公开(公告)号：US5605615A

公开(公告)日：1997-02-25

申请号：US349590

申请日：1994-12-05

Applicant: Peter G. Goolsby ,  Dan R. Ramirez ,  Lei P. Lai

Inventor： Peter G. Goolsby ,  Dan R. Ramirez ,  Lei P. Lai

IPC: C25D5/18 ,  C25D7/12 ,  C25D21/12 ,  C25D5/50 ,  G01N27/26

CPC classification number: C25D21/12 ,  Y10S204/09

Abstract: A method and apparatus for plating metals which delivers a voltage pulse with the possibility of a widely varying current magnitude characteristic to a plating electrode and an object having a large electrical reactance in terms of a parallel resistance and capacitance in order to raise the voltage potential between the electrode and an object to a programmed plating voltage overpotential and underpotential. The programmed plating voltage overpotential determines how fast the electrochemical reaction is allowed to proceed in the diffusion layer, and the programmed voltage underpotential determines how quickly the electrochemical reaction of the diffusion layer will slow down.

Abstract translation: 一种用于电镀金属的方法和装置，其传递电压脉冲，其中电压脉冲具有广泛变化的电流幅值特性，对于电镀电极和具有大并联电阻和电容的大电抗的物体，以便提高电压电平 电极和对象被编程的电镀电压超电势和欠电压。 编程电镀电压超电势决定了电化学反应在扩散层中进行的速度有多快，编程电压欠电位决定了扩散层的电化学反应将如何减慢。