Vertical extraction tool for semiconductor packaged devices
    1.
    发明授权
    Vertical extraction tool for semiconductor packaged devices 失效
    半导体封装器件的垂直提取工具

    公开(公告)号:US5979955A

    公开(公告)日:1999-11-09

    申请号:US22444

    申请日:1998-02-12

    IPC分类号: H05K7/14 B25J15/10

    CPC分类号: H05K7/1415 Y10T29/53283

    摘要: An extraction tool for extracting a module that is detachably connected to a mounting substrate includes a fixed plate that is vertically supported over the module to be extracted. A movable plate is arranged below the fixed plate and a screw is inserted in central openings in each of the fixed and movable plates. A pair of vertically extending side panels are connected at one edge by a hinge to opposite sides of the movable plate. The opposite edge of the respective side panels are used to grip the module to be extracted. A spring biases the side panels inwardly. A rotatable handle is arranged above the fixed plate and is connected to the screw. Lateral rotation of the handle causes a corresponding axial rotation of the screw for moving the movable plate in a vertical direction. The precise vertical movement of the plate also causes vertical movement of the side panels gripping the module which ensures that the module is extracted without any side-to-side or twisting motion, thereby avoiding damage to the connectors.

    摘要翻译: 用于提取可拆卸地连接到安装基板的模块的提取工具包括垂直地支撑在要提取的模块上的固定板。 固定板的下方配置可动板,在每个固定板和可动板的中央开口插入有螺钉。 一对垂直延伸的侧板通过铰链在一个边缘处连接到可移动板的相对侧。 各个侧面板的相对边缘用于夹持要提取的模块。 弹簧向内偏压侧板。 可旋转手柄设置在固定板的上方并与螺钉连接。 手柄的横向旋转引起螺钉的相应的轴向旋转,用于沿垂直方向移动可动板。 板的精确垂直运动也导致夹紧模块的侧板的垂直运动,这确保了模块被提取而没有任何侧向或扭转运动,从而避免损坏连接器。

    Method and system for handling substrates
    2.
    发明授权
    Method and system for handling substrates 有权
    处理基板的方法和系统

    公开(公告)号:US08914143B1

    公开(公告)日:2014-12-16

    申请号:US13098296

    申请日:2011-04-29

    IPC分类号: G06F19/00 G03F9/00

    摘要: System and method for handling substrates in a lithography manufacturing process are disclosed. In one embodiment, a system for handling substrates in a lithography manufacturing process includes a plurality of porous chucks positioned above a substrate for imaging, a plurality of pressure sources configured to apply pressured air towards the substrate through the plurality of porous chucks, a plurality of vacuums configured to apply suction force away from the substrate, and a controller with control logic configured to hold the substrate in place by controlling the pressured air applied by the plurality of pressure sources and the suction force generated by the plurality of vacuums.

    摘要翻译: 公开了在光刻制造工艺中处理衬底的系统和方法。 在一个实施例中,用于在光刻制造工艺中处理衬底的系统包括多个位于衬底上用于成像的多孔卡盘,多个压力源被配置为通过多个多孔卡盘向衬底施加加压空气,多个 构造成将吸力施加离开基底的真空器,以及具有控制逻辑的控制器,其配置成通过控制由多个压力源施加的加压空气和由多个真空产生的吸力来将基板保持在适当位置。