公开(公告)号：US07026054B2

公开(公告)日：2006-04-11

申请号：US09871896

申请日：2001-06-04

申请人： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

发明人： Naoto Ikegawa ,  Naoyuki Kondo ,  Kimiaki Nakata

IPC分类号： B32B15/04

CPC分类号： H05K1/0366 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2203/095 ,  Y10T428/12569 ,  Y10T428/25 ,  Y10T428/256 ,  Y10T428/258 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2916 ,  Y10T428/31678 ,  Y10T428/31681

摘要： A laminate includes a metal layer which is formed on and covers a surface of an insulating substrate activated by a plasma treatment by any method selected from a sputtering method, a vacuum depositing method and an ion plating method. The substrate is obtained by molding a resin composition containing 20 to 150 parts by mass of a fibrous filler having an average fiber diameter of 0.1 to 5 μm and an average fiber length of 10 to 50 μm relative to 100 parts by mass of a base resin comprising a thermoplastic resin and a thermosetting resin.

摘要翻译： 层压体包括通过溅射法，真空蒸镀法，离子镀法等任一种方法形成在绝缘基板的表面并覆盖由等离子体处理而起作用的金属层。 通过将相对于100质量份的基础树脂相对于100质量份的含有20〜150质量份平均纤维直径为0.1〜5μm，平均纤维长度为10〜50μm的纤维状填料， 包括热塑性树脂和热固性树脂。