摘要:
A method is disclosed for connecting two components with functional parts in a predetermined alignment such as a semiconductor laser and motherboard including forming the laser by processing in which a radiation outlet and alignment structure are provided in a predetermined position with respect to each other, similarly forming on the motherboard, a waveguide and alignment structure, mounting the laser on the motherboard in a generally aligned position, providing solder between metal pads on the laser and motherboard and utilizing the surface tension of the molten metal extending between the pads to move the laser into an accurately aligned position on the motherboard.