公开(公告)号：KR1020100043147A

公开(公告)日：2010-04-28

申请号：KR1020097026925

申请日：2007-11-29

Applicant: 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드

Inventor： 브룰랜드켈리제이. ,  반데르기에센클린트 ,  에잇젠두아네

IPC: H01L21/268 ,  H01L21/78 ,  H01L21/02

CPC classification number: B23K26/0853 ,  B23K26/042 ,  B23K26/082 ,  B23K26/351 ,  B23K2201/40 ,  G11C17/143 ,  G11C29/006 ,  G11C29/028 ,  G11C29/56 ,  H01L21/76894

Abstract: Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer.

Abstract translation: 系统和方法自动修改基于激光的系统，以处理目标样品，如半导体晶圆。 在一个实施例中，基于激光的系统检测与处理模型相关联的触发。 处理模型对应于一组晶片。 响应于触发，系统根据处理模型自动调整一个或多个系统参数。 然后，系统使用修改的系统参数来选择性地照射在该组晶片中的至少一个晶片上或其内的结构。 在一个实施例中，触发器包括与运动级相关的热状态的变化。 响应于热状态的变化，系统以一系列运动运行运动阶段，直到达到热平衡阈值。 运动顺序可以例如模拟用于处理特定晶片的运动。

公开(公告)号：KR1020100035175A

公开(公告)日：2010-04-02

申请号：KR1020107002396

申请日：2008-08-29

Applicant: 미쓰보시 다이야몬도 고교 가부시키가이샤

Inventor： 모리타히데키 ,  아리마노리후미

IPC: B23K26/10 ,  B23K26/40 ,  B28D5/00 ,  B28D7/04

CPC classification number: B28D7/043 ,  B23K26/082 ,  B23K26/40 ,  B23K2203/50 ,  B28D1/225

Abstract: Provided is a laser processing apparatus which can easily and surely perform steps from double face scribing to double face breaking. The laser processing apparatus is provided with a first beam scanning optical system (22a), which shapes a beam into a first beam composed of a parallel luminous flux and guides the first beam to a substrate front surface for scanning; a second beam scanning optical system (22b), which shapes a beam into a second beam composed of a parallel luminous flux and guides the second beam to a substrate rear surface for scanning; and a table having a substrate placing surface (41) divided by a groove (49) to be an optical path for guiding the second beam to the substrate rear surface. On the substrate placing surface, floating mechanisms (41, 47) are formed of a porous member for floating the substrate by blowing a gas to the substrate. An abutting section (54) is arranged for limiting movement of the substrate in the horizontal direction by abutting to the side surface of the floated substrate. Double face scribing is performed to the substrate in a state where the substrate is placed on the substrate placing surface, and the substrate is broken from each surface in the floated state.

Abstract translation: 提供一种可以容易且可靠地从双面划线到双面打破的步骤的激光加工装置。 该激光加工装置设置有第一光束扫描光学系统（22a），其将光束成形为由平行光束组成的第一光束，并将第一光束引导到基板前表面进行扫描; 第二光束扫描光学系统（22b），其将光束成形为由平行光束组成的第二光束，并将第二光束引导到基板后表面进行扫描; 以及具有被作为用于将第二光束引导到基板背面的光路的凹槽（49）分割的基板放置面（41）的台。 在基板放置表面上，浮动机构（41,47）由多孔构件形成，用于通过向衬底吹气体来浮置衬底。 布置有邻接部分（54），用于通过邻接漂浮的基底的侧表面来限制基底在水平方向上的移动。 在基板被放置在基板放置面上的状态下对基板进行双面划线，并且基板从浮置状态的各表面断开。

公开(公告)号：KR1020100020727A

公开(公告)日：2010-02-23

申请号：KR1020080079453

申请日：2008-08-13

Applicant: 삼성전기주식회사

Inventor： 윤도영 ,  나기룡 ,  전영진

IPC: B23K26/02 ,  B23K26/38 ,  B23K26/00

CPC classification number: B23K26/0853 ,  B23K26/042 ,  B23K26/082 ,  B23K26/382 ,  B23K2201/38

Abstract: PURPOSE: A laser processing apparatus and method are provided to cut an accurate hole on a substrate by correcting a position error of the hole. CONSTITUTION: A laser processing apparatus comprises a stage(110), a laser oscillator(120), a scanner(130), and a camera(140). The stage on which a substrate(100) is placed is electrically connected to a stage driving unit(112). The laser oscillator projects a laser beam(L) which propagates to the substrate and forms a hole on the substrate. The scanner comprising a first and a second optical section(132,136) and a laser scanner(134) is located on the optical path of the laser beam from the laser oscillator. The camera comprises a first pickup camera(142).

Abstract translation: 目的：提供一种激光加工装置和方法，通过校正孔的位置误差来切割基板上的精确孔。 构成：激光加工装置包括台（110），激光振荡器（120），扫描器（130）和照相机（140）。 放置基板（100）的台阶与台架驱动单元（112）电连接。 激光振荡器投射激光束（L），其传播到衬底并在衬底上形成孔。 扫描仪包括第一和第二光学部分（132,136）和激光扫描器（134），其位于来自激光振荡器的激光束的光路上。 相机包括第一拾取相机（142）。

公开(公告)号：KR1020090116740A

公开(公告)日：2009-11-11

申请号：KR1020097016607

申请日：2008-02-22

Applicant: 피코데온 리미티드 오와이

Inventor： 루트자리 ,  밀리마키베사 ,  라팔라이넨레이조 ,  풀리라세 ,  마키탈로주하 ,  일라탈로삼포

IPC: C23C14/28 ,  B23K26/0622 ,  H01J37/32

CPC classification number: B23K26/0821 ,  B23K26/067 ,  B23K26/0673 ,  B23K26/082 ,  C23C14/28 ,  H01J37/32339

Abstract: The invention relates in general level to radiation transference techniques as applied for utilisation of material handling. The invention relates to a radiation source arrangement comprising a path of radiation transference, or an improved path of radiation transference, which path comprises a scanner or an improved scanner. The invention also concerns a target material suitable for vaporization and/or ablation. The invention concerns an improved scanner. The invention concerns also to a vacuum vaporization/ablation arrangement that has a radiation source arrangement according to invention. The invention concerns also a target material unit, to be used in coating and/or manufacturing target material.

Abstract translation: 本发明一般涉及用于材料处理利用的辐射转移技术。 本发明涉及一种辐射源装置，其包括辐射传播路径或改进的辐射传播路径，该路径包括扫描器或改进的扫描仪。 本发明还涉及适于蒸发和/或消融的靶材料。 本发明涉及一种改进的扫描仪。 本发明还涉及具有根据本发明的辐射源装置的真空蒸发/消融装置。 本发明还涉及用于涂覆和/或制造目标材料的靶材料单元。

公开(公告)号：KR100915160B1

公开(公告)日：2009-09-03

申请号：KR1020070084821

申请日：2007-08-23

Applicant: 미쓰비시덴키 가부시키가이샤

Inventor： 타케구치토루 ,  유라신스케

IPC: H01L29/786 ,  H01L21/324

CPC classification number: H01L21/02675 ,  B23K26/064 ,  B23K26/066 ,  B23K26/0738 ,  B23K26/082 ,  B23K26/083 ,  B23K26/40 ,  B23K2201/42 ,  B23K2203/50 ,  H01L21/02532 ,  H01L21/02691 ,  H01L21/2026 ,  H01L27/1285 ,  H01L27/1296 ,  H01L29/04

Abstract: 본 발명은, 결정 입자 지름이 작고, 등간격으로 격자 모양으로 정렬한 결정 입자를 가지는 반도체 박막, 박막 트랜지스터, 그것들의 제조 방법 및 반도체 박막의 제조 장치를 얻는 것을 목적으로 한다. 본 발명에 따른 반도체 박막은, 비정질의 반도체 박막에 레이저광(12)을 조사함으로써 다결정화된 것이다. 그리고, 본 발명에 따른 반도체 박막은, 결정 입자(6)가 격자 모양으로 정렬하고 있다. 또한 결정 입자(6)의 크기는, 레이저광(12)의 발진 파장의 대략 절반이 되고 있다.

公开(公告)号：KR1020090086518A

公开(公告)日：2009-08-13

申请号：KR1020097007567

申请日：2007-09-14

Applicant: 노반타 코포레이션

Inventor： 구,보

IPC: B23K26/386 ,  H01S3/10 ,  B23K26/0622

CPC classification number: B23K26/0622 ,  B23K26/082 ,  B23K26/351 ,  B23K26/40 ,  B23K2201/40 ,  B23K2203/50

Abstract: A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed. ® KIPO & WIPO 2009

Abstract translation: 提供了一种用于工件上不同类型的激光加工对象的方法和系统。 该方法包括设置一个或多个激光脉冲的激光脉冲宽度，以基于待处理的第一类型的目标选择性地提供具有一个或多个设定脉冲宽度的一个或多个激光输出脉冲。 该方法还包括设置一个或多个输出脉冲的脉冲形状，以根据待处理的目标的类型选择性地提供具有设定脉冲形状的一个或多个输出脉冲。 该方法还包括将具有一个或多个设定脉冲宽度的一个或多个输出脉冲和设定的脉冲形状传送到第一类型的至少一个目标。 该方法最终包括重置一个或多个激光脉冲的激光脉冲宽度，以基于待处理的第二类型的目标选择性地提供具有一个或多个复位脉冲宽度的一个或多个激光输出脉冲。 ®KIPO＆WIPO 2009

公开(公告)号：KR100864863B1

公开(公告)日：2008-10-23

申请号：KR1020070045105

申请日：2007-05-09

Applicant: 주식회사 이오테크닉스

Inventor： 성규동

IPC: H01L21/02 ,  H01L21/00

CPC classification number: B23K26/0608 ,  B23K26/0604 ,  B23K26/082

Abstract: A multi-laser system is provided to reduce a processing time and to enhance productivity by performing all processing works with only one system. A first laser oscillator(110) outputs a first laser beam. A second laser oscillator(120) outputs a second laser beam. A first scanner couple(131) receives the first laser beam from the first laser oscillator and deflects the first laser beam to a desired position on a substrate. A second scanner couple(132) receives the second laser beam from the second laser oscillator and deflects the second laser beam to a desired position on the substrate. A shuttle unit(150) is arranged between the first laser oscillator and the first scanner couple and between the second laser oscillator and the second scanner couple in order to transmit or shield incident laser beams. A scan lens(140) receives the laser beams through the scanner couples in order to concentrate the laser beams on a spot of a predetermined diameter and to irradiate the concentrated laser beams onto the substrate.

Abstract translation: 提供多激光系统以通过仅使用一个系统执行所有处理工作来减少处理时间并提高生产率。 第一激光振荡器（110）输出第一激光束。 第二激光振荡器（120）输出第二激光束。 第一扫描器耦合（131）从第一激光振荡器接收第一激光束并将第一激光束偏转到衬底上的期望位置。 第二扫描器耦合（132）从第二激光振荡器接收第二激光束，并将第二激光束偏转到基板上的期望位置。 穿梭单元（150）布置在第一激光振荡器和第一扫描器耦合之间以及第二激光振荡器和第二扫描器耦合之间，以便透射或屏蔽入射的激光束。 扫描透镜（140）通过扫描器对接收激光束，以便将激光束集中在预定直径的点上，并将集中的激光束照射到基板上。

公开(公告)号：KR1020080079177A

公开(公告)日：2008-08-29

申请号：KR1020080005002

申请日：2008-01-16

Applicant: 가부시기가이샤 디스코

Inventor： 고바야시유타카 ,  네하시고우이치 ,  노마루게이지

IPC: B23K26/00 ,  B23K26/70 ,  H01S3/067 ,  G02B6/04

CPC classification number: H01L21/67092 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853

Abstract: A laser beam irradiation apparatus and a laser beam machining apparatus are provided to perform high accuracy machining by maintaining an acousto-optical device comprising an acousto-optical deflection unit in a temperature predetermined range. A laser beam irradiation apparatus(52) comprises: a laser beam oscillation unit(6) including a pulsed laser beam oscillator(61) for oscillating a pulsed laser beam, and a repetition frequency setting unit(62) for setting a repetition frequency of the pulsed laser beam oscillated from the pulsed laser beam oscillator; an acousto-optical deflection unit(7) including an acousto-optical device(71) for deflecting an optical axis of the pulsed laser beam oscillated from the laser beam oscillation unit, an RF oscillator(72) for applying RF to the acousto-optical device, a deflection angle adjusting unit(74) for adjusting the frequency of the RF outputted from the RF oscillator, and an output adjusting unit(75) for adjusting the amplitude of the RF generated from the RF oscillator; a control unit(8) for controlling the acousto-optical deflection unit and the output adjusting unit; and a condenser(9) for condensing the laser beam deflected by the acousto-optical deflection unit, wherein the control unit, based on a repetition frequency setting signal from the repetition frequency setting unit, outputs to the deflection angle adjusting unit a first driving pulse signal with a predetermined time width comprising the pulse width of the pulsed laser beam oscillated by the pulsed laser beam oscillator, outputs a second driving pulse signal to the output adjusting unit, and outputs to the RF oscillator a correction pulse signal between driving pulses consisting of the first driving pulse signal and the second driving pulse signal.

Abstract translation: 提供一种激光束照射装置和激光束加工装置，通过将包括声光偏转装置的声光装置保持在预定温度范围内来进行高精度的加工。 激光束照射装置（52）包括：激光束振荡单元（6），包括用于振荡脉冲激光束的脉冲激光束振荡器（61），以及重复频率设定单元（62），用于设定 脉冲激光束从脉冲激光束振荡器振荡; 包括用于偏转从激光束振荡单元振荡的脉冲激光束的光轴的声光装置（71）的声光偏转单元（7），用于将RF施加到声光的RF振荡器（72） 装置，用于调节从RF振荡器输出的RF的频率的偏转角调整单元（74），以及用于调整从RF振荡器产生的RF的幅度的输出调整单元（75） 控制单元（8），用于控制声光偏转单元和输出调节单元; 以及用于聚光由所述声光偏转单元偏转的激光束的聚光器（9），其中，所述控制单元基于来自所述重复频率设定单元的重复频率设定信号，向所述偏转角调整单元输出第一驱动脉冲 具有包括由脉冲激光束振荡器振荡的脉冲激光束的脉冲宽度的预定时间宽度的信号，将第二驱动脉冲信号输出到输出调节单元，并且将由驱动脉冲组成的驱动脉冲之间的校正脉冲信号输出到RF振荡器 第一驱动脉冲信号和第二驱动脉冲信号。

公开(公告)号：KR1020080074700A

公开(公告)日：2008-08-13

申请号：KR1020070106541

申请日：2007-10-23

Applicant: 웨이퍼마스터스, 인코퍼레이티드

Inventor： 유우식 ,  강기택

IPC: H01L21/268 ,  H01L21/66

CPC classification number: G01N21/718 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/40 ,  B23K2203/50 ,  G01N2021/1782 ,  G01N2021/8416 ,  H01L21/268

Abstract: A system and a method for processing a semiconductor material and an apparatus are provided to realize the characterization of a semiconductor substrate, a monitoring, and a control process by using a focused laser beam. A laser beam of a selected wavelength and a selected peak power is provided(810). The laser beam is modulated so that a pulse having a discontinuous pulse width is provided(820). The laser beam is focused on a surface of a semiconductor material(830). Total energy in each laser pulse is controlled by a selected value(840). The laser beam in a pattern programmed on a surface of the semiconductor material is scanned(850). The semiconductor material is changed. The selected wavelength is between about 140 nm and 3 mum. The discontinuous pulse width is between 10 fm second and 100 mm second. The total energy at every selected pulse is between about 1 micro joule and 1 joule.

Abstract translation: 提供了一种用于处理半导体材料的系统和方法以及装置，以通过使用聚焦激光束实现半导体衬底的表征，监测和控制过程。 提供所选波长的激光束和选定的峰值功率（810）。 调制激光束使得具有不连续脉冲宽度的脉冲（820）。 激光束聚焦在半导体材料（830）的表面上。 每个激光脉冲中的总能量由选定值（840）控制。 扫描在半导体材料的表面上编程的图案中的激光束（850）。 半导体材料改变了。 所选择的波长在约140nm和3μm之间。 不连续的脉冲宽度在10fm秒到100mm之间。 每个选定脉冲的总能量在约1微焦耳和1焦耳之间。

公开(公告)号：KR1020080052571A

公开(公告)日：2008-06-11

申请号：KR1020087005265

申请日：2006-07-27

Applicant: 사이버 레이저 가부시끼가이샤

Inventor： 츠지카와스스무 ,  오타니요시오 ,  스미요시테츠미

IPC: G02F1/13 ,  G02B5/20

CPC classification number: G02F1/133516 ,  B23K26/0624 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2203/172

Abstract: A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate (2) is scanned with a beam in a parallel direction, while irradiating a protrusion (8) generated on the color filters (3-1, 3-2, 3-3) formed on a transparent substrate (2) with a beam collected by a high NA condensing lens (18), and the protrusion (8) is removed or modified.

Abstract translation: 提供了通过使用短脉冲激光器去除和修改突起的方法来修改滤色器。 在滤色器修改方法中，在平行方向上用光束扫描透明基板（2），同时照射在形成于其上的滤色器（3-1,3-2,3-3）上产生的突起（8） 具有由高NA聚光透镜（18）收集的光束的透明基板（2），并且突出部（8）被去除或修改。