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公开(公告)号：US09848516B2
公开(公告)日：2017-12-19
申请号：US15460139
申请日：2017-03-15
申请人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.
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公开(公告)号：US09635785B1
公开(公告)日：2017-04-25
申请号：US14936177
申请日：2015-11-09
申请人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
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公开(公告)号：US07233501B1
公开(公告)日：2007-06-19
申请号：US10939198
申请日：2004-09-09
申请人： Charles J. Ingalz
发明人： Charles J. Ingalz
IPC分类号： H05K7/00
CPC分类号： H01L23/367 , G06F1/185 , G06F1/20 , H01L2924/0002 , H01L2924/00
摘要： A heat sink comprises a heat sink base and a row of heat sink extensions that are attached to one side of the heat sink base. An interleaved heat sink structure includes a first row and a second row of heat sink extensions. The first row and the second row of heat sink extensions are coupled respectively to a first and a second heat sink bases. The first and the second heat sink bases are thermally coupled to a first plurality of memory packages and a second plurality of memory packages, respectively. The first row of heat sink extensions is parallel to and at least partially interleaved with the second row of heat sink extensions. A memory heat dissipation control system and a method for assembly a memory part that includes a DIME and two heat sinks are also described.
摘要翻译： 散热器包括散热器基座和连接到散热器基座的一侧的一排散热器延伸部。 交错散热器结构包括第一排和第二排散热器延伸部。 第一排和第二排散热器延伸部分别耦合到第一和第二散热器底座。 第一和第二散热器基座分别热耦合到第一多个存储器封装和第二多个存储器封装。 第一排散热器延伸部分与第二排散热器延伸部平行并至少部分交错。 还描述了存储器散热控制系统和用于组装包括DIME和两个散热器的存储器部件的方法。
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公开(公告)号：US20170188483A1
公开(公告)日：2017-06-29
申请号：US15460139
申请日：2017-03-15
申请人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric M. Kumar , Charles J. Ingalz , Weiyu W. Lu , Tianyi Gao , Manasa Sahini , Yan Cui
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.
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公开(公告)号：US20170105317A1
公开(公告)日：2017-04-13
申请号：US14936177
申请日：2015-11-09
申请人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
发明人： Ali Heydari , Eric Mahendra Kumar , Charles J. Ingalz , Weiyu Lu , Tianyi Gao , Manasa Sahini , Yan Cui
IPC分类号： H05K7/20
CPC分类号： H05K7/2079 , H05K7/20145 , H05K7/20172 , H05K7/20736 , H05K7/20745 , H05K7/20836
摘要： A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.
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6.发明申请SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES 审中-公开表面光滑超导电导率复合材料，用于改进半导体封装器件的标记永久公开(公告)号：US20100052154A1
公开(公告)日：2010-03-04
申请号：US12201661
申请日：2008-08-29
CPC分类号： H01L23/367 , H01L21/4817 , H01L23/3737 , H01L24/28 , H01L24/29 , H01L24/32 , H01L2224/32057 , H01L2224/83385 , H01L2924/01006 , H01L2924/01013 , H01L2924/01024 , H01L2924/01029 , H01L2924/01074 , H01L2924/01078 , H01L2924/014 , H01L2924/078 , H01L2924/1305 , H01L2924/13055 , H01L2924/16195 , H01L2924/16235 , H01L2924/351 , H01L2924/00
摘要： A semiconductor-lid structure and method of forming a semiconductor-lid structure includes a semiconductor die, an ultrahigh thermal conductivity lid disposed on the semiconductor die, and a thermal interface layer between said semiconductor die and said ultrahigh thermal conductivity lid. The ultrahigh thermal conductivity lid includes a coupon having at least one uneven surface, a first layer on said at least one uneven surface formed from a process comprising one of sputter coating a highly adhesive metal over said uneven surface and sputtering a metallic seed layer, and a second layer on said first layer formed from a process comprising one of sputtering a metallic diffusion barrier layer over said first layer and electroplating the metallic seed layer with a highly conductive metal. The ultrahigh thermal conductivity lid has a smooth outer surface formed by chemical and/or mechanical processing of the ultrahigh thermal conductivity lid after formation of the second layer.
摘要翻译： 半导体盖结构和半导体盖结构的形成方法包括半导体管芯，设置在半导体管芯上的超高导热性盖，以及位于所述半导体管芯和所述超高导热性盖之间的热界面层。 超高热导率盖包括具有至少一个不平坦表面的试样，在所述至少一个不平坦表面上的第一层，其由包括在所述不平坦表面上溅射涂覆高粘合性金属并溅射金属种子层的方法形成的工艺形成;以及 所述第一层上的第二层由包括在所述第一层上溅射金属扩散阻挡层并用高导电性金属电镀所述金属种子层之一的工艺形成。 超高热导率盖通过在形成第二层之后通过超高热导率盖的化学和/或机械加工而形成平滑的外表面。
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公开(公告)号：US06923018B1
公开(公告)日：2005-08-02
申请号：US10611568
申请日：2003-06-30
摘要： An electro-desorption actuator comprises a fixed member, a movable member which is coupled to the fixed member, a pressure chamber which is disposed between the fixed member and the movable member, and a sorption compression system which is in communication with the pressure chamber. The sorption compression system comprises first and second electrical conductors, a sorbent which is positioned between the first and second conductors, a sorbate which is capable of combining with the sorbent in an adsorption reaction to form a sorbate/sorbent compound, and a power supply which is connected to the conductors and which is selectively actuated to generate a current that is conducted through the sorbate/sorbent compound to desorb the sorbate from the sorbent in a desorption reaction. The sorbate is communicated from the sorption compression system to the pressure chamber during the desorption reaction and from the pressure chamber back to the sorption compression system during the adsorption reaction. Thus, during the desorption reaction a relatively high pressure is created in the pressure chamber which will displace the movable member in one direction, and during the adsorption reaction a relatively low pressure is created in the pressure chamber which will displace the movable member in the opposite direction.
摘要翻译： 电解吸致动器包括固定构件，联接到固定构件的可动构件，设置在固定构件和可动构件之间的压力室，以及与压力室连通的吸附压缩系统。 吸附压缩系统包括第一和第二电导体，位于第一和第二导体之间的吸附剂，能够与吸附剂在吸附反应中与吸附剂组合以形成山梨酸盐/吸附剂化合物的吸附物，以及电源， 连接到导体，并且其被选择性地致动以产生通过山梨酸/吸着剂化合物传导的电流，以在解吸反应中从吸附剂解吸吸附物。 在吸附反应期间，山梨酸盐从吸附压缩系统传递到压力室，并且在吸附反应过程中从压力室返回到吸附压缩系统。 因此，在解吸反应期间，在压力室中产生相对较高的压力，该压力室将沿一个方向移动可动件，并且在吸附反应期间，在压力室中产生相对较低的压力，该压力室将在相反的位置移动可动件 方向。
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