公开(公告)号：US20190189480A1

公开(公告)日：2019-06-20

申请号：US16217188

申请日：2018-12-12

申请人： Ebara Corporation

发明人： Gaku Yamasaki

IPC分类号： H01L21/67 ,  C25D21/12 ,  G05B19/418 ,  C25D17/00

CPC分类号： H01L21/67259 ,  C25D17/001 ,  C25D21/12 ,  G05B19/4189 ,  G05B2219/45031

摘要： A substrate processing apparatus includes: a stage configured to place thereon a substrate or at least a portion of a substrate holding member configured to hold the substrate, the substrate having two sides extending in a first direction and two sides extending in a second direction; a transporter configured to transport the substrate to a position facing the stage; first and second sensors, which are fixed relative to the stage and respectively located outside the sides, extending in the second direction, of the substrate at the position facing the stage so as to detect the sides of the substrate, respectively; and third and fourth sensors, which are fixed relative to the stage and respectively located outside the sides, extending in the first direction, of the substrate at the position facing the stage so as to detect the sides of the substrate, respectively.

公开(公告)号：US20180291522A1

公开(公告)日：2018-10-11

申请号：US15483201

申请日：2017-04-10

申请人： Ryszard Rokicki

发明人： Ryszard Rokicki

IPC分类号： C25F3/16 ,  C25D11/02

CPC分类号： C25F3/16 ,  C25D11/02 ,  C25D11/26 ,  C25D21/12

摘要： The method for improvement of Nitinol fatigue fracture resistance may be accomplished by electropolishing or magnetoelectropolishing under oxygen evolution regime, and by anodizing or magnetoanodizing the intermetallic compound. All four processes are performed under an oxygen evolution regime and by these processes the outermost and subsequent underlying oxide layers are enriched with oxygen which saturates, fills oxygen vacancies and bridges surface oxide lattice defects making the passive oxide layer more stoichiometric and homogenous, elastic and, as a result of the oxygen enrichment, more fatigue fracture resistant.

公开(公告)号：US20180286723A1

公开(公告)日：2018-10-04

申请号：US15941760

申请日：2018-03-30

申请人： EBARA CORPORATION

发明人： Masayuki FUJIKI ,  Hideharu AOYAMA ,  Ryuya KOIZUMI

IPC分类号： H01L21/67 ,  G06F3/0484 ,  G06F3/147 ,  C25D17/00

CPC分类号： H01L21/67276 ,  C25D17/00 ,  C25D17/001 ,  C25D21/12 ,  G05B19/46 ,  G06F3/04847 ,  G06F3/147 ,  G06T13/80 ,  G06T2200/24 ,  Y02P90/02

摘要： A method is provided, the method including: repeatedly acquiring a state of one or more devices included in the semiconductor manufacturing apparatus; providing a first animation indicating an operation of the semiconductor manufacturing apparatus by displaying at least an image indicating the state of one or more devices on a display unit each time the state is acquired; storing, in a memory, the acquired state of one or more devices and a time related to the state; receiving an input for switching a display mode; and providing a second animation of the semiconductor manufacturing apparatus by displaying, one by one on the display unit, at least one or more images respectively indicating the state of one or more devices related to one or more times including a reference time stored in the memory, after receiving the input for switching a display mode.

公开(公告)号：US20180282893A1

公开(公告)日：2018-10-04

申请号：US15933280

申请日：2018-03-22

申请人： EBARA CORPORATION

发明人： Gaku YAMASAKI ,  Hirotaka OHASHI

IPC分类号： C25D17/06 ,  B25J5/02 ,  B25J11/00 ,  B25J9/16 ,  C25D21/12 ,  H01L21/677 ,  H01L21/687

CPC分类号： C25D17/06 ,  B25J5/02 ,  B25J9/023 ,  B25J9/1669 ,  B25J9/1676 ,  B25J9/1697 ,  B25J11/0095 ,  C23C18/163 ,  C25D17/001 ,  C25D21/12 ,  H01L21/67173 ,  H01L21/6723 ,  H01L21/67718 ,  H01L21/67733 ,  H01L21/67742 ,  H01L21/67751 ,  H01L21/68707 ,  H01L21/68764 ,  Y10S901/47 ,  Y10S901/49

摘要： In assembly of a conventional plating apparatus, a position of a processing tank is adjusted so that the processing tank is disposed at an ideal position. This adjustment takes time and effort to assemble a plating apparatus, and assembly of the plating apparatus requires a high cost. The invention provides a substrate transporting apparatus provided with a substrate holder for holding a substrate, a holder griping mechanism that grips the substrate holder, a substrate transporting section that transports the substrate holder, a rotation mechanism that rotationally moves the holder griping mechanism around a vertical direction as an axis, and a linear motion mechanism that linearly moves the holder griping mechanism in a direction perpendicular to a plane defined by a transporting direction of the substrate holder by the substrate transporting section and a vertical direction.

公开(公告)号：US10047454B2

公开(公告)日：2018-08-14

申请号：US14727674

申请日：2015-06-01

申请人： EBARA CORPORATION

发明人： Yuji Araki ,  Jumpei Fujikata ,  Masashi Shimoyama ,  Mizuki Nagai

IPC分类号： C25D21/12

CPC分类号： C25D21/12

摘要： A plating apparatus 10 includes a rectifier 18 configured to apply a DC current to a substrate, and a plating apparatus control unit 30 that instructs the rectifier 18 on a value of the DC current. The plating apparatus control unit 30 has a setting unit 32 for setting a current value, a storage unit 34 that stores a relational expression between an instructed current value on which the rectifier 18 is instructed and an actual current value which the rectifier 18 outputs in accordance with the instructed current value, a calculation unit 38 that corrects the current value set by the setting unit 32 on the basis of the above-mentioned relational expression to calculate a corrected current value, and an instruction unit 36 that instructs the rectifier 18 on the corrected current value calculated by the calculation unit 38.

公开(公告)号：US20180178461A1

公开(公告)日：2018-06-28

申请号：US15437403

申请日：2017-02-20

申请人： ANYCASTING CO., LTD.

发明人： Sungbin KIM ,  Bongyoung YOO

IPC分类号： B29C67/00 ,  C25D5/02 ,  B29C67/24

CPC分类号： C25D5/026 ,  B33Y10/00 ,  B33Y30/00 ,  C25D1/003 ,  C25D5/003 ,  C25D17/00 ,  C25D21/02 ,  C25D21/12

摘要： A three-dimensional (3D) printing apparatus using selective electrochemical deposition is provided. The 3D printing apparatus is used to selectively deposit a metallic material on a substrate using a nozzle for jetting an electrolyte at a predetermined pressure to enhance 3D printing speed of a metallic product stacked on the substrate. The 3D printing apparatus is configured in such a way that a metallic product is 3D-printed as a metallic material is selectively deposited on the substrate while the electrolyte is continuously jetted at a predetermined pressure and, thus, 3D printing speed of a metallic product stacked on the substrate is remarkably increased compared with the case according to the prior art (Korean Publication No. 10-2015-0020356) in which plating is performed only when a meniscus is formed. Accordingly, the 3D printing apparatus is also applied to 3D printing of a bulk type of a metallic product with a comparatively large shape.

公开(公告)号：US09988729B2

公开(公告)日：2018-06-05

申请号：US14294608

申请日：2014-06-03

申请人： Dürr Systems AG

发明人： Alfred Pregenzer ,  Michael Dieterich

IPC分类号： C25D17/00 ,  C25D5/18 ,  C25D13/22 ,  C25D21/12

CPC分类号： C25D5/18 ,  C25D13/22 ,  C25D17/00 ,  C25D21/12

摘要： In order to provide a coating facility for coating workpieces, which includes a dip tank, into which the workpieces are introducible in order to coat them, a current conversion system for providing a coating current, which is feedable through the dip tank to coat the workpieces, and an electrode, which is configured to be arranged in the dip tank and which is electrically connected to the current conversion system, which coating facility is configured to be flexibly and reliably operated, it is proposed that the current conversion system comprises a current conversion unit, which includes a power switch and an isolating transformer, the power switch being connectable on the input side to a supply current source and being connected on the output side to the isolating transformer and the isolating transformer being connected on the input side to the power switch and on the output side to an electrode.

公开(公告)号：US20180148856A1

公开(公告)日：2018-05-31

申请号：US15884572

申请日：2018-01-31

申请人： International Business Machines Corporation

发明人： Charles L. Arvin ,  Michael S. Gordon

IPC分类号： C25D21/12 ,  H01L21/288 ,  C25D5/18 ,  H01L23/00 ,  H01L21/66 ,  C25D3/30 ,  C25D7/12 ,  C25D5/56

CPC分类号： C25D21/12 ,  C25D3/30 ,  C25D3/54 ,  C25D5/02 ,  C25D5/18 ,  C25D5/56 ,  C25D7/12 ,  C25D17/001 ,  C25D17/10 ,  C25D21/06 ,  C25D21/10 ,  C25D21/14 ,  C25D21/18 ,  H01L21/2885 ,  H01L22/14 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/117

摘要： A plating product fabrication method includes forming a first concentrate. The concentrate includes a Tin (Sn) species and a trace amount of Polonium (Po) species. The plating product fabrication method also includes creating a circuit between a filtering anode and a filtering cathode and reducing the Po species from the concentrate by plating Po upon the filtering cathode. In this manner, a purified Sn concentrate is formed. The purified Sn concentrate may be utilized to plate Sn upon a plating cathode. The purified Sn concentrate may be utilized to form purified Sn.

公开(公告)号：US20180135198A1

公开(公告)日：2018-05-17

申请号：US15808466

申请日：2017-11-09

申请人： EBARA CORPORATION

发明人： Shoichiro OGATA ,  Masaaki KIMURA ,  Mitsutoshi YAHAGI

IPC分类号： C25D17/06 ,  C25D7/12 ,  G01M3/32 ,  H01L21/687 ,  H01L21/288

CPC分类号： C25D17/06 ,  C25D5/34 ,  C25D7/12 ,  C25D17/001 ,  C25D17/004 ,  C25D17/02 ,  C25D21/04 ,  C25D21/06 ,  C25D21/10 ,  C25D21/12 ,  G01M3/3209 ,  G01M3/3263 ,  G01M3/3281 ,  H01L21/2885 ,  H01L21/67126 ,  H01L21/68721

摘要： There is disclosed an improved leak checking method which can accurately test a sealing performance of a substrate holder more than conventional leak check techniques. The leak checking method includes: holding a substrate with a substrate holder, the substrate holder including a first holding member and a second holding member, the second holding member having an opening through which a surface of the substrate is exposed; pressing a sealing projection of the second holding member against the surface of the substrate when holding the substrate with the substrate holder; covering the surface of the substrate, exposed through the opening, and the sealing projection with a sealing cap; forming a hermetic space between the sealing cap and the substrate holder; introducing a pressurized gas into the hermetic space; and detecting a decrease in pressure of the pressurized gas in the hermetic space.

公开(公告)号：US20180119302A1

公开(公告)日：2018-05-03

申请号：US15797472

申请日：2017-10-30

申请人： Samsung Electronics Co., Ltd.

发明人： Dong-Chan LIM ,  Kwang-Jin MOON ,  Byung-Lyul PARK ,  Nae-In LEE ,  Ho-Jin LEE

IPC分类号： C25D5/00 ,  C25D7/12 ,  C25D17/00 ,  C25D21/12 ,  H01L21/288 ,  H01L21/768

CPC分类号： C25D5/006 ,  C25D7/123 ,  C25D17/001 ,  C25D17/005 ,  C25D21/12 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76877

摘要： An electroplating apparatus includes an electroplating bath including an anode installed therein and a plating solution received therein, a substrate holder configured to hold a substrate to be submerged into the plating solution and including a support surrounding the substrate and a cathode on the support to be electrically connected to a periphery of the substrate, a magnetic field generating assembly provided in the support and including at least one electromagnetic coil extending along a circumference of the substrate, and a power supply configured to current to the electromagnetic coil.