利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

33 条记录 (耗时 0.021 秒)

    펠리클 및 그것에 이용하는 마스크 접착제
    2.
    发明授权
    펠리클 및 그것에 이용하는 마스크 접착제 有权
    胶囊和面膜粘合剂用于同一种

    公开(公告)号：KR101536393B1

    公开(公告)日：2015-07-13

    申请号：KR1020127032364

    申请日：2011-06-29

    申请人： 미쓰이 가가쿠 가부시키가이샤

    发明人： 다네이치다이키 ,  고제키다카시 ,  고이데아키히로

    IPC分类号： G03F1/62 ,  C09J133/00 ,  C09J153/00

    CPC分类号： G03F1/62 ,  C08L23/20 ,  C08L57/02 ,  C08L91/06 ,  C08L2205/02 ,  C09J135/06 ,  C09J153/025 ,  G03F1/64

    摘要： 노광이행해지는온도영역에서특히소성변형되기쉽고, 마스크로부터박리시킬때의접착제잔류가거의없으며, 취급성이양호한마스크접착제층을갖는, 패턴의위치어긋남을억제가능한펠리클을제공하는것을과제로한다. 상기과제를해결하기위해, 펠리클프레임(14)과, 펠리클막(12)과, 마스크접착제를포함하는마스크접착제층(15)을구비한펠리클(10)로한다. 마스크접착제는, tanδ피크온도가 -20∼30℃인열가소성엘라스토머(A) 100질량부와, 점착부여수지(B) 20∼150질량부를포함하고, 열가소성엘라스토머(A)는스타이렌계열가소성엘라스토머, (메트)아크릴산에스터계열가소성엘라스토머및 올레핀계열가소성엘라스토머로이루어지는군으로부터선택되는적어도 1종이며, 마스크접착제의 tanδ피크온도가 -10∼30℃로한다.

    접착제 조성물, 접착 필름 및 열처리 방법
    4.
    发明公开
    접착제 조성물, 접착 필름 및 열처리 방법 有权
    胶粘组合物，胶粘剂和热处理方法

    公开(公告)号：KR1020090131253A

    公开(公告)日：2009-12-28

    申请号：KR1020090052703

    申请日：2009-06-15

    申请人： 도오꾜오까고오교 가부시끼가이샤

    发明人： 아사이다카히로 ,  미스미고이치 ,  이마이히로후미

    IPC分类号： C09J179/08 ,  C09J7/02

    CPC分类号： C09J133/14 ,  C09J133/12 ,  C09J135/06 ,  Y10T428/2852 ,  Y10T428/2861 ,  Y10T428/2887 ,  Y10T428/2896 ,  C08F212/08 ,  C08F220/14 ,  C08F2222/402 ,  C09J2203/326

    摘要： PURPOSE: An adhesive composition is provided to ensure high adhesive strength, heat resistance and alkali resistance in a high temperature environment, and to be separated form a semiconductor wafer and chip after high-temperature process. CONSTITUTION: An adhesive composition comprises a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group as a main material; and further a thermopolymerization inhibitor. The content of the thermal polymerization inhibitor is 0.1-10.0 mass % or less. The content of the monomer having a maleimide group within the monomer composition is 1.0-25 mass %.

    摘要翻译： 目的：提供一种粘合剂组合物，以确保高温环境下的高粘合强度，耐热性和耐碱性，并在高温过程后由半导体晶片和芯片分离。 组成：粘合剂组合物包含通过共聚含有以马来酰亚胺基为单体的单体组合物作为主要材料得到的聚合物; 并进一步加入热聚合抑制剂。 热聚合抑制剂的含量为0.1-10.0质量％以下。 单体组合物中具有马来酰亚胺基团的单体的含量为1.0〜25质量％。

    중합체 및 조성물
    5.
    发明公开
    중합체 및 조성물 无效
    聚合物和组合物

    公开(公告)号：KR1020080055899A

    公开(公告)日：2008-06-19

    申请号：KR1020087008464

    申请日：2006-09-07

    申请人： 올넥스 벨지움 에스.에이.

    发明人： 듀퐁,올리비에르 ,  토빙,신가 ,  리우,휴이

    IPC分类号： C08F220/18 ,  C08F220/14 ,  C09J133/06

    CPC分类号： C08F220/18 ,  C08F220/14 ,  C09D133/04 ,  C09D133/08 ,  C09D135/06 ,  C09J133/04 ,  C09J133/08 ,  C09J135/06 ,  C09J2201/606

    摘要： There is disclosed a polymer (Polymer P) which is obtained and/or is obtainable from a monomer composition comprising (a) from about 5% to about 95% by weight of at least one C2-12alkyl acrylate; (b) from about 2.5% to about 60% by weight of at least one polymer precursor selected from the group consisting of: C1-30 alkyl (meth)acrylates, C2-30 vinyl aromatic compounds, C2-30 vinyl halides, C2-30 vinyl nitriles, C2-30 vinyl esters of carboxylic acids and mixtures thereof; with the provisos that (i) the homopolymers of each of said polymer precursor(s) have a Tg above about-25°C; and (ii) each of said polymer precursor(s) comprises other than a functional group selected from the group consisting of: hydroxy, carboxy, acid anhydride, nitro, epoxy and amino ;(c) from about 0.1 % to about 2% by weight of at least one polymer precursor comprising at least one activated unsaturated moiety (conveniently ethylenically unsaturated monomer) having at least one carboxy and/or acid anhydride group(s); and (d) optionally up to about 60% by weight of at least one further optionally substituted polymer precursor comprising at least one activated unsaturated moiety (conveniently ethylenically unsaturated monomer) where the further optional substituent(s) are other than carboxy and/or acid anhydride group(s) where each of the constituents 'a', 'b' and 'c' and optionally constituent 'd' are different from each other with the additional proviso that Polymer P was obtained and/or is obtainable by polymerisation of the each of the constituents 'a', 'b' and 'c' and optionally constituent 'd' in the presence of a water soluble initiator in an amount above about 0.35% and optionally up to about 2% by weight of the total monomer composition.

    摘要翻译： 公开了一种聚合物（聚合物P），其由单体组合物获得和/或获得，所述单体组合物包含（a）约5重量％至约95重量％的至少一种丙烯酸C2-12烷基酯; （b）约2.5％至约60％重量的至少一种选自以下的聚合物前体：（甲基）丙烯酸C1-30烷基酯，C2-30乙烯基芳族化合物，C2-30乙烯基卤化物，C2- 30乙烯基腈，羧酸的C2-30乙烯基酯及其混合物; 条件是（i）每种所述聚合物前体的均聚物具有高于约-25℃的Tg; 和（ii）所述聚合物前体中的每一个除了选自羟基，羧基，酸酐，硝基，环氧基和氨基的官能团之外;（c）约0.1％至约2％ 至少一种包含至少一种具有至少一个羧基和/或酸酐基团的活化不饱和部分（方便的烯属不饱和单体）的聚合物前体的重量; 和（d）任选地至多约60重量％的至少一种另外的任选取代的聚合物前体，其包含至少一个活化的不饱和部分（方便的烯键式不饱和单体），其中另外任选的取代基不是羧基和/或酸 组分“a”，“b”和“c”和任选的组分“d”中的每一个都是不同的，附加条件是获得聚合物P和/或可通过聚合 在水溶性引发剂存在下，每种组分“a”，“b”和“c”和任选的组分“d”，其量高于总单体组合物的约0.35重量％，最优选约2重量％ 。

    접착력 유지가 우수한 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름
    10.
    发明公开
    접착력 유지가 우수한 이방 전도성 필름용 조성물 및 이를 이용한 이방전도성 필름 有权
    具有良好维护粘合强度和使用其的各向异性导电膜的各向异性导电膜组合物

    公开(公告)号：KR1020080060613A

    公开(公告)日：2008-07-02

    申请号：KR1020060134933

    申请日：2006-12-27

    申请人： 제일모직주식회사

    发明人： 박경수 ,  신경훈 ,  전병환 ,  윤강배 ,  이천석

    IPC分类号： C09J135/06 ,  C09J129/08 ,  C09J9/02 ,  C09J7/02

    CPC分类号： H01B1/22 ,  C09J7/00 ,  C09J9/02 ,  C09J129/08 ,  C09J135/06 ,  C09J2201/602

    摘要： A composition for an anisotropic conductive film is provided to realize excellent room temperature stability, stable conductivity even under a short-time compression condition, flowability and adhesion maintenance. A composition for an anisotropic conductive film comprises: (i) an ethylene-vinyl acetate copolymer; (ii) a radical polymerizable material; (iii) at least one radical initiator selected from diacyl peroxide, peroxydicarbonate and peroxyester; (iv) at least one radical initiator selected from peroxyketal and dialkyl peroxide; and (v) conductive particles. In a variant, the composition further comprises a film-forming polymer resin.

    摘要翻译： 提供用于各向异性导电膜的组合物，以实现优异的室温稳定性，即使在短时间压缩条件下也具有稳定的导电性，流动性和粘附维持性。 用于各向异性导电膜的组合物包括：（i）乙烯 - 乙酸乙烯酯共聚物; （ii）可自由基聚合的材料; （iii）至少一种选自二酰基过氧化物，过氧化二碳酸酯和过氧酯的自由基引发剂; （iv）至少一种选自过氧缩酮和二烷基过氧化物的自由基引发剂; 和（v）导电颗粒。 在一个变体中，组合物还包含成膜聚合物树脂。