반도체 가공 장치용 세라믹 피복 부재
    1.
    发明公开
    반도체 가공 장치용 세라믹 피복 부재 有权
    用于半导体加工设备的陶瓷涂层组件

    公开(公告)号:KR1020070095211A

    公开(公告)日:2007-09-28

    申请号:KR1020070026433

    申请日:2007-03-19

    CPC classification number: C23C28/042 C23C4/02 C23C4/11 C23C4/18 C23C26/00

    Abstract: A ceramic coating member used as a member or a part disposed in a semiconductor processing container to perform a plasma etching process in a corrosive gas atmosphere, and a member which has an excellent durability to plasma erosion in a corrosive gas atmosphere, can suppress the formation of contaminants(particles) and lessens a load for maintaining an apparatus are provided. A ceramic coating member for a semiconductor processing apparatus comprises: a substrate; a porous layer coated on a surface of the substrate and formed of an oxide of an element in Group IIIa of the periodic table of the elements; and a secondary recrystallized layer of the oxide formed on the porous layer. The ceramic coating member comprises an undercoat is disposed between the substrate and the porous layer. The substrate is (1) aluminum and an alloy thereof, titanium and an alloy thereof, stainless steel and other special steels, Ni-based alloy, and other metals and alloys thereof, (2) a ceramic of quartz, glass or an oxide or a carbide, a boride, a silicide, a nitride or a mixture thereof, (3) a cermet of the ceramic and the metal or alloy, (4) plastics, and (5) a metal plating(electroplating, fusion plating, chemical plating) or a metal deposition film formed on surfaces of the materials (1) to (4). The porous layer is an oxide layer of Sc, Y or a lanthanide of atom number 57 to 71(La, Ce, Pr, Nb, Pm, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu).

    Abstract translation: 用作部件的陶瓷涂层构件或设置在半导体处理容器中以在腐蚀性气体气氛中进行等离子体蚀刻工艺的部件以及在腐蚀性气体气氛中对等离子体侵蚀具有优异耐久性的部件可以抑制形成 的污染物(颗粒)并且减轻用于维持设备的负载。 一种用于半导体处理装置的陶瓷涂层构件包括:基板; 由该元件的周期表第IIIa族元素的氧化物形成在该表面上的多孔层, 和形成在多孔层上的氧化物的二次再结晶层。 陶瓷涂层构件包括在基底和多孔层之间设置底涂层。 基材是(1)铝及其合金,钛及其合金,不锈钢等特殊钢,镍基合金等金属及其合金,(2)石英,玻璃或氧化物的陶瓷, 碳化物,硼化物,硅化物,氮化物或其混合物,(3)陶瓷的金属陶瓷和金属或合金,(4)塑料,(5)金属电镀(电镀,电镀,化学镀 )或形成在材料(1)至(4)的表面上的金属沉积膜。 多孔层是原子数为57〜71(La,Ce,Pr,Nb,Pm,Sm,Eu,Gd,Tb,Dy,Ho,Er,Tm,Yb,Lu)的Sc,Y或镧系元素的氧化物层 )。

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