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公开(公告)号：US08424257B2
公开(公告)日：2013-04-23
申请号：US13079572
申请日：2011-04-04
IPC分类号： E04F11/16
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion with a radial end surface configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
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2.发明申请Method of Making A Modular Synthetic Floor Tile Configured For Enhanced Performance 审中-公开配置模块化合成地板砖以提高性能的方法公开(公告)号：US20090235605A1
公开(公告)日：2009-09-24
申请号：US12340555
申请日：2008-12-19
申请人： Thayne Haney , Mark L. Jenkins , Cheryl Forster , Jeremiah Shapiro , Dana Hedquist , Amy Haney Cardall
发明人： Thayne Haney , Mark L. Jenkins , Cheryl Forster , Jeremiah Shapiro , Dana Hedquist , Amy Haney Cardall
CPC分类号： E01C5/20 , E01C13/045 , E01C2201/12 , E04F15/10
摘要： A method for enhancing the performance characteristics of a modular synthetic floor tile, which includes configuring a plurality of structural members to define an upper contact surface with a plurality of openings in the upper contact surface of the floor tile, configuring each of the structural members to comprise a thickness sufficient to support a load about the upper contact surface and with a contact flat having a smooth surface and a width between 0.03 and 0.08 inches, and configuring the upper contact surface with a dry static coefficient of friction of at least 0.6 and an abrasion index no greater than 20.
摘要翻译： 一种用于增强模块化合成地板砖的性能特征的方法，其包括构造多个结构构件以限定具有在地板砖的上接触表面中的多个开口的上接触表面，将每个结构构件配置为 包括足以支撑围绕上接触表面的负载的厚度和具有平滑表面和0.03至0.08英寸之间的宽度的接触平面，并且将干接触表面的干静摩擦系数构成为至少为0.6和 磨损指数不大于20。
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公开(公告)号：US08596023B2
公开(公告)日：2013-12-03
申请号：US12789161
申请日：2010-05-27
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion with a radial end surface configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
摘要翻译： 模块化瓦片被配置为与多个瓦片互锁以形成覆盖在地板上的模块化地板。 该瓦片包括具有限定从顶表面向下延伸的侧壁的周边的顶表面，所述侧壁具有被配置为与其邻近的其它瓦片联接以形成模块化地板覆盖物的联接部分。 瓦片还包括与顶表面相对的底侧，具有包括向下延伸的聚合物柱结构的阵列的支撑格栅，至少一些柱结构包括至少一个具有径向端面的弹性端部，弹性端部构造成定位 抵靠地板以便于柱结构的受控偏转。 柱结构可以包括初级和次级柱结构，其中辅助柱结构限制了主柱结构的偏转。
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公开(公告)号：US08397466B2
公开(公告)日：2013-03-19
申请号：US11244723
申请日：2005-10-05
CPC分类号： E01C13/045 , E01C2201/12 , E04F15/02194 , E04F15/087 , E04F15/105 , E04F2201/0138
摘要： A grid-top floor tile for outdoor use includes a polymer tile having a grid-type top surface with multiple levels, such as a bi-level surface having an upper lattice and a lower lattice oriented generally transverse to the upper lattice. The multiple levels of the surface are preferably integrally formed with one another and provide drainage gaps therethrough. In a bi-level surface configuration, the lower lattice has a top surface below a top surface of the upper lattice, so as to draw residual moisture below the top surface of the upper lattice. The tile further includes a support structure, configured to support the tile on a support surface and provide drainage pathways beneath the top surface. The tile still further comprises various reinforcement members on each of the loop and pin connectors used to interlock the tiles when forming a flooring assembly.
摘要翻译： 用于户外使用的格栅地砖包括具有多层的格栅型顶面的聚合物砖，例如具有上层格的双层表面和通常横向于上格栅的下层晶格。 表面的多个级别优选地彼此一体地形成并且提供通过其的排水间隙。 在双层表面构造中，下格栅具有位于上格子的顶表面下方的顶表面，以便在上晶格的顶表面下方残留水分。 该瓷砖还包括支撑结构，该支撑结构被配置为将支撑板支撑在支撑表面上并且在顶表面下方提供排水路径。 在形成地板组件时，瓦片还包括用于在瓦片互锁的每个环和销连接件上的各种加强构件。
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公开(公告)号：US20120085043A1
公开(公告)日：2012-04-12
申请号：US13079572
申请日：2011-04-04
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion with a radial end surface configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
摘要翻译： 模块化瓦片被配置为与多个瓦片互锁以形成覆盖在地板上的模块化地板。 该瓦片包括具有限定从顶表面向下延伸的侧壁的周边的顶表面，所述侧壁具有被配置为与其邻近的其它瓦片联接以形成模块化地板覆盖物的联接部分。 瓦片还包括与顶表面相对的底侧，具有包括向下延伸的聚合物柱结构的阵列的支撑格栅，至少一些柱结构包括至少一个具有径向端面的弹性端部，弹性端部构造成定位 抵靠地板以便于柱结构的受控偏转。 柱结构可以包括初级和次级柱结构，其中辅助柱结构限制了主柱结构的偏转。
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公开(公告)号：US07748177B2
公开(公告)日：2010-07-06
申请号：US11065192
申请日：2005-02-24
IPC分类号： E04F11/16
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion with a radial end surface configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
摘要翻译： 模块化瓦片被配置为与多个瓦片互锁以形成覆盖在地板上的模块化地板。 该瓦片包括具有限定从顶表面向下延伸的侧壁的周边的顶表面，所述侧壁具有被配置为与其邻近的其它瓦片联接以形成模块化地板覆盖物的联接部分。 瓦片还包括与顶表面相对的底侧，具有包括向下延伸的聚合物柱结构的阵列的支撑格栅，至少一些柱结构包括至少一个具有径向端面的弹性端部，弹性端部构造成定位 抵靠地板以便于柱结构的受控偏转。 柱结构可以包括初级和次级柱结构，其中辅助柱结构限制了主柱结构的偏转。
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公开(公告)号：US20100236176A1
公开(公告)日：2010-09-23
申请号：US12789161
申请日：2010-05-27
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion with a radial end surface configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
摘要翻译： 模块化瓦片被配置为与多个瓦片互锁以形成覆盖在地板上的模块化地板。 该瓦片包括具有限定从顶表面向下延伸的侧壁的周边的顶表面，所述侧壁具有被配置为与其邻近的其它瓦片联接以形成模块化地板覆盖物的联接部分。 瓦片还包括与顶表面相对的底侧，具有包括向下延伸的聚合物柱结构的阵列的支撑格栅，至少一些柱结构包括至少一个具有径向端面的弹性端部，弹性端部构造成定位 抵靠地板以便于柱结构的受控偏转。 柱结构可以包括初级和次级柱结构，其中辅助柱结构限制了主柱结构的偏转。
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公开(公告)号：US20140215950A1
公开(公告)日：2014-08-07
申请号：US14090845
申请日：2013-11-26
CPC分类号： E04F15/225 , E01C5/20 , E01C13/04 , E01C13/045 , E04B5/43 , E04F15/105 , E04F15/22 , E04F2201/091 , E04F2201/096 , Y10T428/24802
摘要： A modular tile configured to interlock with multiple tiles to form a modular floor covering over a floor. The tile includes a top surface having a periphery defining side walls extending downward from the top surface, the side walls having a coupling portion configured to couple with other tiles adjacent thereto to form the modular floor covering. The tile also includes a bottom side, opposite the top surface, having a support grid including an array of downward extending polymeric post structures, at least some of the post structures including at least one resilient end portion configured to be positioned against the floor to facilitate controlled deflection of the post structures. The post structures may comprise primary and secondary post structures, with the secondary post structures limiting the deflection of the primary post structures.
摘要翻译： 模块化瓦片被配置为与多个瓦片互锁以形成覆盖在地板上的模块化地板。 该瓦片包括具有限定从顶表面向下延伸的侧壁的周边的顶表面，所述侧壁具有被配置为与其邻近的其它瓦片联接以形成模块化地板覆盖物的联接部分。 瓦片还包括与顶表面相对的底侧，具有包括向下延伸的聚合物柱结构的阵列的支撑格栅，至少一些柱结构包括至少一个弹性端部，其构造成抵靠地板定位以便于 柱结构的受控偏转。 柱结构可以包括初级和次级柱结构，其中辅助柱结构限制了主柱结构的偏转。
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公开(公告)号：USD481138S1
公开(公告)日：2003-10-21
申请号：US29164120
申请日：2002-07-16
申请人： Cheryl M. Forster , Jason D. Carling , Frank A. Jugler , Mark L. Jenkins , Brad Andes , Jeremiah Shapiro
设计人： Cheryl M. Forster , Jason D. Carling , Frank A. Jugler , Mark L. Jenkins , Brad Andes , Jeremiah Shapiro
CPC分类号： A63C19/10 , E04F15/02 , E04F15/02194 , E04F15/082 , E04F15/10 , E04F2201/0594
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