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    BRIGHTENER FOR ELECTROLESS NICKEL PLATING SOLUTION
    1.
    发明专利
    BRIGHTENER FOR ELECTROLESS NICKEL PLATING SOLUTION 失效

    公开(公告)号：JPS59232262A

    公开(公告)日：1984-12-27

    申请号：JP10671083

    申请日：1983-06-16

    Applicant: HONMA NORITOSHI

    Inventor： HONMA NORITOSHI

    IPC: C23C18/34 ,  C23C3/02

    Abstract: PURPOSE:To form bright adhesive plating of a uniform thickness on an article of a complex shape, a plastic article or the like by using TeO2 as a brightener. CONSTITUTION:TeO2 is added as a brightener to an electroless nickel plating soln. to such a degree that it is present in a supersatd. state. Since TeO2 is almost insoluble in the plating soln., it is practically added by about several ppm/l.

    FORMATION OF ELECTRODE FOR ELECTRONIC PARTS
    2.
    发明专利
    FORMATION OF ELECTRODE FOR ELECTRONIC PARTS 失效

    公开(公告)号：JPS59232260A

    公开(公告)日：1984-12-27

    申请号：JP10674483

    申请日：1983-06-16

    Applicant: TOSHIBA KK

    Inventor： HIGASHINAKAGAHA IWAO

    IPC: C23C18/14 ,  C23C18/16 ,  H01L21/288 ,  H01L21/3205 ,  H05K3/18 ,  C23C3/02 ,  H01L21/88

    Abstract: PURPOSE:To minimize heating of an aq. soln. contg. a metallic salt and a reducing agent and to obtain an electrode for electronic parts formed with a metal lic layer in the desired part of a substrate by irradiating light to the substrate held in said soln. to accelerate reduction reaction. CONSTITUTION:A semiconductor substrate 11 which is formed with apertures after formation of an insulating film 2 is held in a bath tank 26. The bath is composed of, for example, 10g nickel sulfate and 100ml/l hydrazine in 1l water. Laser light is then irradiated from a laser oscillator 21 through X-, Y mirrors 22, 23, a condenser lens 24 and an optical window 25 at 4W power to the substrate 11. The substrate 11 is then instantaneously heated up to accelerate reduction reaction so that an Ni metallic layer 4 is deposited only inside the apertures (connecting holes) 13. An electrode for electronic parts which is filled with the metal only in the connecting parts and is formed with the fine wiring layer with good reliability is thus obtd.

    Method for plating bundle of fiber
    3.
    发明专利
    Method for plating bundle of fiber 失效
    光纤敷设方法

    公开(公告)号：JPS59215499A

    公开(公告)日：1984-12-05

    申请号：JP8987083

    申请日：1983-05-20

    Applicant: Hitachi Cable Ltd

    Inventor： KAYANE KOUICHI ,  SASAKI SATOSHI ,  HAGITANI SHIGEO ,  YOSHIOKA OSAMU ,  ISHIKAWA TETSUO ,  SATO HIDEAKI

    IPC: C25D7/00 ,  C23C18/16 ,  C23C18/31 ,  C25D7/06 ,  D06M11/00 ,  D06M11/83 ,  D06M11/84 ,  D06M101/00 ,  D06M101/40 ,  C23C3/02

    Abstract: PURPOSE: To carry out uniform plating by linking a mechanism for winding a bundle of plated fibers around a reel to a stopper mechanism for keeping a not- tension state.
    CONSTITUTION: A bundle 1 of fibers is immersed in a plating soln. 2 in a plating vessel 3, and it is wound around a reel 14 after plating. At this time, a stopper mechanism 7 at one end of the vessel 3 is worked to move vertically a holder 9 whenever a fixed cycle passes. When the holder 9 is moved downward and holds the bundle 1, the bundle 1 slacks in the vessel 3 in a non-tension state, and the fibers are unbundled and plated separately. The holder 9 is then moved upward and releases the bundle 1. The reel 14 winds the bundle 1 synchronously with the release.
    COPYRIGHT: (C)1984,JPO&Japio

    Abstract translation: 目的：通过将用于将一束电镀纤维缠绕在卷轴上的机构连接到用于保持张力状态的止动机构来进行均匀电镀。 构成：将一束纤维浸入电镀溶液中。 2，在电镀槽3中卷绕在卷盘14上。 此时，在固定循环经过的同时，将容器3的一端的止动机构7加工成使支架9垂直移动。 当保持器9向下移动并保持束1时，束1在非张力状态下在容器3中松弛，并且将纤维分开并分开镀覆。 然后保持器9向上移动并释放束1.卷轴14与释放同步地卷绕束1。

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