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1.发明授权Adhesive of substituted oxirane or oxetane compound with silver-based, lead-free solder 有权取代环氧乙烷或氧杂环丁烷化合物与银基，无铅焊料的粘合剂公开(公告)号：US07671114B2
公开(公告)日：2010-03-02
申请号：US12176729
申请日：2008-07-21
CPC分类号： H01L21/563 , C08G59/1455 , C08G59/1494 , C08K5/5435 , C09J163/00 , H01L23/293 , H01L2224/73203 , H01L2924/01004 , H01L2924/01077 , H01L2924/01079
摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.
摘要翻译： 根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。 由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。
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公开(公告)号：US06882058B2
公开(公告)日：2005-04-19
申请号：US10289506
申请日：2002-11-05
申请人： Bruce C. B. Chan , Michael G. Todd
发明人： Bruce C. B. Chan , Michael G. Todd
CPC分类号： C09J11/06 , H01L21/563 , H01L2924/0002 , Y10T428/31511 , H01L2924/00
摘要： In accordance with the present invention, it has been discovered that the addition of organic acids provides improved performance properties to curable compositions, e.g., improved flux compatibility, improved flow properties, improved voiding properties, and the like. Accordingly, there are provided curable compositions having improved performance properties, methods for the preparation thereof, and methods employing same. Also provided are novel articles prepared using invention compositions.
摘要翻译： 根据本发明，已经发现，加入有机酸提供了可固化组合物的改进的性能特性，例如改进的助熔剂相容性，改进的流动性能，改善的排气性能等。 因此，提供了具有改进的性能的可固化组合物，其制备方法和使用它们的方法。 还提供了使用本发明组合物制备的新型制品。
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