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公开(公告)号：KR101115855B1
公开(公告)日：2012-03-08
申请号：KR1020077017685
申请日：2006-02-28
申请人： 덴카 주식회사
CPC分类号： C09K11/7734 , B82Y30/00 , C04B35/597 , C04B35/62675 , C04B35/6281 , C04B35/62813 , C04B35/62884 , C04B35/62892 , C04B35/62897 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3224 , C04B2235/3225 , C04B2235/3229 , C04B2235/3409 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/3895 , C04B2235/441 , C04B2235/442 , C04B2235/445 , C04B2235/446 , C04B2235/5296 , C04B2235/5436 , C04B2235/5454 , C04B2235/549 , C04B2235/72 , C04B2235/724 , C04B2235/766 , C04B2235/767 , C04B2235/79 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T428/2993 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： 일반식 : (M1)(M2)(Si)(Al)(O)(N)(단, M1 은 Li, Mg, Ca, Y 및란타니드금속 (La 와 Ce 를제외한다) 으로이루어지는군에서선택되는 1 종이상의원소이고, M2 는 Ce, Pr, Eu, Tb, Yb 및 Er 에서선택되는 1 종이상의원소이고, 0.3≤X+Y≤1.5, 0
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公开(公告)号：KR1020000035298A
公开(公告)日：2000-06-26
申请号：KR1019990049209
申请日：1999-11-08
申请人： 덴카 주식회사
IPC分类号： C04B35/565
CPC分类号： C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C22C32/0063 , H01L23/3733 , H01L2924/0002 , Y10T428/12007 , Y10T428/249957 , Y10T428/249971 , Y10T428/249974 , Y10T428/24998 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B35/565 , C04B38/00 , H01L2924/00
摘要： PURPOSE: A highly thermal-conductive silicon carbide composite material is provided which has excellent thermal conductive characteristics, a light weight, and suitable as a heatsink for semiconductor parts such as a ceramic substrate or an IC package. CONSTITUTION: A silicon carbide composite is a flat composite comprising a porous preform of silicon carbide and a metal containing aluminum as the main component, infiltrated into the porous preform, the composite having a warpage of at most 250μm per 10cm of the principal plane length of the composite.
摘要翻译： 目的：提供高导热性碳化硅复合材料，其具有优异的导热特性，重量轻，并且适用于诸如陶瓷基板或IC封装的半导体部件的散热器。 构成：碳化硅复合材料是一种平面复合材料，包括碳化硅多孔预制件和含有铝的金属作为主要成分，渗透到多孔预制件中，该复合材料的翘曲最大为250μm/ 10cm的主平面长度 复合材料。
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公开(公告)号：KR1020070106507A
公开(公告)日：2007-11-01
申请号：KR1020077017685
申请日：2006-02-28
申请人： 덴카 주식회사
CPC分类号： C09K11/7734 , B82Y30/00 , C04B35/597 , C04B35/62675 , C04B35/6281 , C04B35/62813 , C04B35/62884 , C04B35/62892 , C04B35/62897 , C04B2235/3203 , C04B2235/3206 , C04B2235/3208 , C04B2235/3224 , C04B2235/3225 , C04B2235/3229 , C04B2235/3409 , C04B2235/3865 , C04B2235/3869 , C04B2235/3873 , C04B2235/3895 , C04B2235/441 , C04B2235/442 , C04B2235/445 , C04B2235/446 , C04B2235/5296 , C04B2235/5436 , C04B2235/5454 , C04B2235/549 , C04B2235/72 , C04B2235/724 , C04B2235/766 , C04B2235/767 , C04B2235/79 , H01L33/502 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2924/181 , Y10T428/2993 , H01L2924/00014 , H01L2924/00012 , H01L2924/00
摘要： This invention provides a fluorescent substance as a fluorescent material for white LED using blue LED or ultraviolet LED as a light source. The fluorescent substance comprises E-type sialon represented by general formula: (M1)X(M2)Y(Si)12-(m+n)Al)m+ n(O)n(N)16-n wherein M1 represents one or more elements selected from the group consisting of Li, Mg, Ca, Y, and lanthanide metals (excluding La and Ce); M2 represents one or more elements selected from Ce, Pr, Eu, Tb, Yb, and Er; and 0.3
摘要翻译： 本发明提供了一种荧光物质，作为使用蓝色LED或紫外线LED作为光源的白色LED的荧光材料。 荧光物质包括由通式（M1）X（M2）Y（Si）12-（m + n）Al）m + n（O）n（N）16-n表示的E型赛隆，其中M1表示1或 更多选自Li，Mg，Ca，Y和镧系金属（不包括La和Ce）的元素; M2表示选自Ce，Pr，Eu，Tb，Yb和Er中的一种或多种元素; 和0.3 <= X + Y <= 1.5,0
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公开(公告)号：KR100637635B1
公开(公告)日：2006-10-23
申请号：KR1019990049209
申请日：1999-11-08
申请人： 덴카 주식회사
IPC分类号： C04B35/565
CPC分类号： C04B41/009 , C04B41/5155 , C04B41/88 , C04B2111/00844 , C22C32/0063 , H01L23/3733 , H01L2924/0002 , Y10T428/12007 , Y10T428/249957 , Y10T428/249971 , Y10T428/249974 , Y10T428/24998 , Y10T428/249986 , Y10T428/249987 , Y10T428/24999 , C04B41/4521 , C04B41/4523 , C04B35/565 , C04B38/00 , H01L2924/00
摘要： (과제)
고열전도성을 가짐과 동시에, 비중이 작고, 또한 열팽창 계수가 세라믹스 기판에 가까우며, 게다가, 휨을 갖고 있어 방열 부품 등에 좋은 밀착성으로 접합할 수 있는 방열 부품을 저렴하게 제공한다.
(해결수단)
다공질 탄화규소 성형체에 알루미늄을 주성분으로 하는 금속을 함침하여 이루어지는 판형상 복합체로, 복합체의 주면의 길이 10 ㎝ 에 대한 휨량이 250 ㎛ 이하의 휨을 갖는 탄화규소질 복합체와, 이를 사용하여 이루어지는 방열 부품.
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