公开(公告)号：US5956601A

公开(公告)日：1999-09-21

申请号：US839358

申请日：1997-04-17

申请人： Sumie Sato ,  Jun Ohmori

发明人： Sumie Sato ,  Jun Ohmori

IPC分类号： G06K19/077 ,  H01L21/68 ,  H01L23/00 ,  H01L23/31 ,  H01L21/30 ,  H01L21/46

CPC分类号： H01L21/6835 ,  G06K19/07745 ,  H01L23/3121 ,  H01L23/562 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01079 ,  H01L2924/181

摘要： A method of manufacturing a semiconductor device mountable in a module supporter. According to the present invention, a semiconductor substrate has a plurality of semiconductor modules, where each semiconductor module has a semiconductor chip covered with a protective material, such as resin, on a first surface and a connector formed on a second surface which is electrically connected to the semiconductor chip. An adhesive layer is applied to the first surface of the substrate. The adhesive layer has a plurality of opening portions arranged to positionally correspond to the plurality of semiconductor modules on the substrate. The substrate and the adhesive layer are cut into individual substrates each having the semiconductor chip so that each semiconductor module has the adhesive layer on a periphery of the protective material. Individual substrates containing a semiconductor module are bonded to the supporter having a concave portion for holding the semiconductor module.

摘要翻译： 一种制造安装在模块支架中的半导体器件的方法。 根据本发明，半导体衬底具有多个半导体模块，其中每个半导体模块具有覆盖有诸如树脂的保护材料的半导体芯片在第一表面上，并且连接器形成在电连接的第二表面上 到半导体芯片。 将粘合剂层施加到基底的第一表面。 粘合剂层具有多个开口部分，其布置成与衬底上的多个半导体模块位置对应。 将基板和粘合剂层切割成各自具有半导体芯片的单个基板，使得每个半导体模块在保护材料的周围具有粘合剂层。 含有半导体模块的单个基板被结合到具有用于保持半导体模块的凹部的支撑件。