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123 条记录 (耗时 0.029 秒)

    슬라이드 부재
    6.
    发明公开
    슬라이드 부재 无效
    幻灯片会员

    公开(公告)号：KR1020120028841A

    公开(公告)日：2012-03-23

    申请号：KR1020110092589

    申请日：2011-09-14

    申请人： 다이도 메탈 고교 가부시키가이샤

    发明人： 타카야나기사토시 ,  장이 ,  아사쿠라히로유키 ,  카고하라유키히코

    IPC分类号： B32B15/01 ,  F16C33/12

    CPC分类号： C25D5/12 ,  B22F7/04 ,  B32B15/015 ,  C22C9/00 ,  C22C13/00 ,  C22C19/03 ,  C23C6/00 ,  C23C28/021 ,  C23C28/023 ,  C25D7/10 ,  F16C33/124 ,  F16C33/127 ,  F16C2360/22 ,  Y10T428/12722

    摘要： PURPOSE: A slide member is provided to suppress the formation of Sn-Ni-Cu-based compound layer at the interference of a Sn-based overlay layer and a Ni-based intermediate layer by including copper at the sliding layer and the bottom layer of the Sn-based overlay layer. CONSTITUTION: A slide member(11) includes a bearing alloy layer(13), a Ni-based intermediate layer(14) arranged on the bearing alloy layer, and a Sn-based overlay layer(15) arranged on the Ni-based intermediate layer. The Sn-based overlay layer includes at least one layer. A Sn-based sliding layer(15a) forming the Sn-based overlay layer includes Sn and 3 mass% or more of Cu. A Sn-based bottom layer(15b) forming the Sn-based overlay layer includes Sn and 8mass% or less of Cu. The thickness of the Sn-based bottom layer is 0.5um or more.

    摘要翻译： 目的：提供一种滑动构件，以通过在滑动层和底层上包含铜来抑制在Sn基覆盖层和Ni基中间层的干涉下形成Sn-Ni-Cu基化合物层 基于Sn的覆盖层。 构成：滑动构件（11）包括轴承合金层（13），设置在轴承合金层上的Ni基中间层（14）和布置在Ni基中间层上的Sn基覆盖层（15） 层。 基于Sn的覆盖层包括至少一个层。 形成Sn系覆盖层的Sn系滑动层（15a）包括Sn和3质量％以上的Cu。 形成Sn基覆盖层的Sn基底层（15b）包括Sn和8质量％以下的Cu。 Sn基底层的厚度为0.5um以上。

    휘스커가 억제된 Ｃｕ－Ｚｎ 합금 내열 Ｓｎ도금 스트립
    9.
    发明公开
    휘스커가 억제된 Ｃｕ－Ｚｎ 합금 내열 Ｓｎ도금 스트립 有权
    耐高温SN镀铜铜合金条

    公开(公告)号：KR1020090006084A

    公开(公告)日：2009-01-14

    申请号：KR1020087024683

    申请日：2007-04-26

    申请人： 제이엑스금속주식회사

    发明人： 하타노다카아키

    IPC分类号： C25D5/12 ,  C22C9/04 ,  H01R12/51

    CPC分类号： C25D5/12 ,  C22C9/04 ,  C25D5/34 ,  C25D5/50 ,  C25D7/0614 ,  Y10T428/12458 ,  Y10T428/12715 ,  Y10T428/12722 ,  Y10T428/1291

    摘要： An Sn-plated strip which is composed of a basis material consisting of a copper alloy containing Zn in an average concentration of 15 to 40% by mass and a plated coating constituted of an Sn phase layer, an Sn-Cu alloy phase layer and an Ni phase layer present in this order from the surface to the basis material, wherein the Zn concentration of the surface of the Sn phase layer is adjusted to 0.1 to 5.0% by mass. The basis material can contain one or more arbitrary components selected from among Sn, Ag, Pb, Fe, Ni, Mn, Si, Al and Ti in a total amount of 0.005 to 3.0% by mass, while the basis material may be a copper-base alloy which consists of 15-40% by mass Zn, 8 to 20% by mass Ni, 0 to 0.5% by mass Mn, and the balance Cu with unavoidable impurities and which may further contain one or more of the above arbitrary components in a total amount of 0.005 to 10% by mass. Thus, the invention provides a reflow Sn-plated Cu-Zn alloy strip which has a Cu/Ni double undercoat and is suppressed in whiskering.

    摘要翻译： 一种Sn镀带，由含有平均浓度为15〜40质量％的Zn的铜合金构成的基材和由Sn相层，Sn-Cu合金相层和 Ni相层从表面依次存在于基材中，其中，将Sn相层的表面的Zn浓度调整为0.1〜5.0质量％。 基材可以含有选自Sn，Ag，Pb，Fe，Ni，Mn，Si，Al和Ti中的一种以上的任意成分，总量为0.005〜3.0质量％，而基材可以是铜 基质合金，其由15〜40质量％的Zn，8〜20质量％的Ni，0〜0.5质量％的Mn组成，余量Cu为不可避免的杂质，并且还可以含有一种或多种上述任意成分 总量为0.005〜10质量％。 因此，本发明提供了一种具有Cu / Ni双层底涂层并且被抑制在晶须中的回流镀Sn的Cu-Zn合金带。

    주석 도금 강판 및 그 제조 방법
    10.
    发明公开
    주석 도금 강판 및 그 제조 방법 有权
    镀锡钢板及其制造方法

    公开(公告)号：KR1020080046742A

    公开(公告)日：2008-05-27

    申请号：KR1020087009178

    申请日：2006-10-20

    申请人： 제이에프이 스틸 가부시키가이샤

    发明人： 스즈키다케시 ,  마키이시노리코 ,  이와사히로키 ,  다나카다쿠미 ,  시게쿠니도모후미

    IPC分类号： C23C22/08 ,  C23C28/00 ,  C25D11/36

    CPC分类号： C23C22/08 ,  C23C22/74 ,  C23C28/321 ,  C23C28/322 ,  C23C28/345 ,  C25D3/30 ,  C25D5/10 ,  C25D5/48 ,  C25D9/08 ,  Y10T428/12618 ,  Y10T428/12722 ,  Y10T428/12972 ,  Y10T428/12979 ,  Y10T428/27

    摘要： A tin plated steel sheet comprising a steel sheet, a tin-containing plating layer superimposed on at least one major surface of the steel sheet and a chemical treatment film containing P and tin superimposed on the plating layer, wherein the chemical treatment film adheres in an amount of 1.0 to 50 mg/m^2 or more in terms of P per surface, and wherein as determined from the P2p peak and Sn3d peak intensities of the chemical treatment film measured from the surface according to X-ray photoelectron spectroscopy, the atomic ratio of Sn to P, Sn/P, is in the range of 1.0 to 1.5, while as determined from the P2p peak and O1s peak intensities, the atomic ratio of O to P, O/P, is in the range of 4.0 to 9.0. Phosphate chemical treatment film provided on the tin plated steel sheet, as a replacement of conventional chromate film, is capable of inhibiting performance deterioration attributed to growth of tin oxide film at its surface layer.

    摘要翻译： 一种镀锡钢板，包括钢板，叠加在钢板的至少一个主表面上的含锡镀层和包含叠加在镀层上的P和锡的化学处理膜，其中化学处理膜附着在 根据表面的P表示的量为1.0〜50mg / m 2以上，其中，根据由X射线光电子能谱测定的表面的化学处理膜的P2p峰值和Sn3d峰值强度， Sn与P，Sn / P的比例在1.0〜1.5的范围内，从P2p峰和O1s峰强度求出，O与P，O / P的原子比在4.0〜 9.0。 提供在镀锡钢板上的磷酸盐化学处理膜作为常规铬酸盐膜的替代物，能够抑制由于其表面层上的氧化锡膜的生长引起的性能劣化。