摘要:
A method of severing a band (11) which encloses a blank stack (10), wherein the band (11), preferably in the region of a band station (19), is severed by a cutting means, in particular a knife (23), and is then removed from the blank stack (10). According to the invention, it is provided that the blank stack (10) is pushed together such that the band (11) is spaced apart from the blank stack (10), at least in certain regions, and that the band (11) is then severed in the spaced-apart region by the cutting means. The invention also relates to a corresponding apparatus for implementing the method.
摘要:
PROBLEM TO BE SOLVED: To provide a cutting device capable of cutting a workpiece such as a wafer without cutting chips adhered to a cutting surface of the workpiece by improving the fluidity of cutting water supplied to a cutting part by a cutting blade.SOLUTION: A cutting device includes: a chuck table 3 which holds a workpiece; cutting means comprising a cutting blade 43 for cutting the workpiece held on the chuck table 3; and cutting water supply means for supplying cutting water to a cutting part by the cutting blade 43. The cutting device further includes ultrasonic generation means 6 comprising: vibration plates 61, with the cutting blade 43 positioned in the middle, disposed over the workpiece in a configuration that a space is reserved between a top face of the workpiece held on the chuck table 3 and the vibration plates 61 so that the cutting water can form a layer in the space; and an ultrasonic vibrator 62 which imparts an ultrasonic vibration to the vibration plate 61.
摘要:
Disclosed herein is a cutter frame including a plurality of cutters for cutting one or more kinds of rectangular unit pieces having a relatively small size from a rectangular base material at a predetermined inclination, the cutters being mounted or formed in the cutter frame such that the cutters correspond to the rectangular unit pieces, two of the rectangular unit pieces being arranged mainly in the inclination direction such that the rectangular unit pieces are in contact with each other at one side of each rectangular unit piece, wherein, on the assumption that imaginary vertex coordinates of a leftmost end are (Ax, Ay), and imaginary vertex coordinates of a rightmost end are (Bx, By), when the rectangular unit pieces coincide with each other at a left or right side of each rectangular unit piece, vertex coordinates (B′x, B′y) of the rightmost end are greater than the imaginary vertex coordinates (Bx, By) of the rightmost end based on the imaginary vertex coordinates (Ax, Ay) of the leftmost end in an array having a higher cutting area ratio than the imaginary array.
摘要:
PROBLEM TO BE SOLVED: To provide a method and system for automating control of fluid jet orientation parameters. SOLUTION: Example embodiments provide a Dynamic Waterjet Control System (DWCS) 401 to dynamically control an orientation of jet relative to a material to be cut as a function of speed and other process parameters. Orientation parameters include, for example, an x-y position of the jet along a cutting path, as well as three dimensional orientation parameters of the jet, such as standoff compensation values and taper and lead angles of a cutting head. In one embodiment, the DWCS 401 uses a set of predictive models to determine these orientation parameters. The DWCS 401 preferably comprises: a motion program generator/kernel 402; a user interface 403; one or more replaceable orientation and process models; and a communication interface to a fluid jet apparatus controller. COPYRIGHT: (C)2010,JPO&INPIT