公开(公告)号：US09445531B1

公开(公告)日：2016-09-13

申请号：US14702617

申请日：2015-05-01

申请人： Ali Heydari

发明人： Ali Heydari

IPC分类号： H05K7/20 ,  H05K7/14 ,  H01L23/473

CPC分类号： H05K7/20827 ,  H05K7/1497 ,  H05K7/20745 ,  H05K7/20836

摘要： A data center system includes a housing to house servers arranged in electronic racks and an air supply system to receive contaminated air from an external environment of the housing. The datacenter system further includes a misting and cooling system to clean and cool the contaminated air. The misting and cooling system includes a cooling and cleaning chamber to receive the contaminated air and nozzles to spray liquid droplets into the contaminated air within the cooling and cleaning chamber. The liquid droplets collect and remove at least a portion of the particles contained in the contaminated air to generate non-contaminated air. The data center system further includes an airflow delivery system to generate an airflow from the non-contaminated air to cause the airflow to travel through the servers of the electronic racks to exchange heat generated by the servers due to operations of the servers.

摘要翻译： 数据中心系统包括用于容纳布置在电子机架中的服务器的外壳和用于从外壳的外部环境接收污染空气的空气供应系统。 数据中心系统还包括雾化和冷却系统，以清洁和冷却污染的空气。 雾化和冷却系统包括冷却和清洁室，以接收污染的空气和喷嘴，以将液滴喷射到冷却和清洁室内的污染空气中。 液滴收集并除去包含在污染空气中的颗粒的至少一部分，以产生未被污染的空气。 数据中心系统还包括一个气流传送系统，以产生来自无污染空气的气流，使气流穿过电子机架的服务器，以交换由于服务器的操作而由服务器产生的热量。

公开(公告)号：US20090308081A1

公开(公告)日：2009-12-17

申请号：US12138853

申请日：2008-06-13

申请人： Chien Ouyang ,  Kenny C. Gross ,  Ali Heydari

发明人： Chien Ouyang ,  Kenny C. Gross ,  Ali Heydari

IPC分类号： F25B21/02

CPC分类号： H01L35/30 ,  H01L23/38 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

摘要： Some embodiments of the present invention provide a system that cools an integrated circuit (IC) chip within a computer system. During operation, the system converts heat generated by a heat-generating device within the computer system during operation of the computer system into thermoelectric power. Next, the system supplies the thermoelectric power to drive a fluid pump. Finally, the system uses the fluid pump to conduct heat away from the IC chip.

摘要翻译： 本发明的一些实施例提供了一种在计算机系统内冷却集成电路（IC）芯片的系统。 在运行过程中，系统将计算机系统内的发热装置产生的热量转换为热电。 接下来，系统提供热电力来驱动流体泵。 最后，系统使用流体泵将热量从IC芯片传导出去。

公开(公告)号：US20170188483A1

公开(公告)日：2017-06-29

申请号：US15460139

申请日：2017-03-15

申请人： Ali Heydari ,  Eric M. Kumar ,  Charles J. Ingalz ,  Weiyu W. Lu ,  Tianyi Gao ,  Manasa Sahini ,  Yan Cui

发明人： Ali Heydari ,  Eric M. Kumar ,  Charles J. Ingalz ,  Weiyu W. Lu ,  Tianyi Gao ,  Manasa Sahini ,  Yan Cui

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836

摘要： An electronic rack includes a housing to contain one or more IT components arranged in a stack, a first rack aisle formed on a first side of the one or more IT components to direct cooler air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the one or more IT components to direct warmer air to the cooling unit downwardly. The electronic rack further includes a cooling unit having one or more cooling units disposed underneath the IT components to receive first liquid from an external chiller system, to exchange heat carried by the warmer air using the first liquid to generate the cooler air, to transform the first liquid into a second liquid with a higher temperature, and to transmit the second liquid carrying the exchanged heat back to the external chiller system.

公开(公告)号：US20170105317A1

公开(公告)日：2017-04-13

申请号：US14936177

申请日：2015-11-09

申请人： Ali Heydari ,  Eric Mahendra Kumar ,  Charles J. Ingalz ,  Weiyu Lu ,  Tianyi Gao ,  Manasa Sahini ,  Yan Cui

发明人： Ali Heydari ,  Eric Mahendra Kumar ,  Charles J. Ingalz ,  Weiyu Lu ,  Tianyi Gao ,  Manasa Sahini ,  Yan Cui

IPC分类号： H05K7/20

CPC分类号： H05K7/2079 ,  H05K7/20145 ,  H05K7/20172 ,  H05K7/20736 ,  H05K7/20745 ,  H05K7/20836

摘要： A data center system includes a container to contain electronic racks of IT components operating therein, a cooling unit disposed underneath the electronic racks to receive cool liquid from a chiller unit, to exchange heat generated from the IT components, and to transmit the hot liquid carrying the exchanged heat back to the chiller unit. Each electronic rack includes a housing to house IT components arranged in a stack, a first rack aisle formed on a first side of the IT components to direct cool air received from the cooling unit upwardly, and a second rack aisle formed on a second side of the IT components to direct hot air to the cooling unit downwardly, where the host air is transformed from the cool air from the first rack aisle by flowing through an air space between the IT components.

公开(公告)号：US20120327590A1

公开(公告)日：2012-12-27

申请号：US13602407

申请日：2012-09-04

申请人： Ali HEYDARI ,  Kenneth C. GROSS

发明人： Ali HEYDARI ,  Kenneth C. GROSS

IPC分类号： G06F1/20

CPC分类号： H01L23/427 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion with cooling fins extending outward and positioned in a fan-provided airflow. A generator compartment is provided within the shell with a generator vessel for containing an absorbent, and the generator compartment is maintained at a pressure lower than ambient. The generator compartment conducts heat away from the electronic component to the absorbent in the generator vessel. An absorber compartment, at a pressure lower than the generator compartment, is provided within the shell above the generator compartment, and, in use, an absorption refrigeration cycle contained within the shell is activated by heat from the electronic component. A bubble pump moves absorbent from the generator compartment to the absorber compartment.

摘要翻译： 用于冷却诸如高性能处理器的电子部件的被动散热器。 散热器包括具有可邻近电子部件的发热表面定位的表面的外壳。 壳体包括热交换器部分，其中冷却翅片向外延伸并定位在风扇提供的气流中。 发电机室设置在壳体内，发电机容器用于容纳吸收剂，发电机室保持低于环境温度的压力。 发电机室将热量从电子部件传导到发电机容器中的吸收剂。 在低于发电机室的压力下的吸收室设置在发电机室上方的壳体内，并且在使用中，包含在壳体内的吸收制冷循环由来自电子部件的热量激活。 吸气泡将吸收剂从发生器室移动到吸收室。

公开(公告)号：US20110154842A1

公开(公告)日：2011-06-30

申请号：US12651282

申请日：2009-12-31

申请人： Ali Heydari ,  Marco Magarelli

发明人： Ali Heydari ,  Marco Magarelli

IPC分类号： F25D23/00 ,  F28D15/00

CPC分类号： H05K7/20836 ,  F25B27/02 ,  Y02A30/274

摘要： To reduce power consumption and more efficiently cool computing devices in a data center, an air supply unit supplies air from outside the data center to an air handling unit, which cools servers within the data center using the supplied air. Using air from outside the data center, rather than recirculating and cooling air from within the data center, reduces the power consumption of the data center. In an embodiment, a chiller and/or an evaporative cooling system are coupled to the air supply unit to allow further cooling of the outside air before it is circulated. Heat generated by the servers within the data center is collected, for example using thermal pathways coupled to server components, and used by the chiller in an absorption or adsorption process to further reduce power consumption of the data center and allow the air handling unit to further cool the outside air.

摘要翻译： 为了降低功耗并更有效地降低数据中心中的计算设备，空气供应单元将空气从数据中心外部供应到空气处理单元，空气处理单元使用供应的空气冷却数据中心内的服务器。 使用数据中心外的空气，而不是从数据中心内再循环和冷却空气，从而降低了数据中心的功耗。 在一个实施例中，冷却器和/或蒸发冷却系统联接到空气供应单元以允许外部空气在其循环之前进一步冷却。 收集由数据中心内的服务器产生的热量，例如使用耦合到服务器组件的热路径，并由冷却器在吸收或吸附过程中使用，以进一步降低数据中心的功耗，并允许空气处理单元进一步 冷却外部空气。

公开(公告)号：US20100052154A1

公开(公告)日：2010-03-04

申请号：US12201661

申请日：2008-08-29

申请人： Ali Heydari Monfarad ,  Charles J. Ingalz

发明人： Ali Heydari Monfarad ,  Charles J. Ingalz

IPC分类号： H01L23/36 ,  H01L21/58

CPC分类号： H01L23/367 ,  H01L21/4817 ,  H01L23/3737 ,  H01L24/28 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/32057 ,  H01L2224/83385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/16195 ,  H01L2924/16235 ,  H01L2924/351 ,  H01L2924/00

摘要： A semiconductor-lid structure and method of forming a semiconductor-lid structure includes a semiconductor die, an ultrahigh thermal conductivity lid disposed on the semiconductor die, and a thermal interface layer between said semiconductor die and said ultrahigh thermal conductivity lid. The ultrahigh thermal conductivity lid includes a coupon having at least one uneven surface, a first layer on said at least one uneven surface formed from a process comprising one of sputter coating a highly adhesive metal over said uneven surface and sputtering a metallic seed layer, and a second layer on said first layer formed from a process comprising one of sputtering a metallic diffusion barrier layer over said first layer and electroplating the metallic seed layer with a highly conductive metal. The ultrahigh thermal conductivity lid has a smooth outer surface formed by chemical and/or mechanical processing of the ultrahigh thermal conductivity lid after formation of the second layer.

摘要翻译： 半导体盖结构和半导体盖结构的形成方法包括半导体管芯，设置在半导体管芯上的超高导热性盖，以及位于所述半导体管芯和所述超高导热性盖之间的热界面层。 超高热导率盖包括具有至少一个不平坦表面的试样，在所述至少一个不平坦表面上的第一层，其由包括在所述不平坦表面上溅射涂覆高粘合性金属并溅射金属种子层的方法形成的工艺形成;以及 所述第一层上的第二层由包括在所述第一层上溅射金属扩散阻挡层并用高导电性金属电镀所述金属种子层之一的工艺形成。 超高热导率盖通过在形成第二层之后通过超高热导率盖的化学和/或机械加工而形成平滑的外表面。

公开(公告)号：US06741469B1

公开(公告)日：2004-05-25

申请号：US10360345

申请日：2003-02-07

申请人： Ali Heydari Monfarad

发明人： Ali Heydari Monfarad

IPC分类号： H05K720

CPC分类号： H01L23/427 ,  F25B2400/15 ,  F28F2260/02 ,  H01L2924/0002 ,  H01L2924/00

摘要： A refrigeration cooling assisted MEMS-based micro-channel cooling system that removes high heat densities generated by microelectronic components using a primary cooling system thermally coupled with a secondary chip embedded cooling system.

摘要翻译： 一种制冷冷却辅助的基于MEMS的微通道冷却系统，其利用与第二芯片嵌入式冷却系统热耦合的一次冷却系统来消除由微电子部件产生的高热密度。

公开(公告)号：US08820113B2

公开(公告)日：2014-09-02

申请号：US12651282

申请日：2009-12-31

申请人： Ali Heydari ,  Marco Magarelli

发明人： Ali Heydari ,  Marco Magarelli

IPC分类号： F25B1/00 ,  F25B27/00 ,  F25D23/12 ,  F25B15/00 ,  H05K7/20 ,  F25B27/02

CPC分类号： H05K7/20836 ,  F25B27/02 ,  Y02A30/274

摘要： To reduce power consumption and more efficiently cool computing devices in a data center, an air supply unit supplies air from outside the data center to an air handling unit, which cools servers within the data center using the supplied air. Using air from outside the data center, rather than recirculating and cooling air from within the data center, reduces the power consumption of the data center. In an embodiment, a chiller and/or an evaporative cooling system are coupled to the air supply unit to allow further cooling of the outside air before it is circulated. Heat generated by the servers within the data center is collected, for example using thermal pathways coupled to server components, and used by the chiller in an absorption or adsorption process to further reduce power consumption of the data center and allow the air handling unit to further cool the outside air.

摘要翻译： 为了降低功耗并更有效地降低数据中心中的计算设备，空气供应单元将空气从数据中心外部供应到空气处理单元，空气处理单元使用供应的空气冷却数据中心内的服务器。 使用数据中心外的空气，而不是从数据中心内再循环和冷却空气，从而降低了数据中心的功耗。 在一个实施例中，冷却器和/或蒸发冷却系统联接到空气供应单元以允许外部空气在其循环之前进一步冷却。 收集由数据中心内的服务器产生的热量，例如使用耦合到服务器组件的热路径，并由冷却器在吸收或吸附过程中使用，以进一步降低数据中心的功耗，并允许空气处理单元进一步 冷却外部空气。

公开(公告)号：US08276394B2

公开(公告)日：2012-10-02

申请号：US12352418

申请日：2009-01-12

申请人： Ali Heydari ,  Kenneth C. Gross

发明人： Ali Heydari ,  Kenneth C. Gross

IPC分类号： F25B15/00 ,  F25B15/16

CPC分类号： H01L23/427 ,  G06F1/20 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A passive heat sink for cooling an electronic component such as a high-performance processor. The heat sink includes a shell with a surface that is positionable adjacent a heat generating surface of the electronic component. The shell includes a heat exchanger portion with cooling fins extending outward and positioned in a fan-provided airflow. A generator compartment is provided within the shell with a generator vessel for containing an absorbent, and the generator compartment is maintained at a pressure lower than ambient. The generator compartment conducts heat away from the electronic component to the absorbent in the generator vessel. An absorber compartment, at a pressure lower than the generator compartment, is provided within the shell above the generator compartment, and, in use, an absorption refrigeration cycle contained within the shell is activated by heat from the electronic component. A bubble pump moves absorbent from the generator compartment to the absorber compartment.

摘要翻译： 用于冷却诸如高性能处理器的电子部件的被动散热器。 散热器包括具有可邻近电子部件的发热表面定位的表面的外壳。 壳体包括热交换器部分，其中冷却翅片向外延伸并定位在风扇提供的气流中。 发电机室设置在壳体内，发电机容器用于容纳吸收剂，发电机室保持低于环境温度的压力。 发电机室将热量从电子部件传导到发电机容器中的吸收剂。 在低于发电机室的压力下的吸收室设置在发电机室上方的壳体内，并且在使用中，包含在壳体内的吸收制冷循环由来自电子部件的热量激活。 吸气泡将吸收剂从发生器室移动到吸收室。