公开(公告)号：US09688801B2

公开(公告)日：2017-06-27

申请号：US13148138

申请日：2010-02-04

申请人： Kaori Fukutani ,  Toshihiro Kasai

发明人： Kaori Fukutani ,  Toshihiro Kasai

IPC分类号： C08F265/06 ,  C08F2/22 ,  C08F2/24 ,  C08F4/00 ,  C08J3/12 ,  C08L63/00 ,  C08L51/00 ,  C08L33/06 ,  C08L33/14 ,  C08L57/00 ,  H01L23/29 ,  C08J5/18 ,  C08G59/50 ,  C09D163/00 ,  C08L51/06

CPC分类号： C08F265/06 ,  C08F2/22 ,  C08L33/06 ,  C08L33/14 ,  C08L51/00 ,  C08L51/06 ,  C08L63/00 ,  C09D163/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

公开(公告)号：US20110294954A1

公开(公告)日：2011-12-01

申请号：US13148138

申请日：2010-02-04

申请人： Kaori Fukutani ,  Toshihiro Kasai

发明人： Kaori Fukutani ,  Toshihiro Kasai

IPC分类号： C08F265/06 ,  C08J3/12 ,  C08L63/00 ,  C08L33/14 ,  C08L33/06

CPC分类号： C08F265/06 ,  C08F2/22 ,  C08L33/06 ,  C08L33/14 ,  C08L51/00 ,  C08L51/06 ,  C08L63/00 ,  C09D163/00 ,  H01L2924/0002 ,  H01L2924/00

摘要： Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.

摘要翻译： 公开了一种乙烯基聚合物粉末，其优于对固化性树脂组合物的分散性，其通过用离子浓度高的预定温度通过短时间加热立即给出固化性树脂组合物的凝胶状态， 适用于电子材料领域的凝胶剂，提供包含乙烯基聚合物粉末的可固化树脂组合物，并提供可固化树脂组合物的固化物质。 本发明的乙烯基聚合物粉末的丙酮可溶成分的丙酮可溶成分为30质量％以上，丙酮可溶成分的质均分子量为100,000以上，碱金属离子含量为10ppm以下， 体积平均一次粒径（Dv）为200nm以上。