公开(公告)号：US20050006721A1

公开(公告)日：2005-01-13

申请号：US10886965

申请日：2004-07-07

Applicant: Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

Inventor： Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

IPC: H05K1/03 ,  H05K3/38 ,  H01L29/00

CPC classification number: H05K3/38 ,  H05K1/0306 ,  H05K3/388

Abstract: A structural configuration and manufacture method is applied to manufacture electronic circuits on a ceramic substrate including capacitor and inductors for filters. The electronic circuits have strong bonding to securely adhere to the SOG-coated substrate when the SOG is cured at an elevated temperature supplemented with high nitrogen flow during the curing process. The SOG coated ceramic substrate shows excellent layer compatibilities during temperature variations because reduced differences of thermal coefficients between different layers.

Abstract translation: 应用结构构造和制造方法来制造包括用于滤波器的电容器和电感器的陶瓷基板上的电子电路。 当SOG在固化过程中在补充有高氮气流的升高的温度下固化时，电子电路具有牢固粘附以牢固地粘附到SOG涂覆的基底上。 SOG涂覆的陶瓷基板在温度变化期间显示出优异的层相容性，因为不同层之间的热系数的差异减小。

公开(公告)号：US06387231B1

公开(公告)日：2002-05-14

申请号：US09928519

申请日：2001-08-14

Applicant: Tun-Ho Teng ,  Ching-Chao Wang

Inventor： Tun-Ho Teng ,  Ching-Chao Wang

IPC: C23C1434

CPC classification number: C23C14/50 ,  C23C14/541 ,  C23C14/564

Abstract: A susceptor device in a masked sputtering chamber is disclosed. The device of the present invention comprises a susceptor, a lifter and at least one heater. The susceptor, having at least one trench, is coupled with the lifter having at least one rod. The heater is disposed in the trench and coupled with the rod through the access hole at the bottom of the trench. After the sputtering process for forming indium tin oxide (ITO) film is completed, a baking process is applied to the mask in the chamber for converting the amorphous ITO film formed on the mask to polycrystalline ITO film, thereby increasing the life of the mask.

Abstract translation: 公开了一种在掩模溅射室中的感受器件。 本发明的装置包括基座，升降器和至少一个加热器。 具有至少一个沟槽的感受体与具有至少一个杆的升降器联接。 加热器设置在沟槽中，并通过沟槽底部的通孔与棒连接。 在完成用于形成氧化铟锡（ITO）膜的溅射工艺之后，对用于将形成在掩模上的非晶ITO膜转换为多晶ITO膜的室中的掩模施加烘烤处理，从而延长掩模的寿命。

公开(公告)号：US08137144B1

公开(公告)日：2012-03-20

申请号：US13025527

申请日：2011-02-11

Applicant: Ching-Chao Wang

Inventor： Ching-Chao Wang

IPC: H01R13/187

CPC classification number: H01R13/187 ,  H01R12/58

Abstract: A pin connector includes: a metal outer shell having a tubular wall that has an inner surface, an annular shoulder face that is formed on the inner surface, and a punched rib that protrudes inwardly from the inner surface above the annular shoulder face; and a metal clamping device having an annular wall with an outer surface abutted against the inner surface, a retaining flange, and a plurality of resilient clamp arms. The retaining flange protrudes outwardly from the outer surface of the annular wall to extend over the annular shoulder face and is pressed by the punched rib against the annular shoulder face.

Abstract translation: 针连接器包括：金属外壳，具有内壁表面的管状壁，形成在内表面上的环形肩面，以及从环形肩面上方的内表面向内突出的冲压肋; 以及金属夹持装置，其具有与外表面抵靠的内表面的环形壁，保持凸缘和多个弹性夹紧臂。 保持凸缘从环形壁的外表面向外突出，以在环形肩部表面上延伸并且被冲压肋压靠在环形肩部表面上。

公开(公告)号：US20130162552A1

公开(公告)日：2013-06-27

申请号：US13545656

申请日：2012-07-10

Applicant: Cheng-Chung HUANG ,  Ching-Chao Wang ,  Jeng-Maw Chiou

Inventor： Cheng-Chung HUANG ,  Ching-Chao Wang ,  Jeng-Maw Chiou

IPC: B05D3/06 ,  B05D5/12 ,  G06F3/041

CPC classification number: G06F3/044 ,  G06F2203/04103 ,  G06F2203/04111

Abstract: A touch device and a fabrication method thereof are provided. The touch device includes a cover lens, a light shielding pattern disposed on the cover lens, a UV cut layer disposed on the light shielding pattern and the cover lens, and a plurality of transparent conductive patterns disposed on the UV cut layer, wherein the transparent conductive patterns are formed by using a laser beam to etch a transparent conductive layer.

Abstract translation: 提供一种触摸装置及其制造方法。 触摸装置包括覆盖透镜，设置在覆盖透镜上的遮光图案，设置在遮光图案上的UV切割层和盖透镜，以及设置在UV切割层上的多个透明导电图案，其中透明 通过使用激光束来蚀刻透明导电层来形成导电图案。

公开(公告)号：US07105909B2

公开(公告)日：2006-09-12

申请号：US10886965

申请日：2004-07-07

Applicant: Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

Inventor： Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

IPC: H01L29/00

CPC classification number: H05K3/38 ,  H05K1/0306 ,  H05K3/388

Abstract: A structural configuration and manufacture method is applied to manufacture electronic circuits on a ceramic substrate including capacitor and inductors for filters. The electronic circuits have strong bonding to securely adhere to the SOG-coated substrate when the SOG is cured at an elevated temperature supplemented with high nitrogen flow during the curing process. The SOG coated ceramic substrate shows excellent layer compatibilities during temperature variations because reduced differences of thermal coefficients between different layers.

Abstract translation: 应用结构构造和制造方法来制造包括用于滤波器的电容器和电感器的陶瓷基板上的电子电路。 当SOG在固化过程中在补充有高氮气流的升高的温度下固化时，电子电路具有牢固粘附以牢固地粘附到SOG涂覆的基底上。 SOG涂覆的陶瓷基板在温度变化期间显示出优异的层相容性，因为不同层之间的热系数的差异减小。