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公开(公告)号：US09848516B2
公开(公告)日：2017-12-19
申请号：US15460139
申请日：2017-03-15
申请人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.
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公开(公告)号：US09635785B1
公开(公告)日：2017-04-25
申请号：US14936177
申请日：2015-11-09
申请人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
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公开(公告)号：US20170188483A1
公开(公告)日：2017-06-29
申请号：US15460139
申请日：2017-03-15
申请人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.
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公开(公告)号：US20170105317A1
公开(公告)日：2017-04-13
申请号：US14936177
申请日：2015-11-09
申请人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
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