公开(公告)号：US08342385B2

公开(公告)日：2013-01-01

申请号：US13089074

申请日：2011-04-18

申请人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

发明人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

IPC分类号： B23K31/02 ,  B23K35/38

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K2101/40 ,  H01L2224/81012

摘要： A transfer process for bonding a solderable device to a solderable firsl substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.

摘要翻译： 用于将可焊接装置接合到具有第一氧化表面的可焊接冷杉基板的转移过程包括将可焊接装置靠近第一基板放置在还原室中，其中第一表面不能被目视观察。 我们以在目视上观察第二表面的方式放置在腔室中具有第二氧化表面的第二衬底。 选择第一基板和第二基板，使得第二表面的减小与第一表面的减小相关，提供第一表面的减小程度的指示。 在还原条件下将还原剂引入到室中通过照射和观察第二表面来减少我们跟踪的表面; 评估照射期间第二表面的任何变化，并将变化与第一表面还原相关联。 当充分减少时，我们将第一个衬底焊接到器件。

公开(公告)号：US5546013A

公开(公告)日：1996-08-13

申请号：US26897

申请日：1993-03-05

申请人： Yoshikazu Ichioka ,  Leslie C. Jenkins ,  Shinichi Kimura ,  Robert J. Polastre ,  Ronald R. Troutman ,  Robert L. Wisnieff

发明人： Yoshikazu Ichioka ,  Leslie C. Jenkins ,  Shinichi Kimura ,  Robert J. Polastre ,  Ronald R. Troutman ,  Robert L. Wisnieff

IPC分类号： G01R31/02 ,  G02F1/13 ,  G02F1/136 ,  G02F1/1362 ,  G02F1/1368 ,  G09G3/00 ,  G06F7/02

CPC分类号： G09G3/006 ,  G02F2001/136254

摘要： An apparatus for testing for and classifying defects in a TFT/LCD array having gate lines and data lines. Devices are provided for activating cells of the array by applying gate pulses to the gate lines and pulses to the data lines. Devices are also provided for acquiring waveforms from data lines of the array. Additional devices sample the waveforms at selected points in time. A computer may be used to classify the waveforms to indicate whether defects are present and if present, the nature of the defects by comparing voltages of the waveform at the selected points in time.

摘要翻译： 一种用于测试和分类具有栅极线和数据线的TFT / LCD阵列中的缺陷的装置。 提供了用于通过向栅极线施加栅极脉冲并将脉冲施加到数据线来激活阵列的单元的装置。 还提供了用于从阵列的数据线获取波形的装置。 附加设备在选定的时间点对波形进行采样。 可以使用计算机对波形进行分类，以指示是否存在缺陷，如果存在缺陷，则通过比较所选择的时间点上的波形的电压来确定缺陷的性质。

公开(公告)号：US20120261458A1

公开(公告)日：2012-10-18

申请号：US13089074

申请日：2011-04-18

申请人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

发明人： Bing Dang ,  Raymond R. Horton ,  Robert J. Polastre

IPC分类号： B23K31/12 ,  B23K1/20 ,  B23K31/02

CPC分类号： B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K1/206 ,  B23K2101/40 ,  H01L2224/81012

摘要： A transfer process for bonding a solderable device to a solderable first substrate having a first oxidized surface comprises placing the solderable device proximate to the first substrate in a reducing chamber, where the first surface cannot be visually observed. We place a second substrate having a second oxidized surface in the chamber in a way to visually observe the second surface. Selecting the first substrate and the second substrate so that the reduction of the second surface correlates with the reduction of the first surface provides an indication of the degree of reduction of the first surface. Introducing a reducing agent into the chamber under reducing conditions reduces the surfaces which we track by irradiating and observing the second surface; evaluate any change in the second surface during irradiation and correlate the change with first surface reduction. When sufficiently reduced, we solder the first substrate to the device.

摘要翻译： 用于将可焊接装置接合到具有第一氧化表面的可焊接的第一基板的转移过程包括将可焊接装置靠近第一基板放置在还原室中，其中第一表面不能被目视观察。 我们以在目视上观察第二表面的方式放置在腔室中具有第二氧化表面的第二衬底。 选择第一基板和第二基板，使得第二表面的减小与第一表面的减小相关，提供第一表面的减小程度的指示。 在还原条件下将还原剂引入到室中通过照射和观察第二表面来减少我们跟踪的表面; 评估照射期间第二表面的任何变化，并将变化与第一表面还原相关联。 当充分减少时，我们将第一个衬底焊接到器件。