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    Methods for assembling electronic devices with adhesive
    2.
    发明授权
    Methods for assembling electronic devices with adhesive 有权
    用粘合剂组装电子设备的方法

    公开(公告)号：US09565773B2

    公开(公告)日：2017-02-07

    申请号：US14231454

    申请日：2014-03-31

    Applicant: Apple Inc.

    Inventor： John J. Baker

    IPC: B05D3/00 ,  H05K3/28 ,  H01L21/56 ,  C09J5/00 ,  B05D3/02 ,  B05D3/06 ,  B05D3/10 ,  H05K1/02

    CPC classification number: H05K3/284 ,  B05D3/0254 ,  B05D3/067 ,  B05D3/108 ,  C09J5/00 ,  C09J2203/326 ,  C09J2205/302 ,  C09J2205/31 ,  H01L21/563 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/0284 ,  H05K3/288 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2203/0126 ,  H05K2203/0285 ,  H05K2203/0292 ,  H05K2203/0783 ,  H05K2203/092 ,  H05K2203/102 ,  H05K2203/107 ,  H05K2203/1163 ,  H05K2203/1194 ,  H01L2924/00012

    Abstract: An electronic device may have housing structures, electrical components, and other electronic device structures. Adhesive may be used to join electronic device structures. Adhesive may be dispensed as liquid adhesive and cured to form adhesive joints. Adhesive joints may be debonded. Chain reactions may be initiated by applying a localized initiator such as a chemical or localized energy to the adhesive. Once initiated, the chain reaction may spread throughout the adhesive to cure the adhesive, to globally change adhesive viscosity, or to weaken the adhesive to facilitate debonding. Local changes to adhesive may also be made such as local increases and decreases to adhesive viscosity. Chain reaction curing may be used to cure adhesive or debond adhesive that is hidden from view within gaps in the electronic device structures. Viscosity changes may be used to control where adhesive flows.

    Abstract translation: 电子设备可以具有壳体结构，电气部件和其他电子设备结构。 粘合剂可用于连接电子器件结构。 粘合剂可以作为液体粘合剂分配并固化以形成粘合剂接合部。 粘合接头可能脱粘。 可以通过将局部引发剂例如化学或局部化的能量施加到粘合剂来引发连锁反应。 一旦开始，连锁反应可能会蔓延到整个粘合剂中以固化粘合剂，从而全局地改变粘合剂粘度，或者削弱粘合剂以促进剥离。 还可以对粘合剂进行局部变化，例如局部增加和降低粘合剂粘度。 链反应固化可用于固化在电子设备结构的间隙内隐藏的粘合剂或脱粘合剂。 粘度变化可用于控制粘合剂流动的位置。

    Circuit board structure and manufacturing method thereof
    4.
    发明授权
    Circuit board structure and manufacturing method thereof 有权
    电路板结构及其制造方法

    公开(公告)号：US08288655B2

    公开(公告)日：2012-10-16

    申请号：US12258453

    申请日：2008-10-27

    Applicant: Ra-Min Tain ,  Ming-Ji Dai

    Inventor： Ra-Min Tain ,  Ming-Ji Dai

    IPC: H05K1/03 ,  H05K1/09 ,  H05K1/00 ,  H05K7/20

    CPC classification number: H05K1/053 ,  B82Y10/00 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/025

    Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer.

    Abstract translation: 提供一种电路板结构及其制造方法。 电路板结构包括复合衬底，电介质层和电路层。 复合衬底包括掺杂有非金属粉末和金属缓冲层的金属衬底。 通过抛光处理处理与金属基板接触的金属缓冲层的另一表面相对的金属缓冲层的表面。 电介质层形成在金属缓冲层的抛光表面上，电介质层形成在电介质层上。 或者，在电介质层和金属缓冲层之间插入阻挡层，以防止金属缓冲层的扩散效应。

    CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    CIRCUIT BOARD STRUCTURE AND MANUFACTURING METHOD THEREOF 有权
    电路板结构及其制造方法

    公开(公告)号：US20100051328A1

    公开(公告)日：2010-03-04

    申请号：US12258453

    申请日：2008-10-27

    Applicant: Ra-Min Tain ,  Ming-Ji Dai

    Inventor： Ra-Min Tain ,  Ming-Ji Dai

    IPC: H05K1/03 ,  B05D5/12 ,  H05K1/02 ,  H05K1/00

    CPC classification number: H05K1/053 ,  B82Y10/00 ,  H05K2201/0179 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/026 ,  H05K2201/0323 ,  H05K2203/025

    Abstract: A circuit board structure and a manufacturing method thereof are provided. The circuit board structure includes a composite substrate, a dielectric layer, and a circuit layer. The composite substrate includes a metal substrate doped with non-metal powders and a metal buffer layer. A surface of the metal buffer layer opposite to the other surface of the metal buffer layer in contact with the metal substrate is treated by a polishing process. The dielectric layer is formed on the polished surface of the metal buffer layer, and the circuit layer is formed on the dielectric layer. Alternatively, a barrier layer is interposed between the dielectric layer and the metal buffer layer for preventing a diffusion effect of the metal buffer layer.

    Abstract translation: 提供一种电路板结构及其制造方法。 电路板结构包括复合衬底，电介质层和电路层。 复合衬底包括掺杂有非金属粉末和金属缓冲层的金属衬底。 通过抛光处理处理与金属基板接触的金属缓冲层的另一表面相对的金属缓冲层的表面。 电介质层形成在金属缓冲层的抛光表面上，电介质层形成在电介质层上。 或者，在电介质层和金属缓冲层之间插入阻挡层，以防止金属缓冲层的扩散效应。

    NANOFIBER SHEET, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED COMPOSITE MATERIAL
    6.
    发明申请
    NANOFIBER SHEET, PROCESS FOR PRODUCING THE SAME, AND FIBER-REINFORCED COMPOSITE MATERIAL 有权
    纳米纤维板，其制造方法和纤维增强复合材料

    公开(公告)号：US20090264036A1

    公开(公告)日：2009-10-22

    申请号：US12374220

    申请日：2007-07-13

    Applicant: Hiroyuki Yano ,  Masaya Nogi ,  Shinsuke Ifuku ,  Kentarou Abe ,  Keishin Handa

    Inventor： Hiroyuki Yano ,  Masaya Nogi ,  Shinsuke Ifuku ,  Kentarou Abe ,  Keishin Handa

    IPC: B32B23/02 ,  D21C9/00 ,  D21B1/04 ,  D21C3/22 ,  D21C3/02

    CPC classification number: H05K1/0366 ,  D21H11/08 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T442/2869

    Abstract: Provided is a nanofiber sheet that sufficiently refined by fibrillation and has high crystallinity of cellulose fiber and can realize a fiber-reinforced composite material exhibiting high transparency, a high elastic modulus, a low coefficient of linear thermal expansion, and high heat resistance and being high in flatness and smoothness. This nanofiber sheet includes crystalline cellulose as the main component and a lignin in an amount of from 10 ppm to 10 wt %. When a fiber/resin composite material obtained by impregnating the nanofiber sheet with tricyclodecane dimethacrylate, subjecting the impregnated product to UV-curing at 20 J/cm2, and heating the cured product in vacuum at 160° C. for two hours includes 60 wt % of the cured tricyclodecane dimethacrylate and 40 wt % of nanofiber, the following physical characteristics (i) to (iii) are satisfied: (i) the parallel light transmittance of light of a wavelength of 600 nm at a sheet thickness of 100 μm is 70% or more; (ii) the Young's modulus is 5.0 GPa or more; and (iii) the coefficient of linear thermal expansion is 20 ppm/K or less.

    Abstract translation: 本发明提供一种纳米纤维片，其通过原纤维化进行充分精制并具有高纤维素纤维素结晶度，并且可以实现具有高透明度，高弹性模量，低热膨胀系数和高耐热性的纤维增强复合材料，并且高 平坦度平滑。 该纳米纤维片包含结晶纤维素作为主要成分，木素含量为10〜10重量％。 当通过用三环癸烷二甲基丙烯酸酯浸渍纳米纤维片而获得的纤维/树脂复合材料，使浸渍产物以20J / cm 2进行UV固化，并且在160℃下真空加热固化产物2小时包括60重量％ 的固化的三环癸烷二甲基丙烯酸酯和40重量％的纳米纤维，满足以下物理特性（i）至（iii）：（i）100μm厚度的波长为600nm的光的平行光透射率为70 ％ 或者更多; （ii）杨氏模量为5.0GPa以上; 和（iii）线性热膨胀系数为20ppm / K以下。

    Aligned nanotube bearing composite material
    8.
    发明申请
    Aligned nanotube bearing composite material 有权
    对齐纳米管轴承复合材料

    公开(公告)号：US20080012155A1

    公开(公告)日：2008-01-17

    申请号：US11479246

    申请日：2006-06-29

    Applicant: Nachiket Raravikar ,  Ravindra Tanikella

    Inventor： Nachiket Raravikar ,  Ravindra Tanikella

    IPC: H01L23/29

    CPC classification number: H01L23/29 ,  B82Y10/00 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0239 ,  H05K2201/0251 ,  H05K2201/026 ,  Y10S977/70 ,  Y10T428/24 ,  Y10T428/24331 ,  H01L2924/00 ,  H01L2224/0401

    Abstract: A composite material including an arrangement of approximately aligned nanofilaments overlying at least another arrangement of approximately aligned nanofilaments, the longitudinal axis of the nanotubes of the first arrangement being approximately perpendicular to the longitudinal axis of the nanotubes of the other arrangement, and the arrangements forming at least one array. A resin material having nanoparticles dispersed throughout is disposed among the array(s) of nanofilaments, and cured, and openings may be formed into or through the composite material corresponding to spaces provided in the array of nanofilaments. A composite material according to embodiments forms a microelectronic substrate or some portion thereof, such as a substrate core.

    Abstract translation: 一种复合材料，其包括大致排列的纳米丝的布置，其覆盖至少另一布置的大致排列的纳米丝，第一布置的纳米管的纵向轴线大致垂直于另一布置的纳米管的纵向轴线，并且形成在 最少一个数组。 将具有分散在其中的纳米颗粒分散在其中的树脂材料设置在纳米丝阵列中，并固化，并且开口可以形成在复合材料中或通过复合材料，对应于在纳米丝阵列中提供的空间。 根据实施方案的复合材料形成微电子衬底或其某些部分，例如衬底芯。

    Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto
    9.
    发明申请
    Aramid filled polyimides having advantageous thermal expansion properties, and methods relating thereto 失效
    具有有利的热膨胀性能的芳族聚酰胺填充的聚酰亚胺及其相关的方法

    公开(公告)号：US20070231568A1

    公开(公告)日：2007-10-04

    申请号：US11394956

    申请日：2006-03-31

    Applicant: Kuppusamy Kanakarajan

    Inventor： Kuppusamy Kanakarajan

    IPC: C09K19/00 ,  B32B7/12 ,  B32B15/04 ,  B32B15/08 ,  B32B27/00

    CPC classification number: C09J179/08 ,  C08L77/10 ,  C08L2205/16 ,  C08L2666/20 ,  H05K1/0373 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/068 ,  Y10T428/1023 ,  Y10T428/24917 ,  Y10T428/28 ,  Y10T428/2804 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31721 ,  Y10T442/2361

    Abstract: The invention is directed to polyimide based adhesives having a coefficient of thermal expansion (“CTE”) equal to or below 50 ppm/° C. The adhesives of the present invention contain a polyimide base polymer present in the overall adhesive in an amount from 25 to 95 weight percent. The polyimide base polymer has a glass transition temperature (“Tg”) in a range of from about 150 to about 300° C. and typically has a coefficient of thermal expansion above 50 ppm/° C. The polyimide based adhesives of the invention also contain an aramid micro fiber filler in an amount from 5 to 75 weight percent, based upon the total weight of the polyimide based adhesive. The fiber filler can be used to lower CTE of the overall adhesive to match (or nearly match) the CTE of other materials like metal, silicon wafers, other polymers (including polyimide) and the like.

    Abstract translation: 本发明涉及具有等于或低于50ppm /℃的热膨胀系数（“CTE”）的聚酰亚胺基粘合剂。本发明的粘合剂含有总体粘合剂中聚酰亚胺基聚合物的量为25 至95重量％。 聚酰亚胺基聚合物的玻璃化转变温度（“T”g“）在约150至约300℃的范围内，并且通常具有高于50ppm /℃的热膨胀系数。 基于聚酰亚胺基粘合剂的总重量，本发明的聚酰亚胺基粘合剂还含有5至75重量％的芳族聚酰胺微纤维填料。 纤维填料可用于降低整个粘合剂的CTE以匹配（或几乎匹配）其它材料如金属，硅晶片，其它聚合物（包括聚酰亚胺）等的CTE。

    LED display apparatus
    10.
    发明授权
    LED display apparatus 有权
    LED显示装置

    公开(公告)号：US07053416B2

    公开(公告)日：2006-05-30

    申请号：US10857025

    申请日：2004-06-01

    Applicant: Tsuyoshi Yasuoka ,  Hirokazu Yoshida

    Inventor： Tsuyoshi Yasuoka ,  Hirokazu Yoshida

    IPC: H01L33/00

    CPC classification number: H05K3/284 ,  H05K1/0274 ,  H05K2201/0112 ,  H05K2201/0251 ,  H05K2201/10106

    Abstract: A highly reliable LED display apparatus is provided in which dust and other similar particles are prevented from entering spaces formed between light-emitting diodes and openings in a mask member provided on a circuit board. The LED display apparatus has the circuit board, the light-emitting diodes provided at predetermined positions thereon, and the mask member which is disposed approximately parallel to the circuit board. The mask member has openings at positions corresponding to the light-emitting diodes which are placed inside the respective openings. In the LED display apparatus described above, the openings of the mask member have fine projections on side surfaces thereof. The fine projections can be formed on the mask member by a flock processing technique.

    Abstract translation: 提供了一种高度可靠的LED显示装置，其中防止灰尘和其它类似颗粒进入设置在电路板上的掩模构件中的发光二极管和开口之间形成的空间。 LED显示装置具有电路板，设置在其上的预定位置处的发光二极管和与电路板大致平行设置的掩模构件。 掩模构件在对应于放置在相应开口内的发光二极管的位置处具有开口。 在上述LED显示装置中，掩模构件的开口在其侧表面上具有微小的突起。 可以通过羊群处理技术在掩模构件上形成微细的突起。

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