Floor panel for forming a floor covering

    公开(公告)号:US12024899B2

    公开(公告)日:2024-07-02

    申请号:US18099428

    申请日:2023-01-20

    Inventor: Jan Eddy De Rick

    CPC classification number: E04F15/02038 E04F2201/0138 E04F2201/0153

    Abstract: A floor panel arranged to be installed according to the fold-down principle, with a first pair and a second pair of edges. The second pair of edges coupling parts are arranged to be coupled to each other by a downward movement with two contact zones at opposite sides of a male part which fits into a female part. The ratio between the horizontal distance between the middle of the first contact zone and the middle of the second contact zone, and the vertical distance between the middle of the first contact zone and the middle of the second contact zone is more than 5, and/or wherein well-defined support points are applied.

    Floor tile with waterproof connection

    公开(公告)号:US11795700B2

    公开(公告)日:2023-10-24

    申请号:US17529505

    申请日:2020-06-11

    Applicant: Niall Hurson

    Inventor: Niall Hurson

    Abstract: A floor tile comprising a base substrate and a laminate layer, wherein the base substrate comprises a top layer with a laminate layer receiver on a top surface thereof and a bottom layer with connecting means for engaging with connecting means of a base substrate of a further tile to form an interconnected flooring system. The top layer of the base substrate extends over connecting means on at least one side of the base substrate, characterized in that the base substrate further comprises waterproofing means for engaging with waterproofing means of a base substrate of at least one further tile to provide a waterproof seal between the tile and at least one further tile.

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