公开(公告)号：US07671114B2

公开(公告)日：2010-03-02

申请号：US12176729

申请日：2008-07-21

申请人： John G. Woods ,  Yuhshi Lu ,  Bruce C. B. Chan ,  Philip T. Klemarczyk ,  Andrew D. Messana

发明人： John G. Woods ,  Yuhshi Lu ,  Bruce C. B. Chan ,  Philip T. Klemarczyk ,  Andrew D. Messana

IPC分类号： C08K3/08 ,  C08L63/00 ,  C08L71/00

CPC分类号： H01L21/563 ,  C08G59/1455 ,  C08G59/1494 ,  C08K5/5435 ,  C09J163/00 ,  H01L23/293 ,  H01L2224/73203 ,  H01L2924/01004 ,  H01L2924/01077 ,  H01L2924/01079

摘要： In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

摘要翻译： 根据本发明，已经发现在环氧化物环上含有取代基的缩水甘油基环氧树脂可以与常规的环氧固化剂和助熔剂一起使用，以生产适用于银基合金的底部填充粘合剂。 由于新材料与常规环氧树脂的结构相似性，本发明制剂的物理和材料性能相对于目前使用的产品而言几乎没有改变，因此与现有方法高度兼容。