摘要:
PROBLEM TO BE SOLVED: To provide a method of reducing crack propagation in an airfoil part 22. SOLUTION: This method includes steps of: preparing an airfoil part 22 having a root 36 spaced apart from a tip 34, spaced-apart leading and trailing edges 30 and 32, a negative-pressure side surface 40 extending from the leading edge 30 to the trailing edge 32, and an opposed positive-pressure side surface 38 extending from the leading edge 30 and the trailing edge 32; and supporting the airfoil part 22 against bending loads. The airfoil part 22 is burnished by using a burnishing element 42 to form at least one burnished section 68 of residual compressive stress. The at least one burnished section 68 is located adjacent the leading edge 30 and spaced from the leading edge 30 by an offset distance selected to avoid deformation of the leading edge 30. COPYRIGHT: (C)2008,JPO&INPIT
摘要:
A method of reducing crack propagation in an airfoil (22) includes: providing an airfoil (22) having a root (36) spaced apart from a tip (34), spaced-apart leading and trailing edges (30, 32), a suction side (40) extending from the leading edge (30) to the trailing edge (32), and an opposed pressure side (38) extending from the leading edge (30) and the trailing edge (32), supporting the airfoil (22) against bending loads. The airfoil (22) is burnished using a burnishing element (42), so as to create at least one burnished section (68) of residual compressive stress. The at least one burnished section (68) is located adjacent the leading edge (30) and spaced from the leading edge (30) by an offset distance selected so as to avoid deformation of the leading edge (30).
摘要:
PROBLEM TO BE SOLVED: To provide a solution capable of efficiently storing data and having high cost performance in respect to the manufacturing of hard memory disks to be used for a hard disk drive. SOLUTION: Two single-sided hard memory disks are simultaneously processed. Disks are arranged in pairs so that one surface of the 1st disk is positioned adjacent to one surface of the 2nd disk and both disk surfaces are brought into contact with each other or slightly separated. In this back-to-back state, the disk pairs may be processed by using conventional double-sided disk processing equipment and technology. Because of the positioning of the disks during processing, only one surface of each disk is subjected to full processing. Therefore each disk does only have one active surface. COPYRIGHT: (C)2004,JPO