公开(公告)号：US11963309B2

公开(公告)日：2024-04-16

申请号：US17305223

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  Bar-Ilan University ,  PCB Technologies Ltd

Inventor： Boaz Atias ,  Elad Mentovich ,  Yaniv Rotem ,  Doron Naveh ,  Adi Levi ,  Yosi Ben-Naim ,  Yaad Eliya ,  Shlomo Danino ,  Eran Lipp ,  Alon Rubinstein ,  Ran Hasson Ruso

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/06

CPC classification number: H05K3/4644 ,  H05K1/0298 ,  H05K3/06 ,  H05K2203/06

Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

公开(公告)号：US12004308B2

公开(公告)日：2024-06-04

申请号：US17305205

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  BAR-ILAN UNIVERSITY ,  PCB Technologies Ltd

Inventor： Boaz Atias ,  Elad Mentovich ,  Yaniv Rotem ,  Doron Naveh ,  Adi Levi ,  Yosi Ben-Naim ,  Yaad Eliya ,  Shlomo Danino ,  Eran Lipp

IPC: H05K1/02 ,  B32B15/14 ,  C01B32/182 ,  C01B32/184 ,  C08J7/043 ,  C08J7/044 ,  C08J7/046 ,  C08J7/06 ,  H01L21/683 ,  H05K1/09 ,  H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4652 ,  C01B32/184 ,  H05K3/388 ,  H05K2203/085 ,  H05K2203/1338

Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

公开(公告)号：US20230007788A1

公开(公告)日：2023-01-05

申请号：US17305223

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  Bar-Ilan University ,  PCB Technologies Ltd

Inventor： Boaz ATIAS ,  Elad Mentovich ,  Yaniv Rotem ,  Doron Naveh ,  Adi Levi ,  Yosi Ben-Naim ,  Yaad Eliya ,  Shlomo Danino ,  Eran Lipp ,  Alon Rubinsten

IPC: H05K3/46 ,  H05K3/06 ,  H05K1/02

Abstract: Processes for laminating a conductive-lubricant coated Printed Circuit Board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may further include a core, an adhesive layer, and at least one graphene-metal structure or at least one hexagonal Boron Nitride metal (h-BN-metal) structure. The materials of the PCB may change in accordance with the invention described herein, including the materials of the core, the materials of the conductive-lubricant coatings, or the metal layers of the conductive-lubricant-metal structures. Doping processes for each change in materials used are also described herein. The conductive-lubricant of the conductive-lubricant-metal structure will promote high frequency performance and heat management within the PCB. Furthermore, a removal process of those materials post-lamination is described herein to promote protection of materials and subsequent removal of protective layers without breakage or tearing.

公开(公告)号：US20220377912A1

公开(公告)日：2022-11-24

申请号：US17305205

申请日：2021-07-01

Applicant: Mellanox Technologies, Ltd. ,  BAR-ILAN UNIVERSITY ,  PCB Technologies Ltd

Inventor： Boaz ATIAS ,  Elad MENTOVICH ,  Yaniv ROTEM ,  Doron NAVEH ,  Adi LEVI ,  Yosi BEN-NAIM ,  Yaad ELIYA ,  Shlomo DANINO ,  Eran LIPP

IPC: H05K3/46 ,  H05K3/38 ,  C01B32/184

Abstract: Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.