して端子電極13の上面及びダミー端子電極15の上面にそれぞれ接続されている。端子電極13,14、ダミー端子電極15,16、並びに引出電極26,27の各外側側面は、磁性粉含有樹脂層17,18に覆われることなく露出しており、端子電極13,14の外側側面と同一平面上にある基板10の側面10c,10dは、金属磁性粉含有樹脂層17,18に覆われることなく端子電極13,14の外側側面とともに露出している。【選択図】図2
Abstract translation: 要解决的问题：为了防止螺旋导体的最外周转弯的增厚，以抑制焊脚的高度，并且通过少量焊料确保所需的安装强度。解决方案：螺旋导体11，端子 电极13和虚设端子电极15设置在基板10的上表面10a上，并且在基板10的下表面10b上设置有螺旋导体12，端子电极14和虚设端子电极16。 提取电极26和27穿透含有树脂层17的金属磁性粉末，分别连接到引出电极13的上表面和虚拟端子电极15的上表面。端子电极13和14的外侧表面 虚拟端子电极15和16以及引出电极26和27被不含磁性粉末的树脂层17和18覆盖而露出。子层的侧表面10c和10d 端子电极13和14的外侧表面的同一平面上的台板10与端子电极13和14的外侧表面一起暴露，而不被含有金属磁性粉末的树脂层17和18覆盖。
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公开(公告)号：JP2012248630A
公开(公告)日：2012-12-13
申请号：JP2011118361
申请日：2011-05-26
Inventor： ITO TOMOKAZU , OKUBO HITOSHI , MAEDA YOSHIHIRO , OTA MANABU
Abstract: PROBLEM TO BE SOLVED: To prevent facing second and third flat surface spiral conductors from contacting with each other.SOLUTION: A coil component 1 includes: flat surface spiral conductors 11a, 11b respectively formed on a front surface 2at and a rear surface 2ab of a substrate 2a by electrolytic plating; flat surface spiral conductors 11c, 11d respectively formed on a front surface 2bt and a rear surface 2bb of a substrate 2b by electrolytic plating; and an insulation resin layer 21 provided between the flat surface spiral conductor 11b and the flat surface spiral conductor 11c.
Abstract translation: 要解决的问题：防止面对第二和第三平面螺旋导体彼此接触。 解决方案：线圈部件1包括：通过电解电镀分别形成在基板2a的前表面2at和后表面2ab上的平面螺旋导体11a，11b; 通过电解电镀分别形成在基板2b的前表面2bt和后表面2bb上的平面螺旋形导体11c，11d; 以及设置在平面螺旋导体11b和平面螺旋导体11c之间的绝缘树脂层21。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2012089760A
公开(公告)日：2012-05-10
申请号：JP2010236784
申请日：2010-10-21
Inventor： ITO TOMOKAZU , OKUBO HITOSHI , MAEDA YOSHIHIRO , AKAGAWA ATSUSHI , OTA MANABU
Abstract: PROBLEM TO BE SOLVED: To provide a thin and compact high performance transformer component.SOLUTION: A transformer component 10 comprises a ferrite substrate 11, a first coil L1 formed on the ferrite substrate 11, a printed circuit board 16 with a central opening superimposed on the ferrite substrate 11, a second coil L2 formed on the printed circuit board 16, and a magnetic body 19 provided in the opening 16a of the printed circuit board 16 and configuring a magnetic path common to the first and second coils L1, L2. The number of turns of the first coil is larger than that of the second coil, and the second coil is thicker than the first coil.
Abstract translation: 要解决的问题：提供薄型紧凑的高性能变压器部件。 解决方案：变压器部件10包括铁氧体基板11，形成在铁氧体基板11上的第一线圈L1，具有叠置在铁氧体基板11上的中心开口的印刷电路板16，形成在印刷电路板上的第二线圈L2 设置在印刷电路板16的开口16a中并构成第一和第二线圈L1，L2共用的磁路的磁性体19。 第一线圈的匝数大于第二线圈的匝数，第二线圈比第一线圈厚。 版权所有（C）2012，JPO＆INPIT
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公开(公告)号：JP2008251752A
公开(公告)日：2008-10-16
申请号：JP2007089900
申请日：2007-03-29
Inventor： KUWAJIMA HAJIME , OKUBO HITOSHI , OTA MANABU
CPC classification number: H01G4/248 , H01C1/148 , H01C17/281 , H01G4/232 , Y10T29/49128 , Y10T29/49156 , Y10T29/49163 , Y10T29/4979 , Y10T156/1052
Abstract: PROBLEM TO BE SOLVED: To provide a highly reliable terminal electrode on the outer surface of a chip precisely in an arbitrary position and shape. SOLUTION: A manufacturing method of electronic components comprises: a tentative adhesion process for tentatively adhering (for example, vacuum-pressing) a first surface of a substrate to a support plate via an adhesive sheet (for example, made of resin dissolved in a solvent); a substrate dividing process for forming a groove for dividing a substrate into individual chips by forming a notching reaching one portion of the thickness of the support plate from a second surface side at a side opposite to the first surface on the substrate; a continuous electrode formation process for forming a continuous electrode on a second surface and on the circumferential face of a chip positioned in the groove by sputtering; and a component separation process (for example, for applying ultrasonic waves by dipping into a solvent) for separating the chip from the support plate. Before the tentative adhesion process, a first surface electrode formation process for forming an electrode on the first surface of the substrate is further included. In the continuous electrode formation process, an electrode formed on the circumferential face of electronic components is connected to an electrode formed in a first surface electrode formation process. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：在芯片的外表面上精确地设置任意位置和形状的高度可靠的端子电极。 电子部件的制造方法包括：暂时粘合（例如，将基板的第一表面真空按压）到支撑板上的粘合片（例如，由树脂溶解 在溶剂中） 基板分割处理，用于通过从与基板上的第一表面相对的一侧的第二表面侧形成开始到达支撑板的厚度的一部分的开槽，形成用于将基板分割成单个芯片的凹槽; 用于通过溅射在位于槽中的芯片的第二表面和周面上形成连续电极的连续电极形成工艺; 和组分分离处理（例如，通过浸渍到溶剂中来施加超声波），用于将芯片与支撑板分离。 在临时粘合处理之前，还包括用于在基板的第一表面上形成电极的第一表面电极形成工艺。 在连续电极形成工序中，将形成在电子部件的周面上的电极与形成在第一表面电极形成工序中的电极连接。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2013201375A
公开(公告)日：2013-10-03
申请号：JP2012070014
申请日：2012-03-26
Inventor： TONOYAMA KYOHEI , MORITA MAKOTO , ITO TOMOKAZU , OKUBO HITOSHI , OTA MANABU , MAEDA YOSHIHIRO , KANAME YUYA , MORO EIJI
IPC: H01F17/04 , H01F1/20 , H01F17/00 , H01F27/255 , H01F41/02
CPC classification number: H01F41/04 , H01F17/0013 , H01F27/255 , H01F27/292 , H01F41/046 , H01F2017/046
Abstract: PROBLEM TO BE SOLVED: To provide a planar coil element manufacture of which is facilitated by an easy-to-handle resin, and to provide a manufacturing method therefor.SOLUTION: In a planar coil element 10 and a manufacturing method therefor, a metal magnetic powder-containing resin 20 containing a flat or acicular first metal magnetic powder 30 further contains a second metal magnetic powder 32 having an average particle diameter (1 μm) smaller than that (32 μm) of the first metal magnetic powder 30, and thereby the viscosity of the metal magnetic powder-containing resin 20 decreases significantly. Consequently, the metal magnetic powder-containing resin 20 can be handled easily when it is applied and shaped to surround a coil 19, thus facilitating manufacture of the planar coil element 10.
Abstract translation: 要解决的问题：提供通过易于处理的树脂促进的平面线圈元件的制造，并提供其制造方法。解决方案：在平面线圈元件10及其制造方法中，金属磁 含有扁平或针状的第一金属磁性粉末30的含粉末的树脂20还含有平均粒径（1μm）小于第一金属磁粉30的（32μm）的第二金属磁性粉末32，由此， 含金属磁性粉末的树脂20的粘度显着降低。 因此，含金属磁性粉末的树脂20在被施加和成形为围绕线圈19时可以容易地处理，从而有助于平面线圈元件10的制造。
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Patent Agency Ranking
公开(公告)号：JP2012089543A
公开(公告)日：2012-05-10
申请号：JP2010232239
申请日：2010-10-15
Inventor： ITO TOMOKAZU , OKUBO HITOSHI , MAEDA YOSHIHIRO , AKAGAWA ATSUSHI , OTA MANABU
Abstract: PROBLEM TO BE SOLVED: To improve magnetic coupling between primary winding and secondary winding in a transformer component where multiple printed substrates, each of which is provided with a spiral conductor, are laminated.SOLUTION: A transformer component includes printed substrates 20, 40 in which spiral conductors 21, 41 serving as primary winding are formed and printed substrates 10, 30 in which spiral conductors 11, 31 serving as secondary winding are formed. The printed substrates 10, 20 are laminated so that the spiral conductors 11, 21 are disposed facing each other, and the printed substrates 30, 40 are laminated so that the spiral conductors 31, 41 are disposed facing each other. This structure improves magnetic coupling between the primary winding and the secondary winding. Thus, a transformer component with less transmission loss is provided.
Abstract translation: 要解决的问题：为了改善变压器部件中的初级绕组和次级绕组之间的磁耦合，其中层压有各自具有螺旋导体的多个印刷基板。 解决方案：变压器部件包括印刷基板20,40，其中形成有用作初级绕组的螺旋导体21,41和印刷基板10,30，其中形成有用作次级绕组的螺旋导体11,31。 印刷基板10,20被层叠，使得螺旋形导体11,21彼此面对地布置，并且印刷基板30,40被层叠，使得螺旋形导体31,41相对配置。 该结构改善了初级绕组和次级绕组之间的磁耦合。 因此，提供了具有较少传输损耗的变压器部件。 版权所有（C）2012，JPO＆INPIT
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7.发明专利
公开(公告)号：JP2014060284A
公开(公告)日：2014-04-03
申请号：JP2012204830
申请日：2012-09-18
Inventor： OKUBO HITOSHI , TONOYAMA KYOHEI , MORITA MAKOTO , ITO TOMOKAZU , ITO HIDETO , MAEDA YOSHIHIRO , OTA MANABU , KANAME YUYA , KAWAHARA TAKAHIRO
CPC classification number: H01F5/00 , H01F1/06 , H01F1/26 , H01F27/255 , H01F27/2804 , H01F27/292 , H01F2017/0066 , H01F2027/2809
Abstract: PROBLEM TO BE SOLVED: To provide a coil component which allows for enhancement of inductance while suppressing increase in core loss.SOLUTION: A coil component 1 comprises: a substrate 2; planar spiral conductors 10a, 10b formed, respectively, on the front surface 2t and the back surface 2b of the substrate 2 by electrolytic plating; and a metal magnetic powder-containing resin 22 covering the planar spiral conductors 10a, 10b, respectively. The metal magnetic powder-containing resin 22 contains first metal powder having a first average grain size, second metal powder having a second average grain size smaller than the first average grain size, and third metal powder having a third average grain size smaller than the second average grain size. The first average grain size is 15-100 μm, and the third average grain size is 2 μm or less. The first metal powder is a Permalloy-based material, and the second third metal powders are carbonyl iron.
Abstract translation: 要解决的问题：提供一种线圈部件，其能够抑制铁心损耗的增加而提高电感。解决方案：线圈部件1包括：基板2; 通过电解电镀分别形成在基板2的前表面2t和背面2b上的平面螺旋导体10a，10b; 以及分别覆盖平面状螺旋导体10a，10b的含金属磁性粉末的树脂22。 含有金属磁性粉末的树脂22含有具有第一平均粒径的第一金属粉末，具有比第一平均粒径小的第二平均粒径的第二金属粉末和具有比第二平均粒径小的第三平均粒径的第三金属粉末 平均粒度。 第一平均粒径为15-100μm，第三平均粒径为2μm以下。 第一金属粉末是坡莫合金材料，第二金属粉末是羰基铁。
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公开(公告)号：JP2012248628A
公开(公告)日：2012-12-13
申请号：JP2011118359
申请日：2011-05-26
Inventor： ITO TOMOKAZU , OKUBO HITOSHI , MAEDA YOSHIHIRO , OTA MANABU
Abstract: PROBLEM TO BE SOLVED: To prevent conductors excluding lead out conductors from exposing on a side surface of a coil component cut off by dice cutting.SOLUTION: In a coil component formation process, through holes for embedding conductors are respectively formed in first to seventh rectangular regions A1 to A7, and flat surface spiral conductors, covering the through holes for embedding the conductors at inner peripheral ends, are formed on a front surface 2t of a substrate for the respective rectangular regions. Further, in a region where each corner of the first and fourth rectangular regions A1 to A4 gathers, a lead out conductor 11a, connecting with each outer peripheral end of the four flat surface spiral conductors corresponding to these four rectangular regions, is formed. Flat surface spiral conductors, covering the through holes for embedding the conductors at inner peripheral ends, are formed on a rear surface 2b of the substrate for the respective rectangular regions. Further, in a region where each corner A1, A5 to A7 of the first and fifth to seventh rectangular regions A1, A5 to A7 gathers, a lead out conductor 11b, connecting with each outer peripheral end of the four flat surface spiral conductors corresponding to these four rectangular regions, is formed.
Abstract translation: 要解决的问题：为了防止排除导体的导体在通过切割切断的线圈部件的侧面露出。 解决方案：在线圈部件形成工艺中，用于嵌入导体的通孔分别形成在第一至第七矩形区域A1至A7中，并且覆盖用于将导体嵌入内周端的通孔的平面螺旋形导体为 形成在用于各个矩形区域的基板的前表面2t上。 此外，在第一和第四矩形区域A1至A4的每个角部聚集的区域中，形成与四个矩形区域相对应的四个平面螺旋形导体的每个外周端连接的引出导体11a。 在各个矩形区域的基板的后表面2b上形成有覆盖用于将导体嵌入内周端的通孔的平面螺旋形导体。 此外，在第一和第五至第七矩形区域A1，A5至A7的每个角A1，A5至A7的每个区域中，引出导体11b与四个平面螺旋导体的每个外周端相连， 形成这四个矩形区域。 版权所有（C）2013，JPO＆INPIT
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公开(公告)号：JP2013201374A
公开(公告)日：2013-10-03
申请号：JP2012070011
申请日：2012-03-26
Inventor： TONOYAMA KYOHEI , MORITA MAKOTO , ITO TOMOKAZU , OKUBO HITOSHI , OTA MANABU , MAEDA YOSHIHIRO , KANAME YUYA , MORO EIJI
IPC: H01F17/04 , H01F1/22 , H01F17/00 , H01F27/255 , H01F41/02
CPC classification number: H01F27/255 , H01F17/0013 , H01F27/292 , H01F2017/048
Abstract: PROBLEM TO BE SOLVED: To provide a planar coil element achieving intensity and magnetic permeability at the same time.SOLUTION: In a planar coil element 10, a coil part 19 has a magnetic core part 21 in which metal magnetic powder containing resin 20 includes a first metal magnetic powder 30. Proportion of tilting metal magnetic powder in the first metal magnetic powder 30 is greater in the core part 21 than outside of the core part 21, and in most of the first metal magnetic powder 30 in the core part 21, major axes thereof tilt against a thickness direction and a surface direction of a board 16. Therefore, intensity in the planar coil element 10 is increased comparing to one in a planar coil element 110 in Fig. 9 (a), and magnetic permeability in the planar coil element 10 is also increased comparing to one in a planar coil element 210 in Fig. 9 (b). Thus, the planar coil element is provided with achieving intensity and magnetic permeability on a high level at the same time.
Abstract translation: 要解决的问题：提供同时实现强度和磁导率的平面线圈元件。解决方案：在平面线圈元件10中，线圈部分19具有磁性体部分21，其中含有树脂20的金属磁性粉末包括 第一金属磁性粉末30.第一金属磁性粉末30中的倾斜金属磁性粉末的比例在芯部21中比芯部21的外侧大，并且在芯部21中的大部分第一金属磁性粉末30中， 其长轴相对于板16的厚度方向和表面方向倾斜。因此，与图1中的平面线圈元件110中的一个相比，平面线圈元件10中的强度增加。 与图9（a）中的平面线圈元件210中的平面线圈元件10中的导磁率相比，平面线圈元件10的磁导率也增加。 9（b）。 因此，平面线圈元件同时实现高水平的强度和磁导率。
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公开(公告)号：JP2012248629A
公开(公告)日：2012-12-13
申请号：JP2011118360
申请日：2011-05-26
Inventor： ITO TOMOKAZU , OKUBO HITOSHI , MAEDA YOSHIHIRO , OTA MANABU
Abstract: PROBLEM TO BE SOLVED: To prevent the outmost periphery of a flat surface spiral conductor from exposing on a side surface of a coil component.SOLUTION: A coil component 1 includes: a substrate 2; a flat surface spiral conductor 10a formed on a front surface 2t of the substrate 2 by electrolytic plating; and a flat surface conductor 15a which is formed between the outermost periphery of the flat surface spiral conductor 10a and an end part of the substrate 2, from among the front surface 2t of the substrate 2, and is not connected with other conductors on at least the same plane. The flat surface conductor 15a inhibits a plating layer of the outermost periphery from growing in the lateral direction. Thus, the structure prevents the outmost periphery of the flat surface spiral conductor from exposing on a side surface of the coil component.
Abstract translation: 要解决的问题：为了防止平面螺旋导体的最外周暴露在线圈部件的侧表面上。 解决方案：线圈部件1包括：基板2; 通过电解电镀形成在基板2的前表面2t上的平面螺旋导体10a; 以及在基板2的前表面2t之间形成在平面螺旋导体10a的最外周与基板2的端部之间的平坦面导体15a，至少与其它导体不连接 同一架飞机。 平面导体15a抑制最外周的镀层在横向上生长。 因此，该结构防止平面螺旋导体的最外周暴露于线圈部件的侧面。 版权所有（C）2013，JPO＆INPIT
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